Patent classifications
B23D57/00
Wire saw apparatus and cut-machining method
A wire saw apparatus 1 executes cut-machining by pressing a workpiece W against a cutting wire 3 spirally wound around multiple wire guides 2, while running the cutting wire 3 and simultaneously swinging the wire guides 2 as well as the cutting wire 3. The wire saw apparatus 1 includes a controller 8 controlling a position of a workpiece holder 51 for holding the workpiece W. The position is controlled depending on a swing angle of the cutting wire 3 so that machined portion of the workpiece W is shaped into an arc.
METHOD AND DEVICE FOR CRUSHING METAL DROSS BLOCKS AND/OR METAL EXTENSIONS
A method for crushing a metal dross block and/or metal extension uses a cable saw to at least tartly cut the metal dross block and/or metal extension.
Wire deflector and wire saw
A pivotable wire deflector 19 for a saw wire 3 of a wire saw 1 has a deflection roller 32, a pivot joint 60 and a clamping and spreading mechanism. The defection roller 32 has a running groove 45 for guiding the saw wire 3 of the wire saw 1. The pivot joint 60 has a rotary bearing block with a cylindrical receptacle 65, and a tube 63 which is arranged so as to be rotatable in the cylindrical receptacle, wherein the deflection roller 57 is attached to the one of rotary bearing block 62 or tube 63. A clamp 70 is fastened to the rotary bearing block 62 and arranged so as to enclose the tube 63. A lever 68 can be moved manually between a first position and a second position.
Method of cutting target members using a cutting saw device
A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
Chain Driven Diamond Wire Cutter
A diamond wire cutter, using an adjustable length pulley system, a diamond wire saw, and a movable pulley cart, can perform a through-cut of complete sections of a structure such as a tubular subsea by fitting a chain about an outer surface of the structure, securing the chain to the movable pulley cart and using the chain to move or otherwise guide the movable pulley cart about the outer circumference of the structure to cut while using a diamond wire to effect a cut between the movable pulley cart and the diamond wire saw.
WIRE SAW FOR CUTTING PIPE
A wire saw for cutting pipe is provided including a saddle forming a saddle surface for abutting against a cylindrical pipe, an elongate guide fixed to the saddle, a bow having a first and second end, a bridge portion joining the first and second ends, and an open end having a length L from the first end to the second end which is greater than a diameter D of the pipe, a wire loop movable along a track formed within the bow, and a cooling system for actively cooling the wire loop. The elongate guide has an axis approximately perpendicular to an axis of the pipe when the pipe is abutting against the saddle. An exposed portion of the wire loop extends across the open end. The bow is moveable on the elongate guide toward and away from the pipe when the pipe is abutting against the saddle.
Semi-autonomous rescue apparatus
A cutting device is configured to attach to a boom arm and includes a saw assembly with a cutting portion configured to cut into a target surface. The cutting device also includes a motor assembly coupled to the saw assembly. The motor assembly has at least two motors configured to rotate the saw assembly about two different axes. The cutting device further comprises a control system operatively coupled to the motor assembly. The control system has at least two sensors coupled to the saw assembly and the control system is configured to position the saw assembly to cut a target surface based on feedback from the at least sensors.
Treatment apparatus and method for waste steam generator, and installation method of treatment apparatus for waste steam generator
Disclosed herein are a treatment apparatus and method for a waste steam generator, and an installation method of a treatment apparatus for a waste steam generator. The treatment apparatus includes a cutting part for cutting a body of a waste steam generator, a driving part for driving the cutting part, and a support frame for supporting the cutting part and the driving part, wherein the support frame is coupled to an outer peripheral surface of the body of the waste steam generator in a divided state, and the cutting part is driven and cuts the body in a state in which the support frame is coupled to the outer peripheral surface of the body. Consequently, since the treatment apparatus is easily moved and installed, an installation time of the treatment apparatus may be shortened and an exposure time of a worker can be reduced.
Wire saw for cutting pipe
A wire saw for cutting pipe is provided including a saddle forming a saddle surface for abutting against a cylindrical pipe, an elongate guide fixed to the saddle, a bow having a first and second end, a bridge portion joining the first and second ends, and an open end having a length L from the first end to the second end which is greater than a diameter D of the pipe, a wire loop movable along a track formed within the bow, and a cooling system for actively cooling the wire loop. The elongate guide has an axis approximately perpendicular to an axis of the pipe when the pipe is abutting against the saddle. An exposed portion of the wire loop extends across the open end. The bow is moveable on the elongate guide toward and away from the pipe when the pipe is abutting against the saddle.
Method for slicing semiconductor single crystal ingot
An amount of warp of a wafer is not only reduced, but the amount of warp of the wafer is also accurately controlled to a desired amount. The present invention relates to a method for slicing a semiconductor single crystal ingot, by which a cylindrical semiconductor single crystal ingot is bonded to and held by a holder in a state where the ingot is rotated at a predetermined rotation angle around a crystal axis of the ingot different from a center axis of a cylinder of this ingot and the ingot is sliced by a cutting apparatus in this state. The predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder in such a manner that an amount of warp of a wafer sliced out by the cutting apparatus becomes a predetermined amount.