Disclosed are a method of casting heterogeneous materials and a casting produced manufactured by the same. The method may include disposing a lost foam on a cavity of a mold as the cavity being formed in a shape corresponding to a shape of a casting product; injecting a first molten metal through a low-pressure molten metal ingate formed in the mold to form a low-pressure casting portion of the casting product; and injecting a second molten metal through a gravity molten metal ingate formed in the mold to form a gravity casting portion of the casting product.

A method of forming a dry molding sand additive may include recovering a non-sand fraction from a foundry waste material and adding the non-sand fraction to a dry molding sand additive formulation to form a dry molding sand additive. Adding the non-sand fraction to the dry molding sand additive formulation may reduce the amount of fresh clay and carbon to produce the dry molding sand additive. A method of forming a molding sand additive may include recovering a waste molding sand additive composition having a clay or carbon content differing from a desired clay and carbon content, recycling the waste molding sand additive as a raw material in production of a fresh molding sand additive, and adjusting the amount of fresh clay or carbon added during production of the fresh molding sand additive to achieve the desired clay and carbon content.

A method of forming a dry molding sand additive may include recovering a non-sand fraction from a foundry waste material and adding the non-sand fraction to a dry molding sand additive formulation to form a dry molding sand additive. Adding the non-sand fraction to the dry molding sand additive formulation may reduce the amount of fresh clay and carbon to produce the dry molding sand additive. A method of forming a molding sand additive may include recovering a waste molding sand additive composition having a clay or carbon content differing from a desired clay and carbon content, recycling the waste molding sand additive as a raw material in production of a fresh molding sand additive, and adjusting the amount of fresh clay or carbon added during production of the fresh molding sand additive to achieve the desired clay and carbon content.

The subject matter of the invention are sizing compositions containing an aqueous carrier liquid, refractory base materials and CH-acidic compounds, as well as their use for casting molds, as well as casting molds coated with the sizing composition.

The subject matter of the invention are sizing compositions containing an aqueous carrier liquid, refractory base materials and CH-acidic compounds, as well as their use for casting molds, as well as casting molds coated with the sizing composition.

A method and system of casting an integral multi-way valve based on 3D printing belong to the technical field of valve casting. The casting method and system determine, according to structural parameters of an integral multi-way valve to be cast, a plurality of ingates on a plurality of layers, a plurality of runners connecting the ingates on each layer, and a sprue connecting the plurality of runners, and an integral sand mold is printed by using the 3D printing technology to realize a multi-layer composite casting method and a corresponding casting system.

A method and system of casting an integral multi-way valve based on 3D printing belong to the technical field of valve casting. The casting method and system determine, according to structural parameters of an integral multi-way valve to be cast, a plurality of ingates on a plurality of layers, a plurality of runners connecting the ingates on each layer, and a sprue connecting the plurality of runners, and an integral sand mold is printed by using the 3D printing technology to realize a multi-layer composite casting method and a corresponding casting system.

In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.

In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.

A mold device is capable of producing a member formed from aluminum, and includes a mold and a molten metal supply part. The mold is capable of forming a cavity into which molten aluminum is charged. The mold has a base part formed from iron and a surface layer part. The surface layer part is provided on the cavity side of the base part and contains 20 weight % or more of chromium. A dichromium trioxide film is formable on a surface of the cavity side of the surface layer part. The molten metal supply part is capable of supplying molten aluminum into the cavity.