A portable wire cutting device for sampling a steel ingot includes a wire rack device, a driving system, and a multi-axis moving device. The wire rack device includes a first corner wheel, a second corner wheel, a transition wheel, a steering wheel, a first wire rack, a second wire rack, and a wire winding drum. The driving system includes a wire drum motor and a molybdenum wire, wherein the wire drum motor provides power driving for the operation of a cutting line; and the molybdenum wire is a closed molybdenum wire coil connected in an end-to-end manner, the molybdenum wire is wrapped around the first corner wheel, the second corner wheel, the wire winding drum, and an inner side of the transition wheel in a looping manner, and during operation, the cutting line performs wire cutting on an object by the molybdenum wire.

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

The disclosure relates to an apparatus for continuous processing of a cable-to-be-recycled simultaneously with being pulled from a pull zone during reconductoring or restringing so as to avoid storing the cable-to-be-recycled on a reel, wherein said cable-to-be-recycled has a cable length equal to a length of the pull zone, wherein the cable-to-be-recycled has aluminum strands surrounding a core, and wherein the cable-to-be-recycled is pulled during a pull from the pull zone by a first puller, the apparatus including: a strand cutter adapted to be used in proximity to the puller and adapted to continuously receive the cable-to-be-recycled and to cut through the aluminum strands of the cable-to-be-recycled, while in proximity to the puller, so as to remove segments of the aluminum strands from the core of the cable-to-be-recycled, for recycling of the segments of the aluminum strands, while leaving the core intact as the cable-to-be-recycled passes through the strand cutter during the pull from the pull zone of the cable-to-be-recycled.

A cutter for cutting a linear element includes a support frame, a pair of blade holders disposed opposite to each other and movably disposed on the support frame, a pair of blades facing each other and each disposed on one of the pair of blade holders, a pair of holding blocks facing each other and each disposed on one of the pair of blade holders, and a driving device disposed on the support frame. The driving device drives the pair of blade holders to move synchronously in a direction approaching each other or a direction separating away from each other. The pair of holding blocks clamp the linear element and the pair of blades cut off the linear element clamped by the pair of holding blocks while the pair of blade holders move synchronously in the direction approaching each other.

A portable wire cutting device for sampling a steel ingot includes a wire rack device, a driving system, and a multi-axis moving device. The wire rack device includes a first corner wheel, a second corner wheel, a transition wheel, a steering wheel, a first wire rack, a second wire rack, and a wire winding drum. The driving system includes a wire drum motor and a molybdenum wire, wherein the wire drum motor provides power driving for the operation of a cutting line; and the molybdenum wire is a closed molybdenum wire coil connected in an end-to-end manner, the molybdenum wire is wrapped around the first corner wheel, the second corner wheel, the wire winding drum, and an inner side of the transition wheel in a looping manner, and during operation, the cutting line performs wire cutting on an object by the molybdenum wire.

A simplified wire bending machine is provided comprising a bending head with an integrated wire cutoff mechanism. The bending head comprises an inner portion, wherein the inner portion includes a wire bending channel; and an outer portion, wherein the outer portion includes a cutting edge and one or more bending pins. The outer portion is rotatable about the inner portion such that a bending pin is capable of bending a wire around the inner portion. Further, the outer portion is movable from a first position to a second position in which the cutting edge is configured to engage and shear a wire.

A simplified wire bending machine is provided comprising a bending head with an integrated wire cutoff mechanism. The bending head comprises an inner portion, wherein the inner portion includes a wire bending channel; and an outer portion, wherein the outer portion includes a cutting edge and one or more bending pins. The outer portion is rotatable about the inner portion such that a bending pin is capable of bending a wire around the inner portion. Further, the outer portion is movable from a first position to a second position in which the cutting edge is configured to engage and shear a wire.

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.