A vacuum table for supporting and flattening an electronic component includes a base plate structure comprising a top surface defining a plurality of suction arrangements. The vacuum table also includes a plurality of lip seals operatively coupled to the base plate structure and extending upwardly beyond the top surface of the base plate structure, the plurality of lip seals arranged to define a plurality of portions of the vacuum table, wherein each of the plurality of portions of the vacuum table includes at least one of the plurality of suction arrangements therein.

Various aspects of the subject technology relate to methods and systems for strengthening a metallic alloy during machining. The method includes providing a metallic alloy. The method can include flattening a portion of the metallic alloy. The method can include forming a workpiece from the flattened portion of the metallic alloy, wherein the workpiece comprises a top surface and a bottom surface. The method can also include stamping a first dimple profile on a top surface of the workpiece, wherein a dimple profile comprises a plurality of dimple indentations into a surface of the workpiece. The method can also include stamping a second dimple profile on the bottom surface of the workpiece. The disclosure further comprises an apparatus configured to form a workpiece comprising a plurality of dimple profiles oriented in the workpiece to strengthen the workpiece.

Various aspects of the subject technology relate to methods and systems for strengthening a metallic alloy during machining. The method includes providing a metallic alloy. The method can include flattening a portion of the metallic alloy. The method can include forming a workpiece from the flattened portion of the metallic alloy, wherein the workpiece comprises a top surface and a bottom surface. The method can also include stamping a first dimple profile on a top surface of the workpiece, wherein a dimple profile comprises a plurality of dimple indentations into a surface of the workpiece. The method can also include stamping a second dimple profile on the bottom surface of the workpiece. The disclosure further comprises an apparatus configured to form a workpiece comprising a plurality of dimple profiles oriented in the workpiece to strengthen the workpiece.

Pipe elements have circumferential grooves. The grooves have a first side surface contiguous with a first floor surface. The first side surface and the first floor surface together subtend a first 90 circular arc when viewed in cross section. The grooves also have a second side surface contiguous with a second floor surface. The second side surface is in spaced relation to and in facing relation with the first side surface. The second side surface and the second floor surface together subtend a second 90 circular arc when viewed in cross section. A third floor surface is contiguous with both the first and second floor surfaces and is a flat surface. A coupling used to connect the pipe elements has arcuate projections which engage the grooves of the pipe elements. The arcuate projections have a semi-circular cross section. Relief grooves are positioned adjacent to each arcuate projection.

Pipe elements have circumferential grooves. The grooves have a first side surface contiguous with a first floor surface. The first side surface and the first floor surface together subtend a first 90 circular arc when viewed in cross section. The grooves also have a second side surface contiguous with a second floor surface. The second side surface is in spaced relation to and in facing relation with the first side surface. The second side surface and the second floor surface together subtend a second 90 circular arc when viewed in cross section. A third floor surface is contiguous with both the first and second floor surfaces and is a flat surface. A coupling used to connect the pipe elements has arcuate projections which engage the grooves of the pipe elements. The arcuate projections have a semi-circular cross section. Relief grooves are positioned adjacent to each arcuate projection.