The current invention concerns an apparatus (100) for shaping the introductory end (172) of a tampon (162), comprising: a carrying pipe (106) for holding the tampon (162); a support wheel (104) that carries a plurality of carrying pipes (106), the support wheel (104) comprising conveying means to transport each carrying pipe (106); and a head-shaping station (108) for shaping the introductory end (172) of the tampon (162);

According to the invention, the head-shaping station (108) comprises an ultrasonic device (110). The invention also concerns a method for shaping the introductory end (172) of a tampon (162) using such apparatus (100).

The current invention concerns an apparatus (100) for shaping the introductory end (172) of a tampon (162), comprising: a carrying pipe (106) for holding the tampon (162); a support wheel (104) that carries a plurality of carrying pipes (106), the support wheel (104) comprising conveying means to transport each carrying pipe (106); and a head-shaping station (108) for shaping the introductory end (172) of the tampon (162);

According to the invention, the head-shaping station (108) comprises an ultrasonic device (110). The invention also concerns a method for shaping the introductory end (172) of a tampon (162) using such apparatus (100).

Stable operation of an ultrasonic vibrator of an ultrasonic cleaner and scattering prevention of a washing liquid are provided. The ultrasonic cleaner includes a washing tank 206 in which a washing liquid is reserved; an ultrasonic vibrator 205; a vibration head 209 provided with a neck 304 extended from the ultrasonic vibrator to the washing tank and a tip end portion 210 having a cylindrical hole 211 whose longitudinal direction is oriented to a perpendicular direction; and a first cover 601 having an opening corresponding to the neck and the cylindrical hole, in which the first cover is arranged to a height in contact with a liquid surface of the washing liquid such that it covers the washing tank.

A wafer scale ultrasonic sensor assembly includes a wafer substrate, an ultrasonic element, first and second protective layers, conductive wires, a transmitting material, an ASIC, a conductive bump, and a soldering portion. The wafer substrate includes a via. The ultrasonic element is exposed to the via. The conductive wires are on the first protective layer and connected to the ultrasonic element. The second protective layer covers the conductive wires, and the second protective layer has an opening corresponding to the ultrasonic element. The transmitting material contacts the ultrasonic element. The ASIC is connected to the wafer substrate, so that the via forms a space between the ASIC and the ultrasonic element. The conductive pillar is in a via defined through the ASIC, the wafer substrate, and the first protective layer, and the conducive pillar is respectively connected to the conductive wires and the soldering portion.

A wafer scale ultrasonic sensor assembly includes a wafer substrate, an ultrasonic element, first and second protective layers, conductive wires, a transmitting material, an ASIC, a conductive bump, and a soldering portion. The wafer substrate includes a via. The ultrasonic element is exposed to the via. The conductive wires are on the first protective layer and connected to the ultrasonic element. The second protective layer covers the conductive wires, and the second protective layer has an opening corresponding to the ultrasonic element. The transmitting material contacts the ultrasonic element. The ASIC is connected to the wafer substrate, so that the via forms a space between the ASIC and the ultrasonic element. The conductive pillar is in a via defined through the ASIC, the wafer substrate, and the first protective layer, and the conducive pillar is respectively connected to the conductive wires and the soldering portion.

An ultrasonic horn is provided with: a vibration generating unit configured to generate longitudinal vibration having a frequency in the ultrasonic band on the basis of a signal having a frequency in the ultrasonic band input from an oscillator; a vibration amplifying unit configured to amplify the vibration generating unit while transmitting the longitudinal vibration from the vibration generating unit; and a longitudinal-torsional vibration conversion slit unit having slits formed in a groove-like shape on the surfaces of the vibration amplifying unit and configured to convert the longitudinal vibration into torsional vibration. The vibration amplifying unit has a polygonal shape in a plane view, and has a plurality of surfaces provided with slits along with a surface not provided with slits.

An ultrasonic horn is provided with: a vibration generating unit configured to generate longitudinal vibration having a frequency in the ultrasonic band on the basis of a signal having a frequency in the ultrasonic band input from an oscillator; a vibration amplifying unit configured to amplify the vibration generating unit while transmitting the longitudinal vibration from the vibration generating unit; and a longitudinal-torsional vibration conversion slit unit having slits formed in a groove-like shape on the surfaces of the vibration amplifying unit and configured to convert the longitudinal vibration into torsional vibration. The vibration amplifying unit has a polygonal shape in a plane view, and has a plurality of surfaces provided with slits along with a surface not provided with slits.

The invention relates to a method for impregnating at least one fibre bundle (11) with a high-viscosity plastics material (13), said method comprising the following steps: •—providing at least one fibre bundle (11) for impregnation, formed of a multiplicity of continuous fibres, and providing a plastics material (13), melted at a mandated operating temperature and of high viscosity, and •—impregnating the fibre bundle (11) with the plastics material (13), by guiding the fibre bundle for impregnation continuously through an impregnation cavity (12), filled with the melted plastics material (13), •—where during impregnation of the fibre bundle, the melted plastics material within the impregnation cavity is contacted with a surface (15) of at least one oscillation generator (14) in such a way that sonic energy is introduced by said oscillation generator into the melted high-viscosity plastics material in the impregnation cavity.

Disclosed is systems and methods for cleaning devices holding fluid such as heat exchanges. The cleaning is performed by using a system such as a transducer assembly including a mechanical wave generator and a waveguide including a cavity. The system is capable of operating at its fundamental resonance frequency even when connected to an outer surface of the device to be cleaned.

Disclosed is systems and methods for cleaning devices holding fluid such as heat exchanges. The cleaning is performed by using a system such as a transducer assembly including a mechanical wave generator and a waveguide including a cavity. The system is capable of operating at its fundamental resonance frequency even when connected to an outer surface of the device to be cleaned.