Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

A foldable miter saw includes a base unit, a worktable unit rotatably mounted on the base unit and includes an axle block, a cutting unit having a rotatable member axially mounted to the axle block, an adjusting member adjustably mounted on the axle block, and a positioning device mounted on the rotatable member. Rotating the rotatable member relative to the axle block causes the cutting unit to be shifted between a working position where the adjusting member supports the positioning device in position and the end faces of the saw blade are kept perpendicular to the work surface, and a folded position where the adjusting member and the positioning device are separated from each other and one end face of the saw blade approaches the work surface.

According to one implementation, a machining apparatus includes an electromotive saw and an attaching structure. The electromotive saw cuts off a workpiece to be machined. The attaching structure attaches the saw to an arm of a robot. Further, according to one implementation, a machining method is provided. In the machining method, a machined product is manufactured by processing a composite material or a honeycomb structure with a cutting tool attached to an arm of a robot. Further, according to one implementation, a machining method is provided. In the machining method, a machined product is manufactured by processing a workpiece to be machined with a cutting tool attached to an arm of a robot. The workpiece is processed along a shape of a jig for setting the workpiece. The workpiece is processed with contacting a guide with the jig. The guide is attached to the arm.

A multiplicity of wafers are simultaneously cut from an ingot using a structured sawing wire having indentations and protrusions along its length, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire bears, has a curved groove bottom with a radius of curvature which, for each groove, is equal to or up to 1.5 times as large as the radius of the envelope of the structured wire which the structured wire has in the respective groove.

An additive manufacturing system includes a printing surface for supporting a printed part, and a part removal system, including at least one wire configured to move relative to the printing surface and configured to engage the printed part for removing the printed part from the printing surface. In another embodiment, an additive manufacturing system includes a printing surface for supporting a printed part, and a part removal system, including at least one saw configured to move relative to the printing surface and configured to engage the printed part for removing the printed part from the printing surface.

A method for using a vehicle-mounted wire saw for cutting an object (such as a wind turbine blade) includes coupling a wire saw having a continuous abrasive wire to a vehicle, engaging a wire tension to between about 100 PSI and about 5000 PSI, engaging a speed of an engine of the vehicle to between about 500 RPM and 4000 RPM, and cutting the object with the wire saw.

A cutting apparatus and the method of operating same is provided. The apparatus includes a feed tower assembly configured to be attached to an object and a frame assembly movably attached thereto. The frame assembly has arm assemblies thereon which accept a cutting member. A liquid spray system is provided for cooling components of the cutting apparatus.

A device for cutting a plate or panel of porous construction material includes a movement structure that moves the plate or panel and includes at least one conveyor, and which is able to move in a direction (X). The device also includes a wire to cut the plate or panel and a structure for passing the wire in a direction (Y) perpendicular to the direction (X) of travel of the plate or panel. The device for cutting allows a cut to be made that greatly limits the waste and dust generated.

A multiplicity of wafers are simultaneously cut from an ingot by means of a structured sawing wire, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire hears, has a curved groove bottom with a radius of curvature which, for each groove, is equal to or up to 1.5 times as large as the radius of the envelope of the structured wire which the structured wire has in the respective groove.

A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around a plurality of grooved rollers, the wire being fed from one of a pair of wire reels and taken up by another, the method including feeding a workpiece to the row for slicing while allowing the wire to reciprocate and travel in an axial direction, thereby slicing the workpiece at a plurality of positions aligned in an axial direction of the workpiece simultaneously. Prior to slicing, an abrasive-grain abrading step wherein the wire is allowed to travel without slicing the workpiece, allowing the wire to rub against itself within the reels, and dressing its surface for 30 minutes or more. The method can dress a fixed abrasive grain wire at low cost and suppress thickness unevenness of wafers.