A plasma system and a filter device are provided. In the system, an area surrounded by a dielectric window is configured as a first chamber for accommodating plasma. A first adapter is arranged under the dielectric window. An area surrounded by the first adapter is configured as a second chamber. A lower electrode platform is placed in the second chamber to carry a workpiece. A filter member of the filter device is placed at an intersection of the first chamber and the second chamber. The filter member includes through-holes configured to filter ions from the plasma. A first extension member extends from the filter member in a first direction and is placed over the first adapter. A second extension member extends from a position of the filter member adjacent to the first extension member to an inner side of the first adapter.

A material processing path selection method includes calculating a plurality of candidate material processing paths, determining a bottleneck process tank, and for each of the plurality of candidate material processing paths, calculating a bottleneck process tank utilization rate to select a candidate material processing path with a highest bottleneck process tank utilization rate in the plurality of candidate material processing paths as a target material processing path. The bottleneck process tank is a process tank having a highest use frequency among all process tanks, A use frequency of the process tank is equal to a total process time length of all materials that need to be transferred to the process tank divided by a number of all the materials that need to be transferred to the process tank.

A material processing path selection method includes calculating a plurality of candidate material processing paths, determining a bottleneck process tank, and for each of the plurality of candidate material processing paths, calculating a bottleneck process tank utilization rate to select a candidate material processing path with a highest bottleneck process tank utilization rate in the plurality of candidate material processing paths as a target material processing path. The bottleneck process tank is a process tank having a highest use frequency among all process tanks, A use frequency of the process tank is equal to a total process time length of all materials that need to be transferred to the process tank divided by a number of all the materials that need to be transferred to the process tank.

The substrate processing device according to one embodiment may comprise: a chamber unit provided with a processing space therein and comprising an inclined chamber surface having an opening; a door unit comprising an inclined door surface, which corresponds to the inclined chamber surface, and capable of being coupled to the chamber unit; and a door driving unit for driving the door unit so as to open/close the processing space.

The substrate processing device according to one embodiment may comprise: a chamber unit provided with a processing space therein and comprising an inclined chamber surface having an opening; a door unit comprising an inclined door surface, which corresponds to the inclined chamber surface, and capable of being coupled to the chamber unit; and a door driving unit for driving the door unit so as to open/close the processing space.

A system and method of capturing washing agents and washed item particulates. The washing agents and washed item particulates are contained in a pad placed over an existing surface where they are captured. The washing agents and washed items are sent to a central depository for recycling and separation for clean disposal. The depository allows for re-usable portions of the washing agents to be re-used as part of the system while unusable residuals are separated for proper treatment or disposal.

A system and method of capturing washing agents and washed item particulates. The washing agents and washed item particulates are contained in a pad placed over an existing surface where they are captured. The washing agents and washed items are sent to a central depository for recycling and separation for clean disposal. The depository allows for re-usable portions of the washing agents to be re-used as part of the system while unusable residuals are separated for proper treatment or disposal.

A cover plate bearing device, a cover plate cleaning device, and a cover plate cleaning method. The cover plate bearing device includes a main body and a gas channel provided on the main body; the main body includes two side walls separated in a first direction, a bottom wall connected with the side walls, and a receiving cavity enclosed and formed by the side walls and the bottom wall; the shape of the receiving cavity matches that of the curved cover plate; at least one gas outlet of the gas channel are provided on the side wall; and the gas channel being adapted for blowing gas with a preset angle towards a side of the side wall facing away from the bottom wall, to prevent a moving fluid from eroding the functional coating of the curved cover plate.

A cover plate bearing device, a cover plate cleaning device, and a cover plate cleaning method. The cover plate bearing device includes a main body and a gas channel provided on the main body; the main body includes two side walls separated in a first direction, a bottom wall connected with the side walls, and a receiving cavity enclosed and formed by the side walls and the bottom wall; the shape of the receiving cavity matches that of the curved cover plate; at least one gas outlet of the gas channel are provided on the side wall; and the gas channel being adapted for blowing gas with a preset angle towards a side of the side wall facing away from the bottom wall, to prevent a moving fluid from eroding the functional coating of the curved cover plate.

An upper holding device holds a substrate in a horizontal attitude without rotating the substrate. A lower holding device rotates a substrate while holding the substrate by suction. A substrate held by the upper holding device is cleaned with use of a cleaning liquid, and a substrate held by the lower holding device is cleaned with use of a cleaning liquid. Gas in a processing space is exhausted by exhaust equipment of a factory through an exhaust system. When a substrate is held by the upper holding device, gas in the processing space is not exhausted or gas in the processing space is exhausted at a first flow rate. Gas in the processing space is exhausted at a second or third flow rate that is higher than the first flow rate when the substrate is held by the lower holding device.