B23C3/00

Cutting work method and method for producing cut product

The present invention provides a cutting work method comprising a cutting work step of forming a through-groove passing through from a surface to a back face of a workpiece material by cutting the workpiece material with a cutting tool while bringing a lubricant material for assisting cutting process into contact with the cutting tool and/or the to-be-processed portion of the workpiece material, wherein the workpiece material comprises one or more materials selected from the group consisting of a metal, a fiber reinforced plastic, ceramic, and a composite material thereof.

Assembly and method for performing in-situ endpoint detection when backside milling silicon based devices

An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.

Assembly and method for performing in-situ endpoint detection when backside milling silicon based devices

An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.

Method for machining sputtering target, apparatus for machining sputtering target, sputtering target, and method for producing sputtering target product

A method for machining a sputtering target that includes a sputtering surface, an opposing surface opposite to the sputtering surface, and an outer peripheral surface being between the sputtering surface and the opposing surface comprises the steps of: fixing the sputtering target on a fixing table by mounting the sputtering surface or the opposing surface of the sputtering target on the fixing table; and cutting the outer peripheral surface of the sputtering target by a cutting tool while rotating the cutting tool along a circumferential direction of the outer peripheral surface of the sputtering target.

Hand-held power-tool device
11179840 · 2021-11-23 · ·

A hand-held power-tool device is described as including at least one intermediate shaft, which is formed as a planet wheel carrier and includes a plurality of planet wheel receptacles and planet wheel bearing points situated in the circumferential direction. It is provided that the intermediate shaft includes at least one material recess at least in the area of at least one planet wheel bearing point on its outer circumference.

Hard drive non-destructive dismantling system
11167384 · 2021-11-09 · ·

A system and method for dismantling components of electronic media electronic storage devices such as hard disk drives, solid state drives and hybrid hard drives. The components are dismantled in a nondestructive manner so as to be capable of reuse. First devices loosen the various components of the storage device, Second devices are provided for removing components from the storage device. A holding chassis receives the storage device, and moves the storage device for engagement with the first and second devices. A mechanism may be provided for destroying the data containing portion of the electric storage device when it is removed from the storage device. A database of information concerning past and current storage devices including their configurations, component locations and screw/fastener locations is provided along with a scanning system for retrieving information about the storage device being introduced into the system. The scanned information and information from the database is used to control and position the first and second devices and holding chassis.

Vehicle support structure and method of manufacturing same

A vehicle support structure formed by casting, the vehicle support structure includes a main body part attached to a vehicle side, a plurality of support portions extending from the main body part to support vehicle components, and a plurality of rib portions configured to connect the support portions and the main body part, respectively. A lightening portion is formed by casting at least in one of the rib portions. An external component mounting portion is formed in the lightening portion.

Vehicle support structure and method of manufacturing same

A vehicle support structure formed by casting, the vehicle support structure includes a main body part attached to a vehicle side, a plurality of support portions extending from the main body part to support vehicle components, and a plurality of rib portions configured to connect the support portions and the main body part, respectively. A lightening portion is formed by casting at least in one of the rib portions. An external component mounting portion is formed in the lightening portion.

ORGANIC CONTAMINATION FREE SURFACE MACHINING

A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

JIG FOR FIREARM LOWER RECEIVER MANUFACTURE
20230294226 · 2023-09-21 ·

A machining tool assembly is provided for machining a blank to form a firearm lower receiver. The assembly includes a pair of side plates positionable on opposed sides of the blank to capture the blank therebetween. A template plate having a template aperture is adapted to be removeably attachable to the side plates. The template aperture is aligned with a top surface of the blank and is adapted for machining a cavity within the blank having a peripheral contour complimentary to a peripheral contour of the template aperture. A centering mechanism is adapted to be removeably attachable to the template plate, with the centering mechanism including an opening aligned with a corresponding void formed on the blank to align the blank with the template plate.