The invention relates to a blade decommissioning tool for decommissioning an installed wind turbine blade. The blade decommissioning tool comprises cutting means for cutting through the wind turbine blade in a transversal direction perpendicular to a longitudinal direction L of the wind turbine blade to form a proximal and distal part of the wind turbine blade; lowering means for lowering the distal part of the wind turbine blade relative to the proximal part; support means for supporting the cutting means and the lowering means; and clamping means for clamping the support means to wind turbine blade.

An object of the invention is achieved by a method for cutting an elongated shell-type object. The method may include steps of providing a gantry defining a portal and comprising a wire grid operable in the portal; operating the wire grid, whilst moving the shell-type object through the wire grid along a lateral-axis (Z) substantially perpendicular to the portal. The method is performed by a stationary gantry, where the shell-type object is moved through the portal. Thereby, the method is simplified as there is no need for a rail system for moving the gantry.

Wafers are sliced from a workpiece using a wire saw during slicing operations. The wire saw has a wire web of sawing wire and a setting device. The wire web is stretched in a plane between wire guide rollers that are mounted between fixed and moveable bearings. During each of the slicing operations, the setting device feeds the workpiece through the wire web along a feed direction perpendicular to a workpiece axis and perpendicular to the plane of the wire web. During each of the slicing operations, the movable bearings move oscillatingly axialy. The feeding of the workpiece through the wire web includes a simultaneous displacement of the workpiece along the workpiece axis using the setting element in accordance with a correction profile, which includes an oscillating component that is opposite to the effect which the axial moving of the movable bearings has on the shape of the sliced-off wafers.

An underwater cutting device for shipwreck salvage, comprising a lower support plate, an upper support plate, columnar support rods, and a reinforcing plate, and a plurality of columnar support rods and a reinforcing plate are provided between the lower support plate and the upper support plate, wherein it further comprises holding components, a moving component, and a rope saw component; two holding components are provided between the lower support plate and the upper support plate, and the two holding components are symmetrically arranged; a top of the upper support plate is provided with a moving component, and the moving component is provided with a rope saw component. When in use, place the pipe on the inner side of the right end of the lower support plate and the upper support plate, then operate the two holding components to hold the pipe.

An overhead sawing device comprising a central frame, a cutting cable, a driving unit, a first and a second arms configured to deflect the cutting cable to a lower level, at least two rotatable arms configured to receive the cutting cable from the higher level and to guide said cable during a cut. The device further includes a telescopic cable tensioning element. A method of operating the device is also provided, which method permits the execution of a continuous cut without repositioning the device, even in confined spaces.

Systems for cooling and directing a cutting wire. The systems include a water cooling box which permits cooling a cutting cable without any loss of cleaning/cooling fluid or contamination of the driving elements of the system. The systems also include a plurality of cutting wire directing elements which permit multiple cutting directions without derailing of the wire out of the guiding pulleys.

The present invention relates to a reciprocating wire saw device. The device is primarily comprised of a body with at least one handle, at least one trigger, at least one battery, and a second end with at least one blade and at least one plunger. The device preferably has two oscillating arms that oscillate independently via the motor. Therefore, each end of a wire blade can be attached to each arm such that oscillation of the arms allow the blade to cut a pipe or other similar object.

A rotatable multi-tool power saw apparatus may comprise a rotatable cutting head with a base plate. A rotating plate assembly may be rotatably mounted to the base plate and may be configured to position a cutting blade or other tools at multiple angular orientations. Left and right extension arms may extend from the base plate. A cutting blade may receive motive force from a motorized tool and rotate about the cutting head to contact a workpiece. A tool clamp mechanism may mount to the rotatable cutting head and may include a hinged clamp to secure the cutting head to the motorized tool. One or more handles may mount to the apparatus for user control.

A cutting apparatus (1) configured for The cutting apparatus (1) has a cutting means drive arrangement (100) having at least one cutting means (12) and at least one motive means (43) for providing power to the cutting means (12). The cutting apparatus (1) is configured such that all, some or a part of the cutting means drive arrangement (100) is interchangeable, on site. This enables use of a single cutting apparatus to perform a variety of different cuts and/or to cut a variety of different objects.

A system for slicing wafers from a monocrystalline semiconductor ingot includes a wire saw, a bond beam, the monocrystalline semiconductor ingot, and two sacrificial disks. The wire saw includes a wire web and wire guides operable to drive the wire web during a slicing operation. The bond beam is connected to the wire saw. The wire saw is operable to move the bond beam in a movement direction towards the wire web during the slicing operation to slice the wafers from the ingot. The ingot includes longitudinal end faces and a circumferential edge extending between the longitudinal end faces. The ingot is attached to the bond beam along the circumferential edge. One sacrificial disk is positioned adjacent each of the longitudinal end faces of the ingot to inhibit uncontrolled breakage of the wafers during the slicing operation.