Provided is an ultrasonic propagation member used in contact with a test target, wherein a surface of the ultrasonic propagation member contacting the test target has a shape conforming to a surface of the test target, or an ultrasonic propagation member having at least two surfaces, wherein hardness of one surface and hardness of another surface are different.

The present invention provides an image engraving apparatus capable of precisely driving a stylus to improve accuracy of image engraving. The image engraving apparatus has a vibration actuator fixed to a floating base and having an output portion configured to output vibration generated by deformation of piezoelectric elements, a stylus supported with a stylus holder to be vibrated and engrave an image on a medium to be engraved, a supporting spring supporting the stylus holder, and a retainer positionally adjustably supported to the floating base to come into contact with the medium.

Provided is a user-friendly power tool. The power tool 1 comprises: a battery pack mount 2c to which a battery pack 4 can be attached and detached; and a cover 17 that can cover the battery pack 4, mounted on the battery pack mount 2c, and the battery pack mount 2c so as to allow opening and closing. The wall 23 of the battery pack mount 2c is provided with a correcting part 23a that is capable of correcting inward warping of both the left and right side surfaces of the cover 17, which are the longitudinal direction surfaces. The lower edge of the correcting part 23a has a rounded shape.

A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

A transducer probe includes a transducer array with rows of transducer elements that each extend in an elevation direction and is transverse to an azimuth direction, a matching layer disposed adjacent to the transducer array, and a focusing layer disposed adjacent to the matching layer. The focusing layer includes a first material with a first refractive index and a second material with a second refractive index, and the first refractive index is less than the second refractive index. The first and second materials are distributed in an alternating pattern with the first material at edges of the rows. First widths of the first material decrease from the edges towards a center of the rows, and second widths of the second material increase from the edges towards the center.

A transducer probe includes a transducer array with rows of transducer elements that each extend in an elevation direction and is transverse to an azimuth direction, a matching layer disposed adjacent to the transducer array, and a focusing layer disposed adjacent to the matching layer. The focusing layer includes a first material with a first refractive index and a second material with a second refractive index, and the first refractive index is less than the second refractive index. The first and second materials are distributed in an alternating pattern with the first material at edges of the rows. First widths of the first material decrease from the edges towards a center of the rows, and second widths of the second material increase from the edges towards the center.

The invention relates to a sonotrode (218) of an ultrasonic welding device with a sonotrode body (224) with sonotrode head (220) with at least one working surface (230) extending in the longitudinal direction of the sonotrode head for welding or welding together and/or deforming and/or cutting at least one item of metallic welding material, wherein the sonotrode head has cross-sections which vary along the working surface in such a way that the cross-section of the sonotrode head in the end region of the working surface extending at the end face is greater than in the middle region of the working surface.

The invention relates to a sonotrode (218) of an ultrasonic welding device with a sonotrode body (224) with sonotrode head (220) with at least one working surface (230) extending in the longitudinal direction of the sonotrode head for welding or welding together and/or deforming and/or cutting at least one item of metallic welding material, wherein the sonotrode head has cross-sections which vary along the working surface in such a way that the cross-section of the sonotrode head in the end region of the working surface extending at the end face is greater than in the middle region of the working surface.

A medical, particularly a dental or dental surgical, ultrasonic treatment device for generating ultrasonic vibrations and transmitting the ultrasonic vibration to a tool, which can be connected to the ultrasonic treatment device, the medical ultrasonic treatment device having: an ultrasonic vibration generator with a plurality of piezoelectric elements to which an electric voltage can be applied, and a circuit board to supply the plurality of piezoelectric elements with the electric voltage. Furthermore, a method for manufacturing a corresponding medical ultrasonic treatment device is described.