Patent classifications
B22F3/00
Aluminum alloy, manufacturing method of laminated molding and laminated molding
The present disclosure provides an aluminum alloy to be used in laminate molding containing Si, Fe, Mn and inevitable impurities, in which α-phase Al—Si—Fe intermetallic compound is present in the aluminum alloy. In addition, a manufacturing method of a laminated molding is provided which laminate molds using powder of this aluminum alloy. Further, a laminate molding of this aluminum alloy is provided.
ULTRA THIN TWO PHASE HEAT EXCHANGERS WITH STRUCTURAL WICK
Methods and system are provided for a heat exchanger. In one example, a system, comprises a mobile electronic device comprising a front cover and a rear cover, a heat exchanger arranged between the front cover and the rear cover, the heat exchanger comprising a fluid chamber arranged between an inner surface of a first plate and an inner surface of a second plate, and a wick material arranged within the fluid chamber, the wick material comprising a sintered material configured to allow a plurality of fluid passages to extend therethrough.
RARE EARTH MAGNET AND PRODUCTION METHOD THEREOF
A Sm—Fe—N-based rare earth magnet more resistant to demagnetization than ever before, particularly at high temperatures, and a production method thereof are provided.
The present disclosure presents a production method of a rare earth magnet, including mixing a SmFeN magnetic powder and a modifier powder to obtain a mixed powder, compression-molding the mixed powder in a magnetic field to obtain a magnetic-field molded body, pressure-sintering the magnetic-field molded body to obtain a sintered body, and heat-treating the sintered body, and a rare earth magnet obtained by the method. D.sub.50 of the magnetic powder is 1.50 μm or more and 3.00 μm or less, the content ratio of the zinc component in the modifier powder is 6 mass % or more and 30 mass % or less, and the heat treatment temperature is 350° C. or more and 410° C. or less.
Low-Cost High-Purity Vacuum Pumps and Systems
Disclosed is a pumping system with reduced contamination. A vacuum pump system includes a mechanical vacuum pump mechanism within a hermetic pump that hermetically isolates the pump mechanism from ambient air. A pump inlet is hermetically sealed to the hermetic pump housing. A pump outlet is hermetically sealed at one end to the hermetic pump housing and at the other end to an inlet of a Peclet seal tube. The vacuum pump system produces a vacuum in a vacuum processing chamber. A sweep gas source injects a sweep gas into at least one of (i) the hermetic pump housing and (ii) the inlet of the Peclet seal tube. The sweep gas and a process gas flow through the Peclet seal tube to substantially isolate against the backflow of the ambient air through the Peclet seal tube.
Reducing stresses in metal layers
A system including: a polymer substrate with a thermal conductivity of less than 0.5 W/(m-k); a spreader to form a layer of metal particulate on the polymer substrate; a mask applicator to apply a mask to a portion of the layer of metal particulate; and a pulsed irradiation light source to fuse a portion of the layer of metal particulate not covered by the mask.
Multi-directional binder jetting additive manufacturing
The devices, systems, and methods of the present disclosure are directed to powder spreading and binder distribution techniques for consistent and rapid layer-by-layer fabrication of three-dimensional objects formed through binder jetting. For example, a powder may be spread to form a layer along a volume defined by a powder box, a binder may be deposited along the layer to form a layer of a three-dimensional object, and the direction of spreading the layer and depositing the binder may be in a first direction and in a second direction, different from the first direction, thus facilitating rapid formation of the three-dimensional object with each passage of the print carriage over the volume. Powder delivery, powder spreading, thermal energy delivery, and combinations thereof, may facilitate consistently achieving quality standards as the rate of fabrication of the three-dimensional object is increased.
SOFT MAGNETIC ALLOY POWDER, SOFT MAGNETIC SINTERED BODY, AND COIL-TYPE ELECTRONIC COMPONENT
A soft magnetic metal powder or the like from which a soft magnetic metal fired body can be provided has a high magnetic permeability μ and a specific resistance ρ and is contained in a coil-type electronic component having sufficiently high inductance L and Q value and unlikely to be plating-extended and short-circuited. A soft magnetic metal powder contains soft magnetic metal particles containing at least Fe and Ni. Said soft magnetic metal powder further contains P, Si, Cr and/or M. M is at least one selected from among B, Co, Mn, Ti, Zr, Hf, Nb, Ta, Mo, Mg, Ca, Sr, Ba, Zn, Al, and rare earth elements. The content of each element is within a predetermined range.
METHOD FOR INJECTING A DECORATED ITEM
A method for machining by laser ablation or by micro-milling a raised and/or hollow structure on an impression of an injection mould. A method for manufacturing a ceramic or cermet item by injection using the injection mould to produce an item, and in particular a watch bezel, decorated directly during the injection.
AMORPHOUS METAL FOAM AND METHOD FOR PRODUCING SAME
An aspect of the present disclosure provides an amorphous metal porous body that is a metal porous body including pores, the amorphous metal porous body including: powder particle connection bodies in which at least portions of amorphous alloy powder particles adjacent to each other are connected in a network structure; and a plurality of pores provided between the powder particle connection bodies.
Molded solder and molded solder production method
Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.