A solar cell module production method involves applying an adhesive on a light-receiving surface and a rear surface of a solar cell having electrodes on the light-receiving surface and the rear surface, and positioning and attaching a wiring material on the adhesive. Specifically, the solar cell, which is positioned with the light-receiving surface facing upward, is inverted so that the rear surface is facing upward, and the adhesive is applied on the rear surface; and then the solar cell is inverted once again so that the light-receiving surface is facing upward, and the adhesive is applied to the light-receiving surface.

There is provided a dip coating apparatus that includes a sealed case assembly for containing at least one workpiece to be coated. The dip coating apparatus also includes an air pump communicated with the sealed case assembly, for pumping air from the sealed case assembly and injecting air into the sealed case assembly. Further, the dip coating apparatus includes a fresh coating solution container containing a coating solution, which is communicated with the sealed case assembly, for injecting the coating solution to the sealed case assembly and a recycle coating solution container, which is communicated with the sealed case assembly, for retrieving the coating solution from the sealed case assembly.

There is provided a dip coating apparatus that includes a sealed case assembly for containing at least one workpiece to be coated. The dip coating apparatus also includes an air pump communicated with the sealed case assembly, for pumping air from the sealed case assembly and injecting air into the sealed case assembly. Further, the dip coating apparatus includes a fresh coating solution container containing a coating solution, which is communicated with the sealed case assembly, for injecting the coating solution to the sealed case assembly and a recycle coating solution container, which is communicated with the sealed case assembly, for retrieving the coating solution from the sealed case assembly.

A syringe attachment/detachment mechanism enables a syringe to be easily attached to and detached from a discharge device without causing twisting of a tube, and enabling the syringe and an adapter to be fixedly held in a desired orientation. In the syringe attachment/detachment mechanism and the device provided with the mechanism, the mechanism being adapted for a discharge device to which a syringe including an attachment part and an upper connection part is attached through screwing, the attachment part includes an inner cylindrical portion having a small-diameter opening, an outer cylindrical portion surrounding the inner cylindrical portion, and a screw portion. The attachment/detachment mechanism includes a support member including a cylindrical insertion portion into which the inner cylindrical portion is inserted, and having a channel formed therein for communication between the small-diameter opening and a nozzle of the discharge device. A rotation member includes a screw portion.

A syringe attachment/detachment mechanism enables a syringe to be easily attached to and detached from a discharge device without causing twisting of a tube, and enabling the syringe and an adapter to be fixedly held in a desired orientation. In the syringe attachment/detachment mechanism and the device provided with the mechanism, the mechanism being adapted for a discharge device to which a syringe including an attachment part and an upper connection part is attached through screwing, the attachment part includes an inner cylindrical portion having a small-diameter opening, an outer cylindrical portion surrounding the inner cylindrical portion, and a screw portion. The attachment/detachment mechanism includes a support member including a cylindrical insertion portion into which the inner cylindrical portion is inserted, and having a channel formed therein for communication between the small-diameter opening and a nozzle of the discharge device. A rotation member includes a screw portion.

In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.

In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.

Aspects of the methods and apparatuses herein involve applying fluids onto an advancing substrate. The apparatuses and methods herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, when a first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances a second surface of the substrate past the slot opening of the slot die applicator.

Aspects of the methods and apparatuses herein involve applying fluids onto an advancing substrate. The apparatuses and methods herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, when a first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances a second surface of the substrate past the slot opening of the slot die applicator.

A system may include a support surface for supporting a substrate, a plurality of first passages arranged to distribute flows of a first gas to establish a gas bearing to float the substrate above the support surface, and a plurality of second passages arranged to distribute flows of a second gas to convey the substrate along the support surface. A method may include floating a substrate above a support surface of a substrate support apparatus via a gas bearing; and while floating the substrate, conveying the substrate along the support surface by flowing gas toward a surface of the substrate and in a nonperpendicular direction relative to the surface of the substrate.