A method is provided for coating a surface of a material with a film of porous coordination polymer. A first substrate having a first surface to be coated is positioned in a processing chamber such that the first surface is placed in an opposing relationship to a second surface. The second surface may be provided by a wall of the processing chamber, or in some cases the second surface may be provided by a second substrate to be coated. The first substrate is held such that a gap exists between the first and second surfaces, and the gap is filled with at least one reaction mixture comprising reagents sufficient to form the crystalline film on at least the first surface. A thin gap (e.g., less than 2 mm) between the first and second surfaces is effective for producing a high quality film having a thickness less than 100 μm. Confining the volume of the reaction mixture to a thin layer adjacent the substrate surface significantly reduces problems with sedimentation and concentration control. The size, shape, or average thickness of the gap may be adjusted during formation of the film in response to feedback from at least one film growth monitor.

A method is provided for coating a surface of a material with a film of porous coordination polymer. A first substrate having a first surface to be coated is positioned in a processing chamber such that the first surface is placed in an opposing relationship to a second surface. The second surface may be provided by a wall of the processing chamber, or in some cases the second surface may be provided by a second substrate to be coated. The first substrate is held such that a gap exists between the first and second surfaces, and the gap is filled with at least one reaction mixture comprising reagents sufficient to form the crystalline film on at least the first surface. A thin gap (e.g., less than 2 mm) between the first and second surfaces is effective for producing a high quality film having a thickness less than 100 μm. Confining the volume of the reaction mixture to a thin layer adjacent the substrate surface significantly reduces problems with sedimentation and concentration control. The size, shape, or average thickness of the gap may be adjusted during formation of the film in response to feedback from at least one film growth monitor.

The inventive concept provides an apparatus for treating a substrate. The apparatus comprises a processing container having an inner space; a support unit configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply a treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow from the inner space, wherein the exhaust unit includes an air flow guide duct with an inlet provided to introduce the air flow into the air flow guide duct in a tangential direction to a rotating direction of the substrate supported on the support unit.

The inventive concept provides an apparatus for treating a substrate. The apparatus comprises a processing container having an inner space; a support unit configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply a treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow from the inner space, wherein the exhaust unit includes an air flow guide duct with an inlet provided to introduce the air flow into the air flow guide duct in a tangential direction to a rotating direction of the substrate supported on the support unit.

An apparatus for coating a working wire of a sensor includes a carousel, a robotic arm, and an optical scanner. The carousel includes a first platform, a second platform, and a ring dipping tool. The first platform has a central axis and supports a plurality of stations, all arranged around the central axis. The second platform is positioned above the first platform, with a platform actuator that raises, lowers, and rotates the second platform. The ring dipping tool is coupled to an edge of the second platform and oriented vertically with respect to ground and extending toward the first platform. The robotic arm is configured to transport a fixture, the fixture being configured to hold the wire. The optical scanner is positioned near a wire dipping station of the plurality of stations and configured to scan a position of the wire and a location of the ring dipping tool.

An apparatus for coating a working wire of a sensor includes a carousel, a robotic arm, and an optical scanner. The carousel includes a first platform, a second platform, and a ring dipping tool. The first platform has a central axis and supports a plurality of stations, all arranged around the central axis. The second platform is positioned above the first platform, with a platform actuator that raises, lowers, and rotates the second platform. The ring dipping tool is coupled to an edge of the second platform and oriented vertically with respect to ground and extending toward the first platform. The robotic arm is configured to transport a fixture, the fixture being configured to hold the wire. The optical scanner is positioned near a wire dipping station of the plurality of stations and configured to scan a position of the wire and a location of the ring dipping tool.

An apparatus including a grid having a plurality of rows and columns; a base, to which the grid is configured to be fixed; a liquid container; and a liquid application device; wherein the liquid application device is removably attached to the grid and configured to move along the grid when attached to the grid; and wherein the liquid application device is connected to the liquid container so that it receives liquid from the liquid container. The liquid application device may include a brush, a roller, and/or a spray device. The liquid may be paint or an adhesive, and for adhesive, wallpaper may be applied after the adhesive. The grid may be configured to be fixed parallel or perpendicular to the base, when the base is parallel to a floor surface, depending on whether the liquid is being applied to a vertical wall or to a ceiling.

An apparatus including a grid having a plurality of rows and columns; a base, to which the grid is configured to be fixed; a liquid container; and a liquid application device; wherein the liquid application device is removably attached to the grid and configured to move along the grid when attached to the grid; and wherein the liquid application device is connected to the liquid container so that it receives liquid from the liquid container. The liquid application device may include a brush, a roller, and/or a spray device. The liquid may be paint or an adhesive, and for adhesive, wallpaper may be applied after the adhesive. The grid may be configured to be fixed parallel or perpendicular to the base, when the base is parallel to a floor surface, depending on whether the liquid is being applied to a vertical wall or to a ceiling.

A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.

A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.