The present invention relates to a cold rolled steel beam comprising: a web having two layers of steel, the web having a top end and a bottom end; a pair of bottom flanges extending outwardly from the bottom end of the web; and a pair of top flanges extending outwardly from the top end of the web, each top flange having two layers of steel. Preferably, a portion of each bottom flange has two layers of steel, and the cold rolled steel beam includes a pair of end connectors extending generally orthogonally from the web and positioned generally orthogonally to the bottom flanges and the top flanges. Preferably, the cold rolled steel beam is cold formed from a unitary piece of sheet steel.

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 m.

Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is laminated on the supporting copper foil, and an ultrathin copper layer that is laminated on the releasing layer. The thickness accuracy of the ultrathin copper layer as determined by a weight thickness method is 3.0% or less.

Disclosed herein is an electrolytic copper foil in which an average diameter of a pore which is a region between surface elements protruding from a matte side is 1 mm to 100 nm. The electrolytic copper foil has high elongation while maintaining low roughness and high strength and thus may be used in a current collector of a medium-large size lithium ion secondary battery and a semiconductor packaging substrate, and the like, for tape automated bonding (TAB) which is used in a tape carrier package (TCP).

A method of producing a composite heat dissipating structure by depositing a slurry of graphene particles upon a copper foil, drying the slurry to form a layer of graphene in contact with the copper foil, and consolidating the layer of graphene under pressure to reduce the thickness of the graphene layer and recovering the composite heat dissipating structure. Heat dissipating copper foils and composite heat dissipating structures and electronic devices incorporating the same are also disclosed herein.

An object of the present invention is to provide an electro-deposited copper-alloy foil excellent in infrared laser processability which enables uniform etching rate along a thickness direction in following etching process. To achieve the object, an electro-deposited copper-alloy foil obtained from electrolyzing of an electrolytic solution, wherein the electro-deposited copper-alloy foil has tin content of 8% by mass to 25% by mass is employed. In the electro-deposited copper-alloy foil, a grain in a crystal structure is preferably a columnar grain longitudinal along a thickness direction.

An original plate material for a heat-exchanging plate fabricated by press working and a method for fabricating the original plate material are provided. An original plate material for a heat-exchanging plate is a flat plate material made of titanium on the surface of which convex parts and concave parts are formed, and the heat-exchanging plate is fabricated by press working the original plate material. The convex parts and the concave parts are formed in a manner such that the shape parameter defined by (RzL/P) is 12 m or less, where Rz (m) denotes the height of the convex parts, L (m) denotes the width of the concave parts, and P (m) denotes the pitch between neighboring convex parts.

A method of making steel fibers, preferably for use as a concrete additive, and for the supply thereof in making steel fiber concrete, characterized in that to form the steel fibers (2) first a sheet-metal strip (1) is notched either on one face or both faces so as to form steel-fiber wires (4) that are initially connected together by webs (5), and that further, for subsequently converting the webs (5) into thin easily mutually separable separation webs forming separation surfaces that are fracture-rough and low in burring upon separation, the steel-fiber strip is subjected to a flexing process in which each web (5) is subjected to multiple bending deformations about its longitudinal axis in such a way that incipient cracks are produced at the webs (5) due to fatigue fracture and thus the separation webs are produced.

Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 m, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 m. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.