Improved wafer coating processes, apparatuses, and systems are described. In one embodiment, an improved spin-coating process and system is used to form a mask for dicing a semiconductor wafer with a laser plasma dicing process. In one embodiment, a spin-coating apparatus for forming a film over a semiconductor wafer includes a rotatable stage configured to support the semiconductor wafer. The rotatable stage has a downward sloping region positioned beyond a perimeter of the semiconductor wafer. The apparatus includes a nozzle positioned above the rotatable stage and configured to dispense a liquid over the semiconductor wafer. The apparatus also includes a motor configured to rotate the rotatable stage.

A haptic system for establishing an interaction between at least one part of the body of a user called stimulation zone and a virtual environment comprises means for estimating the position of the stimulation zone; means for emitting, toward the stimulation zone, at least one flow rate-controlled air jet, the air jet being emitted at a point of emission and its flow rate being determined as a function of the estimated position of the stimulation zone in space and of the characteristics of the virtual environment; a robotized structure controlled so as to move the point of emission of the air jet so that said point of emission remains at a constant distance from the stimulation zone.

Diffuser of an active liquid agent, for the treatment of a fluid environment, be it at the gaseous or liquid state, of the type including a container (1) of the active agent, closed by grid element apt to maintain in position the active agent and to allow the emanation of fluids of the same, the grid element being covered by a barrier film, peelable at the time of the first use to make operative the grid element, wherein the container (1) is closed by a single multilayer film (2, 3a, 3b) including at least one external barrier layer (3a) and at least another inner sealing layer (2) apt to maintain in position the active agent and to form the grid element, at the time of the first use of the container, following the simultaneous removal of the barrier film and of predefined portions of the sealing layer.

Diffuser of an active liquid agent, for the treatment of a fluid environment, be it at the gaseous or liquid state, of the type including a container (1) of the active agent, closed by grid element apt to maintain in position the active agent and to allow the emanation of fluids of the same, the grid element being covered by a barrier film, peelable at the time of the first use to make operative the grid element, wherein the container (1) is closed by a single multilayer film (2, 3a, 3b) including at least one external barrier layer (3a) and at least another inner sealing layer (2) apt to maintain in position the active agent and to form the grid element, at the time of the first use of the container, following the simultaneous removal of the barrier film and of predefined portions of the sealing layer.

A nozzle member (14) of a personal care device (10) comprising: a nozzle head (16) positioned at an end of the nozzle member; and an orifice (40) formed in a surface (30) of the nozzle head, wherein the orifice comprises at least one liquid jet orifice (42) configured to allow the liquid and/or air to exit the nozzle head in the form of a jet, and at least one liquid sheet orifice (40a-d) configured to allow the liquid and/or air to exit the nozzle head in the form of a sheet.

A fire suppression nozzle can include a first fluid channel configured to be in fluid communication with a first fluid having a first flow velocity and a second fluid channel configured to be in fluid communication with a second fluid having a second flow velocity. A mixer can be disposed between the first fluid channel and the second fluid channel such that the mixer is configured to induce streamwise vorticity in at least the first fluid exiting first fluid channel to cause mixing of the first fluid and the second fluid to reduce a flow speed of a mixture of the first fluid and the second fluid.

Provided is a gas showerhead with controllable airflow distribution, disposed in a cavity of a thin film deposition device and including: a first-layer panel, having a plurality of first gas supply holes distributed according to a first rule; and a second-layer panel, seated on the first-layer panel and having a plurality of second gas supply holes distributed according to a second rule. The first rule is different from the second rule, and one of the first-layer panel and the second-layer panel is capable of rotating at least by a specific angle relative to the other, so that the two panels have a first position and a second position that are different relative to each other. At the first position, none of the first gas supply holes is covered by the second-layer panel; and at the second position, a portion of the first gas supply holes are aligned with the corresponding second gas supply holes, and the other portion of the first gas supply holes are covered by the second-layer panel. The gas showerhead can adjust the airflow distribution and the airflow rate, which helps to meet the spraying requirements of different thin film deposition processes, and improves the uniformity of a deposited thin film.

An injection head for liquid fire extinguishing agent that has an injection head including an injection head body connecting with a pipe providing the liquid fire extinguishing agent, an orifice plate arranged in the injection head body and formed with an orifice through which flowing the liquid fire extinguishing agent and, a porous member having a block shape arranged in an exiting part of the orifice and, a baffle plate arranged contacting with an end surface of the porous member opposite side of the exiting part of the orifice; and the baffle plate covers at least a projected area of a circumscribed circle of the orifice of the end surface of the porous member and, the liquid fire extinguishing agent is released via a gap formed between the injection head body and the baffle plate.

Methods for treating substrates are described. The methods comprise the steps of flowing an aqueous liquid medium through a flow channel and at least one outlet slit onto a substrate to be treated and exposing the aqueous liquid medium to UV-radiation of a specific wavelength at least in a portion of the flow channel immediately adjacent the at least one outlet slit and after the aqueous liquid medium has flown through the outlet opening towards the substrate and thus prior to and while applying the aqueous liquid medium to the surface of the substrate to be treated. In one method, the electrical conductance of the aqueous liquid medium is adjusted to be in the range of 20 to 2000 μS, by the addition of an additive to the aqueous liquid medium, the aqueous liquid medium prior to the addition of the additive having an electrical conductivity below 20 μS, prior to or while exposing the same to the UV-radiation. Additionally, the pH of the aqueous liquid medium may be adjusted to a range of 8 to 11 or 3 to 6 prior to or while exposing the same to the UV-radiation. The adjustments may lead to a shift in an equilibrium of reactive species generated in the aqueous liquid medium by the UV-radiation towards preferred species.

Methods for treating substrates are described. The methods comprise the steps of flowing an aqueous liquid medium through a flow channel and at least one outlet slit onto a substrate to be treated and exposing the aqueous liquid medium to UV-radiation of a specific wavelength at least in a portion of the flow channel immediately adjacent the at least one outlet slit and after the aqueous liquid medium has flown through the outlet opening towards the substrate and thus prior to and while applying the aqueous liquid medium to the surface of the substrate to be treated. In one method, the electrical conductance of the aqueous liquid medium is adjusted to be in the range of 20 to 2000 μS, by the addition of an additive to the aqueous liquid medium, the aqueous liquid medium prior to the addition of the additive having an electrical conductivity below 20 μS, prior to or while exposing the same to the UV-radiation. Additionally, the pH of the aqueous liquid medium may be adjusted to a range of 8 to 11 or 3 to 6 prior to or while exposing the same to the UV-radiation. The adjustments may lead to a shift in an equilibrium of reactive species generated in the aqueous liquid medium by the UV-radiation towards preferred species.