An ultrasonic cutting tool is designed for use in an ultrasonic instrument. The tool is a blade having a flat section manufactured from at least a first blade layer and second blade layer. The first and second blade layer each being a flat metal plate arranged in parallel to one another and bonded to one another.

The method includes the following steps: a) providing a tubular sonotrode (1) formed in a material substantially inert to liquid aluminum, such as a ceramic, for example, silicon oxynitride, the sonotrode comprising a first open end region (2) and a second optionally closed end region (3), b) submerging at least some of the open end region (2) of the tubular sonotrode (1) in the liquid aluminum alloy, and c) applying power ultrasound on the liquid aluminum alloy by means of the tubular sonotrode (1).

The method includes the following steps: a) providing a tubular sonotrode (1) formed in a material substantially inert to liquid aluminum, such as a ceramic, for example, silicon oxynitride, the sonotrode comprising a first open end region (2) and a second optionally closed end region (3), b) submerging at least some of the open end region (2) of the tubular sonotrode (1) in the liquid aluminum alloy, and c) applying power ultrasound on the liquid aluminum alloy by means of the tubular sonotrode (1).

An ultrasonic horn includes: a vertical vibration generating portion in which a first ultrasonic vibrator is mounted inside; a horn portion extending forward from the vertical vibration generating portion , amplifying an ultrasonic vibration generated by the vertical vibration generating portion , and to which a capillary is mounted at a front end portion ; and a torsional vibration generating portion extending rearward from the vertical vibration generating portion . The torsional vibration generating portion includes: a rod-shaped body ; vibration members arranged axisymmetrically around a central axis ; second ultrasonic vibrators sandwiched between the rod-shaped body and the vibration members such that a vibration direction is a circumferential direction; and bolts pressurizing the second ultrasonic vibrators.

A semiconductor device of embodiments includes a substrate; a semiconductor chip provided above the substrate; a first ultrasonic bonding portion provided between the substrate and the semiconductor chip; a first terminal plate electrically connected to the semiconductor chip via the first ultrasonic bonding portion, the first ultrasonic bonding portion being provided on the substrate, and the first terminal plate having a first surface facing the semiconductor chip; and a first adhesive layer provided on the first surface, and the first adhesive layer containing a first adhesive.

A semiconductor device of embodiments includes a substrate; a semiconductor chip provided above the substrate; a first ultrasonic bonding portion provided between the substrate and the semiconductor chip; a first terminal plate electrically connected to the semiconductor chip via the first ultrasonic bonding portion, the first ultrasonic bonding portion being provided on the substrate, and the first terminal plate having a first surface facing the semiconductor chip; and a first adhesive layer provided on the first surface, and the first adhesive layer containing a first adhesive.

The present invention concerns an ultrasonic welding installation comprising an ultrasonic vibration unit having a sonotrode and a converter, wherein the sonotrode and the converter are arranged in mutually adjacent relationship along a longitudinal axis and the ultrasonic vibration unit can be caused to resonate with an ultrasonic vibration in the direction of the longitudinal axis with a wavelength λ. To provide an ultrasonic welding installation which allows simple and fast highly precise adjustment of the sealing surfaces of the sonotrode relative to the anvil according to the invention there is proposed a support element for supporting a force applied to the sonotrode perpendicularly to the longitudinal axis, wherein the sonotrode and the support element have mutually corresponding support surfaces which at least when a force is applied to the sonotrode perpendicularly to the longitudinal axis come into contact with each other, wherein the support surfaces are of such a configuration that when they are in contact with each other they prevent a relative movement of the sonotrode with respect to the support element in the direction of the longitudinal axis and do not impede a rotation of the sonotrode about the longitudinal axis.

The present invention concerns an ultrasonic welding installation comprising an ultrasonic vibration unit having a sonotrode and a converter, wherein the sonotrode and the converter are arranged in mutually adjacent relationship along a longitudinal axis and the ultrasonic vibration unit can be caused to resonate with an ultrasonic vibration in the direction of the longitudinal axis with a wavelength λ. To provide an ultrasonic welding installation which allows simple and fast highly precise adjustment of the sealing surfaces of the sonotrode relative to the anvil according to the invention there is proposed a support element for supporting a force applied to the sonotrode perpendicularly to the longitudinal axis, wherein the sonotrode and the support element have mutually corresponding support surfaces which at least when a force is applied to the sonotrode perpendicularly to the longitudinal axis come into contact with each other, wherein the support surfaces are of such a configuration that when they are in contact with each other they prevent a relative movement of the sonotrode with respect to the support element in the direction of the longitudinal axis and do not impede a rotation of the sonotrode about the longitudinal axis.

The method comprises the following steps: a) Providing a sonotrode (1) formed from an essentially inert material with respect to the liquid metal, such as a ceramic, and preferably a silicon nitride or a silicon oxynitride, such as SIALON, or a metal essentially inert to said liquid metal, b) Immersing at least partially the sonotrode (1) in a bath of said metal, c) Applying to the sonotrode (1) power ultrasounds, particularly ultrasounds having a power greater than 10 watts to obtain the wetting of said sonotrode by said metal, d) Applying continuously to the sonotrode (1) measurement ultrasounds, also known as testing ultrasounds, particularly ultrasounds wherein the frequency is between 1 and 25 MHz, e) Applying intermittently to the sonotrode (1) power ultrasounds, particularly ultrasounds having a power greater than 10 watts, to maintain said wetting.

The method comprises the following steps: a) Providing a sonotrode (1) formed from an essentially inert material with respect to the liquid metal, such as a ceramic, and preferably a silicon nitride or a silicon oxynitride, such as SIALON, or a metal essentially inert to said liquid metal, b) Immersing at least partially the sonotrode (1) in a bath of said metal, c) Applying to the sonotrode (1) power ultrasounds, particularly ultrasounds having a power greater than 10 watts to obtain the wetting of said sonotrode by said metal, d) Applying continuously to the sonotrode (1) measurement ultrasounds, also known as testing ultrasounds, particularly ultrasounds wherein the frequency is between 1 and 25 MHz, e) Applying intermittently to the sonotrode (1) power ultrasounds, particularly ultrasounds having a power greater than 10 watts, to maintain said wetting.