Patent classifications
B22F2998/00
ARRANGEMENTS FOR FORMING THREE-DIMENSIONAL STRUCTURES, AND RELATED METHODS THEREOF
Embodiments relate to a method for forming a three-dimensional structure. The method includes determining one or more locations for positioning a sensing device based on structural coordinate information relating to a three-dimensional structure to be formed. The method further includes forming a portion of the three-dimensional structure based on the structural coordinate information. The method further includes positioning the sensing device at a location of the one or more locations.
ARRANGEMENTS FOR FORMING THREE-DIMENSIONAL STRUCTURES, AND RELATED METHODS THEREOF
Embodiments relate to a method for forming a three-dimensional structure. The method includes determining one or more locations for positioning a sensing device based on structural coordinate information relating to a three-dimensional structure to be formed. The method further includes forming a portion of the three-dimensional structure based on the structural coordinate information. The method further includes positioning the sensing device at a location of the one or more locations.
IMPROVED THERMOPLASTIC CONDENSATE POLYMERS AND METHOD TO FORM THEM
Copolymers of condensation polymers are formed by a method of cleaving and reacting with a chain extender to form an end capped cleaved condensation polymer that is further reacted with a second compound that may be comprised of a further chain extender and condensation polymer that react with a reactive group still remaining in the chain extender capping the cleaved condensation polymer. The method allows the formation of block copolymers, branched copolymers and star polymers of differing condensation polymers bonded through the residue of a chain extender.
IMPROVED THERMOPLASTIC CONDENSATE POLYMERS AND METHOD TO FORM THEM
Copolymers of condensation polymers are formed by a method of cleaving and reacting with a chain extender to form an end capped cleaved condensation polymer that is further reacted with a second compound that may be comprised of a further chain extender and condensation polymer that react with a reactive group still remaining in the chain extender capping the cleaved condensation polymer. The method allows the formation of block copolymers, branched copolymers and star polymers of differing condensation polymers bonded through the residue of a chain extender.
Molded solder and molded solder production method
Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.
Molded solder and molded solder production method
Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.
MATERIAL MANIPULATION IN THREE-DIMENSIONAL PRINTING
The present disclosure provides three-dimensional (3D) printing systems, apparatuses, software, and methods for safe production of at least one requested 3D object, and for passivation of material accumulated on a filter of the 3D printing system.
ADDITIVELY MANUFACTURED METAL ENERGETIC LIGAND PRECURSORS AND COMBUSTION SYNTHESIS FOR HIERARCHICAL STRUCTURE NANOPOROUS METAL FOAMS
Processes for tailoring the macroscopic shape, metallic composition, mechanical properties, and pore structure of nanoporous metal foams prepared through combustion synthesis via direct write 3D printing of metal energetic ligand precursor inks made with water and an organic thickening agent are disclosed. Such processes enable production of never before obtainable metal structures with hierarchical porosity, tailorable from the millimeter size regime to the nanometer size regime. Structures produced by these processes have numerous applications including, but not limited to, catalysts, heat exchangers, low density structural materials, biomedical implants, hydrogen storage medium, fuel cells, and batteries.
Fe-BASED ALLOY FOR MELT-SOLIDIFICATION-SHAPING AND METAL POWDER
The present invention relates to a Fe-based alloy for melt-solidification-shaping containing : 0.05 mass% ≤ C ≤0.25 mass%, 0.01 mass% ≤ Si ≤ 2.0 mass%, 0.05 mass% ≤ Mn ≤ 2.5 mass%, 2.5 mass% ≤ Ni ≤ 9.0 mass%, 0.1 mass% ≤ Cr ≤ 8.0 mass%, and 0.005 mass% ≤ N ≤ 0.200 mass%, with the balance being Fe and unavoidable impurities, and satisfying: 11.5 < 15C+Mn+0.5Cr+Ni < 20.
Fe-BASED ALLOY FOR MELT-SOLIDIFICATION-SHAPING AND METAL POWDER
The present invention relates to a Fe-based alloy for melt-solidification-shaping containing : 0.05 mass% ≤ C ≤0.25 mass%, 0.01 mass% ≤ Si ≤ 2.0 mass%, 0.05 mass% ≤ Mn ≤ 2.5 mass%, 2.5 mass% ≤ Ni ≤ 9.0 mass%, 0.1 mass% ≤ Cr ≤ 8.0 mass%, and 0.005 mass% ≤ N ≤ 0.200 mass%, with the balance being Fe and unavoidable impurities, and satisfying: 11.5 < 15C+Mn+0.5Cr+Ni < 20.