B22C3/00

SIZED MOLDS OBTAINABLE FROM A MOLDING MATERIAL MIXTURE CONTAINING AN INORGANIC BONDING AGENT AND PHOSPHATIC COMPOUNDS AND OXIDIC BORON COMPOUNDS AND METHOD FOR PRODUCTION AND USE THEREOF
20220355365 · 2022-11-10 ·

Sized molds for metal casting are obtained from molding material mixtures on the basis of inorganic bonding agents containing at least one phosphatic compound and at least one oxidic boron compound, especially sized, water glass-bound forms and cores, having at least one refractory base molding material, water glass as inorganic bonding agent and amorphous particulate silicon dioxide and one or more powdery oxidic boron compounds and one or more phosphatic compounds. The invention furthermore relates to a method for producing sized foundry mold bodies and use thereof, in particular for producing cast parts from iron alloys. The sizing is a water-based sizing.

Aqueous composition

According to an aspect of the present invention, an aqueous composition contains at least one selected from a group consisting of a carboxylic acid compound represented by the following formula (1), a carboxylic anhydride represented by the following formula (2), and a trimellitic anhydride; a basic compound; and water. In the formula (1), “R” represents an alkanediyl group having 2 to 4 carbons, a vinylene group, or a benzene ring, and “a” represents 2 or 3. In the formula (2), “R” represents an alkanediyl group having 2 to 4 carbons, a vinylene group, or a benzene ring.

Aqueous composition

According to an aspect of the present invention, an aqueous composition contains at least one selected from a group consisting of a carboxylic acid compound represented by the following formula (1), a carboxylic anhydride represented by the following formula (2), and a trimellitic anhydride; a basic compound; and water. In the formula (1), “R” represents an alkanediyl group having 2 to 4 carbons, a vinylene group, or a benzene ring, and “a” represents 2 or 3. In the formula (2), “R” represents an alkanediyl group having 2 to 4 carbons, a vinylene group, or a benzene ring.

CASTING ELEMENTS AND METHODS OF MAKING THE SAME USING LOW TEMPERATURE SOLIDIFICATION

Foundry casting elements and methods of forming the same, the methods including: forming an aqueous slurry including an inorganic binder precursor, shaping the slurry using a pattern, curing the shaped slurry using a low temperature solidification process to form a casting element, and removing the pattern from the casting element.

CASTING ELEMENTS AND METHODS OF MAKING THE SAME USING LOW TEMPERATURE SOLIDIFICATION

Foundry casting elements and methods of forming the same, the methods including: forming an aqueous slurry including an inorganic binder precursor, shaping the slurry using a pattern, curing the shaped slurry using a low temperature solidification process to form a casting element, and removing the pattern from the casting element.

Semiconductor-mounting heat dissipation base plate and production method therefor

In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.

Semiconductor-mounting heat dissipation base plate and production method therefor

In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.

Compositions and methods for refractory coatings with ester carriers

This technology relates to refractory coatings used in metal casting by the foundry industry. Refractory coatings are often used to coat foundry cores and molds for the purpose of improving the quality of castings formed in connection with the cores or molds, particularly at the surface of the casting. Whereas traditional coatings comprise water based solvents that require excessive drying times or HAPs that emit hazardous VOCs, preferred embodiments of the present invention comprise refractory coatings having VOC-exempt ester based solvents, such as DMC. Other preferred embodiments of the present invention comprise methods for reduction of VOC content in a foundry article.

Compositions and methods for refractory coatings with ester carriers

This technology relates to refractory coatings used in metal casting by the foundry industry. Refractory coatings are often used to coat foundry cores and molds for the purpose of improving the quality of castings formed in connection with the cores or molds, particularly at the surface of the casting. Whereas traditional coatings comprise water based solvents that require excessive drying times or HAPs that emit hazardous VOCs, preferred embodiments of the present invention comprise refractory coatings having VOC-exempt ester based solvents, such as DMC. Other preferred embodiments of the present invention comprise methods for reduction of VOC content in a foundry article.

COATING COMPOSITION, COMPRISING ORGANIC ESTER COMPOUNDS AND PARTICULATE, AMORPHOUS SILICON DIOXIDE, FOR USE IN THE FOUNDRY INDUSTRY

The present invention describes a coating composition for the foundry industry, for use in the foundry, in particular comprising certain organic ester compounds of a formula (I) and particulate, amorphous silicon dioxide (SiO.sub.2); and also coated foundry molding elements, especially foundry molds and/or foundry cores, which each comprise a coating composition of the invention. The invention further describes the use of a coating composition of the invention for producing a coating on a foundry molding element and a method for producing a foundry molding element coated with a water-containing refractory coating. The invention likewise describes a kit whose contents include a coating composition of the invention.