Patent classifications
B05D1/00
CONTAINER WITH A COATING LAYER
Container (1) with a coating layer. The invention is in the field of containers for foods and drinks. There is provided a method for applying a coating layer (2, 4) on a preform (1, 2) for a container (1) using plasma deposition. There is also provided a preform (1, 2) for a container (1), as well as a container (1) obtainable by stretching of the preform (1, 2).
HARD COAT LAMINATE
Provided is a hard coat laminate having excellent abrasion resistance and heat resistance. The hard coat laminate includes: a substrate; and a base layer disposed on one main surface side of the substrate, in which the base layer contains inorganic nanoparticles, the base layer contains oxygen atoms, carbon atoms, and silicon atoms, the base layer has, on a surface side opposite to the substrate, a first region in which a compositional ratio of carbon atoms to all elements excluding hydrogen decreases as a distance from the substrate increases, in a region other than the first region of the base layer, a compositional ratio of carbon atoms to all elements excluding hydrogen is 5 atom % to 40 atom %, and a compositional ratio of carbon atoms on a surface of the first region is 1 atom % or less.
ORGANO TIN COMPOUND FOR THIN FILM DEPOSITION AND METHOD FOR FORMING TIN-CONTAINING THIN FILM USING SAME
According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1:
##STR00001## In Chemical Formula 1, L.sub.1 and L.sub.2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R.sub.1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R.sub.2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.
Coating composition system, the preparation method, and the use thereof
The present disclosure provides for a coating composition system suitable for forming a stain resistant and soft tactile texture coating onto a variety of substrate materials including plastic materials, metal materials, ceramic materials, and concrete materials. The coating composition system can be cured under mild curing conditions, and provides the resulting coating with excellent properties in terms of adhesion to the substrates, strength, and abrasion resistance. The present disclosure also provides for a method for preparing the coating composition system, and the use thereof.
Coating composition system, the preparation method, and the use thereof
The present disclosure provides for a coating composition system suitable for forming a stain resistant and soft tactile texture coating onto a variety of substrate materials including plastic materials, metal materials, ceramic materials, and concrete materials. The coating composition system can be cured under mild curing conditions, and provides the resulting coating with excellent properties in terms of adhesion to the substrates, strength, and abrasion resistance. The present disclosure also provides for a method for preparing the coating composition system, and the use thereof.
Methods and Apparatuses for Fabricating Polymeric Conformal Coatings, Parts Coated With Polymeric Conformal Coatings, and Optical Apparatus Including Said Parts
A method of forming a vapour deposited polymeric conformal coating on a surface of a part (23). The method comprises placing the part (23) and a flow control screen in a deposition chamber (22); dispersing a gas into the chamber (22) from which the polymeric coating is deposited on the surface. The flow control screen is spaced apart from the surface and is configured to control a localised flow of the gas in the chamber so as to impose a structure on the deposited coating.
THIN FILM FABRICATION METHOD AND APPARATUS
A method of layer-by-layer deposition for thin-film fabrication and a layer-by-layer deposition apparatus for thin-film fabrication. The method comprises the steps of at least partially immersing a substrate in a reservoir of a charged solution to deposit a layer on the substrate and spraying the substrate with an atomized charged solution to deposit a layer on the substrate.
FILM FORMING METHOD AND FILM FORMING APPARATUS
A film forming method includes preparing a substrate having a first region in which a metal film or an oxide film of the metal film is exposed, and a second region in which an insulating film is exposed, supplying, to the substrate, an organic compound containing, in a head group, a triple bond between carbon atoms represented by Chemical Formula (1) described in the specification, causing the organic compound to be selectively adsorbed in the first region among the first region and the second region, and cleaving the triple bond in the first region and forming a hydrophobic film having a honeycomb structure of carbon atoms through polymerization.
INTEGRATION OF METAL NANOWIRE NETWORK INTO CONDUCTING POLYMERS
A metallic nanowire: conductive polymer composite is fabricated. A metallic nanowire layer is formed by a process that leaves an organic ligand residue on the metallic nanowire layer. A conductive polymer film is formed on a supporting substrate. The metallic nanowire layer is integrated with the conductive polymer film to form a metallic nanowire: conductive polymer composite. The metallic nanowire: conductive polymer composite is wet by a reaction solution including a source of metal ions, at least one acid, and a solvent for a period of time sufficient to remove the organic ligand residues from the metallic nanowire layer and sufficient to grow metal nanoparticles from the source of metal ions to create metal interconnections at junctions where the two or more nanowires in the metallic nanowire layer touch each other. Following growth of the nanoparticles, the nanowire: conductive polymer composite is removed from the reaction solution and dried.
METHOD FOR DISPERSING CONDUCTIVE PARTICLES, AND ELECTROSTATIC ADSORPTION DEVICE
A method for dispersing conductive particles includes: forming an electric field between a first electrode and a second electrode of an electrostatic adsorption device including the first electrode including a disposition part having electrostatic diffusivity or conductivity on which particles are disposed and the second electrode including an adsorption part having electrostatic diffusivity or conductivity and facing the disposition part, to cause a blend particle in which the conductive particles each having a particle size smaller than a particle size of an intermediate particle are attached to the intermediate particle and which is disposed on the disposition part, to reciprocate between the disposition part and the adsorption part, and to cause the conductive particles to be adsorbed onto the adsorption part.