B05C13/00

WAFER HOLDER FOR FILM DEPOSITION CHAMBER
20220359232 · 2022-11-10 ·

The present disclosure provides a flexible workpiece pedestal capable of tilting a workpiece support surface. The workpiece pedestal further includes a heater mounted on the workpiece support surface. The heater includes a plurality of heating sources such as heating coils. The plurality of heating sources in the heater allows heating the workpiece at different temperatures for different zones of the workpiece. For example, the workpiece can have a central zone heated by a first heating coil, a first outer ring zone that is outside of the central zone heated by a second heating coil, a second outer ring zone that is outside of the first outer ring zone heated by a third heating coil. By using the tunable heating feature and the tilting feature of the workpiece pedestal, the present disclosure can reduce or eliminate the shadowing effect problem of the related workpiece pedestal in the art.

SUBSTRATE TREATING APPARATUS

A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

SUBSTRATE TREATING APPARATUS

A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

Droplet ejecting apparatus having carriage marks, droplet ejecting method, and computer storage medium

A droplet ejecting apparatus includes a workpiece table configured to place a workpiece thereon, a droplet ejecting head configured to eject droplets onto the workpiece placed on the workpiece table, a Y-axis linear motor configured to move the workpiece table in a main scanning direction (Y-axis direction), a position detector configured to detect a position of a carriage mark, and a control unit configured to calculate the positional deviation amount in the main scanning direction between a detection position detected by the position detector and a reference position of the carriage mark and correct a droplet ejecting timing of the droplet ejecting head based on the positional deviation amount.

Droplet ejecting apparatus having carriage marks, droplet ejecting method, and computer storage medium

A droplet ejecting apparatus includes a workpiece table configured to place a workpiece thereon, a droplet ejecting head configured to eject droplets onto the workpiece placed on the workpiece table, a Y-axis linear motor configured to move the workpiece table in a main scanning direction (Y-axis direction), a position detector configured to detect a position of a carriage mark, and a control unit configured to calculate the positional deviation amount in the main scanning direction between a detection position detected by the position detector and a reference position of the carriage mark and correct a droplet ejecting timing of the droplet ejecting head based on the positional deviation amount.

Apparatus and techniques for electronic device encapsulation

A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.

Apparatus and techniques for electronic device encapsulation

A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.

Method and apparatus for coating objects with minimal coating damage

An apparatus for transporting a component at least partially coated with a flowable coating material is provided. The apparatus includes a holder adapted for selectively forming a releasable coupling with the component. The holder including a screen for minimizing contact with the component during the transfer. The screen thus serves as a spacer for creating multiple areas of contact with the component, yet the contact is achieved in a manner such that damage to the coating is minimized. Related methods are also disclosed.

Method and apparatus for coating objects with minimal coating damage

An apparatus for transporting a component at least partially coated with a flowable coating material is provided. The apparatus includes a holder adapted for selectively forming a releasable coupling with the component. The holder including a screen for minimizing contact with the component during the transfer. The screen thus serves as a spacer for creating multiple areas of contact with the component, yet the contact is achieved in a manner such that damage to the coating is minimized. Related methods are also disclosed.

MATERIAL DEPOSITION DEVICE
20230084378 · 2023-03-16 ·

A material deposition device for decorating an object. The device has a housing as a structural framework, an object holder, and a container releasably coupled to the housing. The housing has an object support for supporting the object to be decorated. The container creates a volumetric enclosure with the housing. The device is configured to deposit decoration materials onto the object.