A pipe cleaning apparatus includes: a driving module; a cleaning module; and a joint module connecting the driving module and the cleaning module, wherein the driving module includes: a hollow frame extending in a horizontal direction; a pneumatic cylinder connected to a first end of the hollow frame; a first slider installed on the hollow frame; a second slider on the hollow frame and spaced apart from the first slider, wherein the second slider is connected to the pneumatic cylinder; front wheel assemblies on the hollow frame; and rear wheel assemblies on the hollow frame. In a cross-sectional view of the hollow frame, the rear wheel assemblies and the front wheel assemblies are arranged alternately with each other in a circumferential direction, and the front wheel assemblies are connected to the first slider, and the rear wheel assemblies are connected to the second slider.

Embodiments of the disclosure include an apparatus and method of cleaning a substrate. The disclosure describes a method of cleaning a substrate includes supplying a gas at a gas temperature and a gas mass flow rate to a nozzle. The method also includes supplying a liquid at a liquid temperature and a liquid mass flow rate to the nozzle. The method also includes mixing the gas with the liquid in the nozzle to form a fluid mixture having a mixture temperature of not more than about 10 C. below the liquid temperature. The method also includes spraying the fluid mixture onto a surface of the substrate through an orifice in the nozzle.

The present application provides a dispensing apparatus for processing an electronic component, comprising: a first track component and a second track component, a first flow-guiding component and a second flow-guiding component, the first flow-guiding component being arranged at the top of the first track component, the second flow-guiding component being arranged at the top of the second track component, the first flow-guiding component having at least one first gas inlet and at least one first gas outlet in communication with each other, the at least one first gas inlet being configured to be in communication with a clean gas source, the second flow-guiding component having at least one second gas inlet and at least one second gas outlet in communication with each other, the at least one second gas inlet being arranged facing the first gas outlet, and the at least one second gas outlet being configured to be in communication with a gas discharge motive power apparatus, so that clean gas can flow toward the at least one second gas inlet from the at least one first gas outlet, thereby forming a clean gas region above the electronic component to be processed, to avoid contamination with impurities during processing.