A syringe or other vessel having a substrate surface coated by PECVD is provided. The PECVD coating is made by generating plasma from a gaseous reactant comprising an organosilicon precursor and optionally O.sub.2. The lubricity, hydrophobicity and/or barrier properties of the coating are set by setting the ratio of the O.sub.2 to the organosilicon precursor in the gaseous reactant, and/or by setting the electric power used for generating the plasma. In particular, a lubricity coating made by said method is provided. Vessels coated by said method and the use of such vessels protecting a compound or composition contained or received in said coated vessel against mechanical and/or chemical effects of the surface of the uncoated vessel material are also provided.

A drench system includes a rotating mount to rotate a workpiece, a showerhead to dispense a fluid onto the workpiece; and a tray to collect the fluid and recirculate the fluid to the shower. A method of repairing or remanufacturing a coating includes abrading a surface to at least partially remove a portion of a coating to leave an abraded surface; applying a sol-gel over the abraded surface; applying a corrosion resistant primer onto the sol-gel; and applying an erosion coating onto the corrosion resistant primer.

A polymer substrate having deposited on its surface a reaction product of a precursor material obtained or obtainable by a method for preparation of polymer, and to the use of the polymer having improved antibacterial properties and/or antiviral properties or of the polymer having improved antibacterial properties and/or antiviral properties obtained or obtainable by the method for medical applications, antibiofouling applications, hygiene applications, food industry applications, industrial or computer related applications, consumer goods applications and appliances, public and public transport applications, underwater, water sanitation or seawater applications.

Methods of forming metal-containing films are provided. The methods include forming a blocking layer, for example, on a first substrate surface, by a first deposition process and forming the metal-containing film, for example, on a second substrate surface, by a second deposition process.

Provided is a low dielectric constant film and a preparation method thereof, where epoxy alkanes, organosilicon compounds and fluorine-containing siloxane compounds are used as raw materials of the low dielectric constant film, and the low dielectric constant film is formed on a substrate surface by a plasma-enhanced chemical deposition method. Accordingly, a nanofilm with a low dielectric constant and excellent hydrophobicity is formed on the substrate surface.

A method for making a dense organosilicon film with improved mechanical properties, the method comprising the steps of: providing a substrate within a reaction chamber; introducing into the reaction chamber a gaseous composition comprising hydrido-dimethyl-alkoxysilane; and applying energy to the gaseous composition comprising hydrido-dimethyl-alkoxysilane in the reaction chamber to induce reaction of the gaseous composition comprising hydrido-dimethyl-alkoxysilane to deposit an organosilicon film on the substrate, wherein the organosilicon film has a dielectric constant from ˜2.70 to ˜3.50, an elastic modulus of from ˜6 to ˜36 GPa, and an at. % carbon from ˜10 to ˜36 as measured by XPS.

A wheel component for a wheel of an at least partially muscle-powered two-wheeled vehicle, including a rim provided to be connected with a hub by means of spokes, the rim including a rim base with a plurality of spoke socket sections having one spoke hole each, to which the spokes can be attached by means of spoke nipples. The wheel component includes at least one washer for placement between a spoke socket section and a spoke nipple. The washer includes a through hole extending between a top face and a bottom face. The rim base includes two opposite rim flanks extending obliquely relative to one another. In its bottom face, the washer shows a canted support flank at least in sections. The washer can be supported on the rim flanks by means of its support flank such that only the support flank bears against, and contacts, the rim.

Provided is a substrate treating method for drying a substrate on which a pattern is formed. The method includes: a solidified film forming liquid supplying step, an entire surface coating step, a solidified film forming step, and a sublimation step. The entire surface coating step causes the substrate to rotate at a number of rotations for solidified film formation in accordance with a relationship among a concentration of a sublimable substance, a target solidified film thickness as a desired film thickness of a solidified film, and the number of rotations for solidified film formation as a number of rotations of the substrate for forming the solidified film of the target solidified film thickness when the concentration of the sublimable substance is a predetermined concentration.

An implantable medical device having a package, including: a device body, and a package configured for packaging the device body. The package includes at least one organic film layer and at least one inorganic film layer that are stacked on one another. An innermost layer of the package is an organic film layer or an inorganic film layer, and an outermost layer of the package is an organic film layer or an inorganic film layer. Each organic film layer is a parylene film or polyimide resin film with biocompatibility, and each inorganic film layer is an inorganic film with biocompatibility. A method for packaging an implantable medical device is also provided.

A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatus 1 includes a rotating/holding unit 21 configured to rotate and hold the wafer W; a processing liquid discharging unit 73 configured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unit 21; a variation acquiring unit configured to acquire information upon a variation amount of a deformation of the peripheral portion of the wafer W; and a discharge controller 7 configured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unit 73 onto the peripheral portion based on the information upon the variation amount of the deformation of the peripheral portion acquired by the variation acquiring unit.