The present invention concerns an ultrasonic welding installation comprising an ultrasonic vibration unit having a sonotrode and a converter, wherein the sonotrode and the converter are arranged in mutually adjacent relationship along a longitudinal axis and the ultrasonic vibration unit can be caused to resonate with an ultrasonic vibration in the direction of the longitudinal axis with a wavelength λ, wherein there can be provided an amplitude transformer arranged between the sonotrode and the converter, wherein there is provided a holder for holding the ultrasonic vibration unit. To provide an ultrasonic welding installation having a holder which allows simple adjustment of the ultrasonic vibration unit and simple replacement thereof it is proposed according to the invention that the holder has a clamping device which is reciprocable between an opened position in which the ultrasonic vibration unit can be removed from the holder and a closed position in which the clamping device comes into contact with the ultrasonic vibration unit and exerts a force on same so that the ultrasonic vibration unit is held.

The present invention concerns an ultrasonic welding installation comprising an ultrasonic vibration unit having a sonotrode and a converter, wherein the sonotrode and the converter are arranged in mutually adjacent relationship along a longitudinal axis and the ultrasonic vibration unit can be caused to resonate with an ultrasonic vibration in the direction of the longitudinal axis with a wavelength λ. To provide an ultrasonic welding installation which allows simple and fast highly precise adjustment of the sealing surfaces of the sonotrode relative to the anvil according to the invention there is proposed a support element for supporting a force applied to the sonotrode perpendicularly to the longitudinal axis, wherein the sonotrode and the support element have mutually corresponding support surfaces which at least when a force is applied to the sonotrode perpendicularly to the longitudinal axis come into contact with each other, wherein the support surfaces are of such a configuration that when they are in contact with each other they prevent a relative movement of the sonotrode with respect to the support element in the direction of the longitudinal axis and do not impede a rotation of the sonotrode about the longitudinal axis.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

The handpiece-type high-frequency vibration apparatus includes a roughly cylindrical housing 10 configuring a handpiece, a holding member 11, a tool 12, a controller 20 and an excitation device 21. In a non-contact state before the tool 12 is brought into contact with an object, the controller 20 drives the excitation device 21 so as to vibrate the tool 12 at an added frequency fp for which a predetermined frequency fs is added to a first resonance frequency fr1 of the tool 12. In a cutting state where the tool 12 is in contact with the object by a load that enables cutting of the object by the tool 12, the controller 20 controls drive of the excitation device 21 such that a third resonance frequency fr3 of the tool 12 increases and coincides with the added frequency fp, and increases a vibration frequency of the tool 12.

A variable-frequency surface acoustic wave electronic cigarette includes an atomizer. An atomization cavity is disposed in the atomizer, and a variable-frequency surface acoustic wave atomization chip is disposed at a lower portion of the atomization cavity. An inverted trapezoidal interdigital transducer is disposed on the variable-frequency surface acoustic wave atomization chip. An e-liquid storage cavity is disposed in the atomization cavity. A porous ceramic sheet is disposed between the e-liquid storage cavity and the atomization chip. The new variable-frequency surface acoustic wave electronic cigarette can realize any adjustment of the working frequency within a set range, thereby realizing the autonomous regulation and control of a smoke particle size after atomization of the e-liquid.

A variable-frequency surface acoustic wave electronic cigarette includes an atomizer. An atomization cavity is disposed in the atomizer, and a variable-frequency surface acoustic wave atomization chip is disposed at a lower portion of the atomization cavity. An inverted trapezoidal interdigital transducer is disposed on the variable-frequency surface acoustic wave atomization chip. An e-liquid storage cavity is disposed in the atomization cavity. A porous ceramic sheet is disposed between the e-liquid storage cavity and the atomization chip. The new variable-frequency surface acoustic wave electronic cigarette can realize any adjustment of the working frequency within a set range, thereby realizing the autonomous regulation and control of a smoke particle size after atomization of the e-liquid.

Non-resonant acoustic meta-material, method of fabrication, and uses thereof are disclosed herein. A layer of a first material is formed on a first substrate. A layer of a second material is formed on the layer of the first material to produce a stacked layer of first and second materials. At least a portion of the stacked layer of first and second materials is exposed to a radiation. The exposed portion of the second material is removed from the stacked layer of first and second materials. A cavity is formed using the removed exposed portion of the second material. The cavity includes a membrane formed from at least a portion of the first material. Additionally, an ultrasound system includes an ultrasound transducer and the non-resonant acoustic metamaterial coupled to the ultrasound transducer.

Non-resonant acoustic meta-material, method of fabrication, and uses thereof are disclosed herein. A layer of a first material is formed on a first substrate. A layer of a second material is formed on the layer of the first material to produce a stacked layer of first and second materials. At least a portion of the stacked layer of first and second materials is exposed to a radiation. The exposed portion of the second material is removed from the stacked layer of first and second materials. A cavity is formed using the removed exposed portion of the second material. The cavity includes a membrane formed from at least a portion of the first material. Additionally, an ultrasound system includes an ultrasound transducer and the non-resonant acoustic metamaterial coupled to the ultrasound transducer.

An ultrasound transducer device can include an ultrasound transducer, and first electrodes that abut second electrodes. Each first electrode can have an annular shape about a rotation axis of the ultrasound transducer device. The first electrodes can be annular and can each have different diameters. The device can also include first support members that includes a support base and first deformation portions, and each first deformation portion can protrude from the support base along the rotation axis. The first deformation portions can be annular and can each have different diameters.

A filtering apparatus formed by a plurality of channel systems. Each of the channel systems include an inlet port formed on an inlet side of the plate; no more than one outlet port formed on an outlet side of the plate; and a channel formed in the plate, the channel coupled to the inlet port and to the outlet port, wherein the ratio of the product of the capture area of the inlet ports of a channel system with the first transmissivity associated with the inlet ports to the product of the capture area of the outlet ports of a channel system with the second transmissivity associated with the outlet ports is greater than one. The channel system is configured to interact with objects of interest on a scale which is smaller than a value several orders of magnitude larger than the mean free path of an object of interest. Some plate embodiments are configured to interact with particles, such as air molecules, water molecules, or aerosols. Other plate embodiments are configured to interact with waves or wavelike particles, such as electrons, photons, phonons or acoustic waves.