The present invention generally relates to a method of reducing contamination from plastics. The resulting purer plastic can be used in demanding applications.

The present invention generally relates to a method of reducing contamination from plastics. The resulting purer plastic can be used in demanding applications.

The present invention generally relates to a method of reducing contamination from plastics. The resulting purer plastic can be used in demanding applications.

The present invention relates to an apparatus for cleaning press rolls for electrodes, comprising two or more cleaning units provided with cleaning members having grains. According to the present invention, the apparatus for cleaning press rolls for electrodes comprises a plurality of, i.e., two or more, cleaning units, wherein the cleaning units respectively comprise cleaning members having grains with different directions, thus allowing a residual cleaning solution and contaminants to be effectively removed. In addition, when press rolls are cleaned using the apparatus for cleaning press rolls according to the present invention, an aqueous cleaning solution and an alcoholic cleaning solution, which have different properties, can be used together, and after cleaning, the cleaning solutions do not remain on the press rolls, and thus subsequently, secondary contamination of electrodes is prevented, and accordingly, when electrodes are manufactured, the occurrence of defects in the electrodes can be reduced.

A cavity cleaning and coating system for safely and efficiently cleaning and coating the interior of a cavity without requiring entry of any workers. The cavity cleaning and coating system generally includes a mount which is coupled with a movable arm of a vehicle. The mount includes an inner plate, which is coupled to the arm, and an outer plate. A shaft is coupled to the outer plate. The mount is adjustable independently of the arm of the vehicle, including outwardly, inwardly, and rotatably. A spray head is connected to the shaft. The spray head is rotatable and includes a dispenser for dispensing fluids. The vehicle is positioned near a cavity to be treated. The mount is adjusted for optimal positioning of the spray head. The spray head is lowered into the cavity to dispense a cleaning fluid and, after the cleaning fluid has dried, a coating fluid.

Provided are an apparatus and a method which ensure the wafers immersing in the chemical solution from one cleaning tank to the other cleaning tanks. The apparatus includes an inner tank (1001); at least one divider (1002) for dividing the inner tank (1001) into at least two cleaning tanks filled with chemical solution; a first robot (1005) equipped with at least a pair of end effectors (1051) for gripping and taking a wafer from a first cleaning tank (1011) to a second cleaning tank (1012); wherein each cleaning tank is provided with a cassette bracket (1003) in the bottom for holding wafers, and the at least one divider (1002) is provided with at least one slot (1004)< wherein the first robot (1005) grips and takes the wafer from the first cleaning tank (1011) to the second cleaning tank (1012) through the slot (1004) while keeping the wafer immersing.

An apparatus for cleaning semiconductor substrates includes a chamber (101), a chuck (102), a liquid collector (104), an enclosing wall (105), at least one driving mechanism (106), at least one internal dispenser (111), and at least one external dispenser (118). The chamber (101) has a top wall (1011), a side wall (1012) and a bottom wall (1013). The chuck (102) is disposed in the chamber (101) for holding a semiconductor substrate (103). The liquid collector (104) surrounds the chuck (102). The enclosing wall (105) surrounds the liquid collector (104). The at least one driving mechanism (106) drives the enclosing wall (105) to move up and down, wherein when the at least one driving mechanism (106) drives the enclosing wall (105) to move up, a seal room (110) is formed by the liquid collector (104), the enclosing wall (105), the top wall (1011) of the chamber (101), and the bottom wall (1013) of the chamber (101). The at least one internal dispenser (111) is disposed inside the seal room (110). The at least one external dispenser (118) is disposed outside the seal room (110). The at least one external dispenser (118) gets in and out the seal room (110) after the enclosing wall (105) is driven to move down.

A method of cleaning a semiconductor wafer includes: loading a semiconductor wafer into a cell having an annular trough; moving a plurality of nozzles into operational orientations for spraying a cleaning solution onto a top surface of the loaded semiconductor wafer; spraying the cleaning solution from each nozzle onto the top surface of the loaded semiconductor wafer in a direction defined by each nozzle's operational orientation such that a patterned flow of cleaning solution is formed on the top surface of the loaded semiconductor wafer; and collecting the cleaning solution in the annular trough of the cell as it flows off the top surface of the loaded semiconductor wafer.

Optimized-coverage selective laser ablation systems and methods may be utilized to prepare (ablate) a three-dimensional surface. Methods comprise receiving a 3D virtual model of the surface to be ablated, generating a preliminary ablation path, and optimizing the preliminary ablation path to produce an adapted ablation path. Methods may comprise ablating the surface according to the adapted ablation path. The preliminary ablation path may be based on scanning a laser sheet across a two-dimensional projection of the surface. The optimization may adjust one or more waypoints of the preliminary ablation path to achieve complete coverage of the surface at acceptable levels of ablation, with little to no ablation outside the surface, and with acceptable (e.g., at least locally minimal) time to ablate the surface.

In an example, a port cleaner may include a body having a fluid aperture extending into the body. The fluid aperture may extend into a surface of the body. The port cleaner may also include a fluid channel disposed, at least partially, within the body and may be in fluid communication with the fluid aperture. The port cleaner may further include a wiper or contact wiper engaged with the fluid channel and movable between a lowered position and a raised position. The contact wiper may extend from a surface of the body when disposed in the raised position.