A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.

A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.

A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.

A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.

A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.

A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.

Disclosed is a washer idler roller and a wafer cleaner using the same in which the wafer cleaner prevents wafer slip and wafer hunting so that the wafer rotates stably, and it is possible to efficiently determine whether the wafer is clean or not by precise detection of a rotation state of the wafer. The wafer cleaner of semiconductor manufacturing equipment according to the present invention includes a wafer roller for rotating the wafer, an idler detecting a rotation speed of the wafer, and brushes respectively disposed at opposite sides of the wafer, wherein the idler includes a first body configured to rotate, a pair of first guide portions disposed at the first body, and a washer idler roller disposed between the first guide portions and being in contact with an outer circumferential surface of the wafer.

Disclosed is a washer idler roller and a wafer cleaner using the same in which the wafer cleaner prevents wafer slip and wafer hunting so that the wafer rotates stably, and it is possible to efficiently determine whether the wafer is clean or not by precise detection of a rotation state of the wafer. The wafer cleaner of semiconductor manufacturing equipment according to the present invention includes a wafer roller for rotating the wafer, an idler detecting a rotation speed of the wafer, and brushes respectively disposed at opposite sides of the wafer, wherein the idler includes a first body configured to rotate, a pair of first guide portions disposed at the first body, and a washer idler roller disposed between the first guide portions and being in contact with an outer circumferential surface of the wafer.

A portable cleaning device comprising a generally cylindrical container for receiving a fluid to a predetermined level and defining a container axis and having a bottom wall and a top opening at opposing axial ends along said container axis; a basket for supporting items to be cleaned and dimensioned to be removably receivable within said container, said basket defining a basket axis that is substantially coextensive with said container axis when said basket is received within said container and being configured to be rotatably supported for rotation on said bottom wall about said axes when received within said container; and spinning means for spinning said basket on said bottom wall about said axes when said basket is received within said container, whereby spinning said basket within said container on said bottom wall when immersed in fluid below said predetermined level creates turbulence and agitates the fluid in contact with the items to be cleaned to dislodge soil particles and contaminants from the items to be cleaned.

Various examples of a substrate cleaning apparatus and a substrate processing apparatus are described in the present disclosure. One example of the present invention is a substrate cleaning apparatus including a roll cleaning member cleaning a substrate, an inclination sensor detecting an inclination of the roll cleaning member, and an output device outputting a detection result of the inclination sensor.