B01L5/00

Bubble ejection method, bubble ejecting device, and bubble ejection apparatus

The present invention addresses the problem of providing a bubble ejection method based on a new principle that is different from conventional bubble ejection methods and a bubble ejecting device. To solve the problem, provided is a bubble ejection method using a bubble ejecting device, wherein the bubble ejecting device comprises a substrate formed of a dielectric, at least one bubble ejection hole formed so as to penetrate through a first face and a second face, which is a face opposite to the first face, of the substrate, a first opening formed at a position of the first face at which the bubble ejection hole penetrates, and a second opening formed at a position of the second face at which the bubble ejection hole penetrates, the bubble ejection method comprising: a substrate-conductive liquid contact step; a conductive liquid-electrode contact step; a voltage application step; and a bubble ejection step.

Bubble ejection method, bubble ejecting device, and bubble ejection apparatus

The present invention addresses the problem of providing a bubble ejection method based on a new principle that is different from conventional bubble ejection methods and a bubble ejecting device. To solve the problem, provided is a bubble ejection method using a bubble ejecting device, wherein the bubble ejecting device comprises a substrate formed of a dielectric, at least one bubble ejection hole formed so as to penetrate through a first face and a second face, which is a face opposite to the first face, of the substrate, a first opening formed at a position of the first face at which the bubble ejection hole penetrates, and a second opening formed at a position of the second face at which the bubble ejection hole penetrates, the bubble ejection method comprising: a substrate-conductive liquid contact step; a conductive liquid-electrode contact step; a voltage application step; and a bubble ejection step.

Build material handling unit for a powder module for an apparatus for additively manufacturing three-dimensional objects
12570041 · 2026-03-10 · ·

Build material handling unit for a powder module for an apparatus for additively manufacturing three-dimensional objects, which apparatus is adapted to successively layerwise selectively irradiate and consolidate layers of a build material which can be consolidated by means of an energy source, wherein the build material handling unit is coupled or can be coupled with a powder module, wherein the build material handling unit is adapted to level and/or compact a volume of build material arranged inside a powder chamber of the powder module by controlling the gas pressure inside the powder chamber.

Build material handling unit for a powder module for an apparatus for additively manufacturing three-dimensional objects
12570041 · 2026-03-10 · ·

Build material handling unit for a powder module for an apparatus for additively manufacturing three-dimensional objects, which apparatus is adapted to successively layerwise selectively irradiate and consolidate layers of a build material which can be consolidated by means of an energy source, wherein the build material handling unit is coupled or can be coupled with a powder module, wherein the build material handling unit is adapted to level and/or compact a volume of build material arranged inside a powder chamber of the powder module by controlling the gas pressure inside the powder chamber.