B23D57/00

Apparatus For Cutting Curved Wall Of Reactor Structure
20240416439 · 2024-12-19 ·

An apparatus for cutting a curved wall of a structure, of the present invention, may comprise; a guide rail mounted on a curved wall of a structure; a chain mounted on the guide rail; a support plate supported by the guide rail so as to be movable by means of a plurality of rollers; a body case coupled to the support plate; a sprocket mounted at the body case so as to rotate while engaged with the chain; a driving motor mounted in the body case so as to rotate the sprocket; a cutting blade rotatably mounted at the front of the body case; and cutting motor mounted in the body case so as to rotate the cutting blade.

Wheel weight removal device and method of use
12179321 · 2024-12-31 · ·

A tool attachment configured to remove a wheel weight from a vehicle wheel is disclosed. The tool attachment comprising a body. The body include an exterior surface, a first end, and a second end. A mounting surface is positioned on a first portion of the body proximate to the first end. The mounting surface is configured to abut a tool. An opening extends from the mounting surface to the exterior surface of the body. The opening is configured to receive a fastener to secure the body to the tool. A blade engage surface is positioned on a second portion of the body proximate to the second end. The blade engaging surface is configured to receive and secure a blade to the body. A tool including the tool attachment and a method of using the tool attachment are also disclosed.

SYSTEMS AND METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS

A system for slicing wafers from a monocrystalline semiconductor ingot includes a wire saw, a bond beam, the monocrystalline semiconductor ingot, and two sacrificial disks. The wire saw includes a wire web and wire guides operable to drive the wire web during a slicing operation. The bond beam is connected to the wire saw. The wire saw is operable to move the bond beam in a movement direction towards the wire web during the slicing operation to slice the wafers from the ingot. The ingot includes longitudinal end faces and a circumferential edge extending between the longitudinal end faces. The ingot is attached to the bond beam along the circumferential edge. One sacrificial disk is positioned adjacent each of the longitudinal end faces of the ingot to inhibit uncontrolled breakage of the wafers during the slicing operation.

Deflection roller, deflection roller package and wire saw

A deflection roller (32) for a deflection roller package (33) of a wire saw (1), having a wheel (32), a pivot bearing (42) and a sealing element (55). The wheel (32) has a raceway (45) along the periphery thereof for guiding a saw wire (3) of the wire saw (1). The pivot bearing (42) is coaxially inserted in the wheel (32). An outer sleeve (51) protrudes from a lateral surface (49) of the wheel (32). An inner sleeve (50) protrudes from a lateral surface opposite the one lateral surface (49). A radius (53) of the inner sleeve (50) is smaller than a radius (52) of the outer sleeve (51). The sealing element (55) is placed on the outer sleeve (51) or inserted into the inner sleeve (50).

Saw blade with reduced modal frequencies in the operating frequency range

A saw blade is provided including a circular metal disc including a circular metal disc including a central aperture and a plurality of teeth spaced around a periphery of the circular metal disc. A first plurality of fully enclosed body slots are generally equally spaced from a center of the circular metal disc by a first distance and a second plurality of fully enclosed body slots are each disposed directly radially outward from a respective one of the first plurality of body slots. The second plurality of slots are generally equally spaced from the center of the circular metal disc by a second distance greater than the first distance. The saw blade design provides a blade with no modal frequencies in the operating frequency range.

Reciprocating cutter
09776264 · 2017-10-03 ·

A reciprocating cutter system for use in spaces where a typical saw is unable to operate due to size, space, and operability limitations is disclosed. In at least one embodiment a reciprocating cutter system includes: a housing; a handle disposed on a top portion of the housing to provide an operator a user grip to operate the system; a cable saw coupled to the housing of reciprocating cutter system; a spring disposed within the housing and coupled to the cable saw such that as the cable saw is moved in a back-and-forth motion when in use, the spring also moves in a back-and forth-motion without the operator-held handle needing to move; and a connectivity bit, coupled to the cable saw, to connect the wire saw through the connectivity bit to a reciprocating device, the reciprocating device to provide the back-and-forth motion to the connectivity bit and the cable saw.

ELECTRIC CUTTING SYSTEM

An electric power saw/cutter includes a rotatable saw structure, a rear handle with a switch/speed control, a front handle, and a drive unit for rotating the saw structure. The drive unit includes a saw structure drive arrangement to which the saw structure is attachable, a transmission for driving the saw drive arrangement, an electric motor for driving an input shaft of the transmission, and a support structure for holding/carrying the saw structure drive arrangement. The transmission and the electric motor may be characterized in that the front handle and the rear handle are directly connected to each other to form a handle unit, which unit is resiliently connected to the drive unit, so that vibrations from the saw blade and drive unit will be reduced in the handle unit.

Method for slicing workpiece and wire saw
09707635 · 2017-07-18 · ·

A method for slicing a workpiece into wafers by imparting axial reciprocating motion to a wire wound around a plurality of grooved rollers, and moving the workpiece relatively downwardly to press the workpiece against the reciprocating wire and feed the workpiece with the workpiece cut into while supplying a slurry to the wire, the method including the steps of: configuring each of the grooved rollers such that a distance from a bottom of grooves of the grooved roller to a rotating shaft of the grooved roller decreases gradually from a wire-supply side toward a wire-collection side; slicing the workpiece in such a manner that the workpiece is pressed against the wire on the wire-supply side before the workpiece is pressed against the wire on the wire-collection side.

Saw blade and system and method for manufacturing a saw blade

A method of manufacturing a saw blade includes providing a coil stock, setting a first portion of the coil stock in a first direction, setting a second portion of the coil stock in a second direction opposite the first direction, and forming a plurality of cutting teeth in the first portion and the second portion of the coil stock after the first and second portions are set.

WORK TOOL
20170136599 · 2017-05-18 · ·

An electric oscillating tool has an electric motor having an output shaft, an eccentric shaft that is connected to one end region of the output shaft, and a weight that is connected to the other end region of the output shaft. A blade as a tool accessory is driven to reciprocally rotate around a spindle by reciprocating motion of the eccentric shaft in a transverse direction of the electric oscillating tool. The weight is driven to cancel out the inertial force of the eccentric shaft, so that the output shaft is stably rotated.