B23D65/00

DIAMOND TOOL AND METHOD FOR PRODUCING A DIAMOND TOOL

A method for producing a tool with a diamond-studded tool head includes the steps of providing a tool shank and fixing a support element to a free end of the tool shank. The method further includes the steps of applying a layer of material interspersed with diamonds at least in sections to the support element and to a section of the tool shank adjoining the support element, and at least partially removing the support element, so that the layer of material interspersed with diamonds forms a tool head which in cross-section has the form of a circular ring and has a front-side recess.

CUTTING ELEMENTS AND PROCESS OF OBTAINING A RETRACTOR IN A CUTTING ELEMENT

A cutting element is described which promotes the removal of material through friction, such as saw blades, cutting tools applied to milling machines, among others, said cutting element having retractors formed by the deposition of metal and/or carbides on the surface of said cutting element, replacing the conventionally used hard metal insert.

GROUND SET SAW BLADE

A saw blade comprises a blade backer with a pair of side surfaces that extend substantially parallel to each other. An intermediate surface extends between the pair of side surfaces of the blade backer. A plurality of teeth extends from the intermediate surface. At least one of the teeth is located entirely within planes containing the side surfaces of the blade backer. A tip is formed at an apex end portion of the one tooth. A leading face surface of the tip on the one tooth is disposed at an acute angle relative to a plane extending perpendicular to the planes containing the side surfaces of the blade backer.

GROUND SET SAW BLADE

A saw blade comprises a blade backer with a pair of side surfaces that extend substantially parallel to each other. An intermediate surface extends between the pair of side surfaces of the blade backer. A plurality of teeth extends from the intermediate surface. At least one of the teeth is located entirely within planes containing the side surfaces of the blade backer. A tip is formed at an apex end portion of the one tooth. A leading face surface of the tip on the one tooth is disposed at an acute angle relative to a plane extending perpendicular to the planes containing the side surfaces of the blade backer.

Saw blade and saw blade tooth construction

A saw blade includes a plate with teeth. A tip pocket is formed in each of the teeth where the tip pocket has a first end and a second end and a continuously curved surface between the first end and the second end. A tip has a back face shaped to match the continuously curved surface. A joint joins the tip to the plate where the joint extends for substantially the length of the surface of the tip pocket and the back face. The continuously curved surface may have a wave profile. A top face of the tip and a peripheral face of the tooth may be coplanar.

Saw blade and saw blade tooth construction

A saw blade includes a plate with teeth. A tip pocket is formed in each of the teeth where the tip pocket has a first end and a second end and a continuously curved surface between the first end and the second end. A tip has a back face shaped to match the continuously curved surface. A joint joins the tip to the plate where the joint extends for substantially the length of the surface of the tip pocket and the back face. The continuously curved surface may have a wave profile. A top face of the tip and a peripheral face of the tooth may be coplanar.

Saw blade and method for arranging saw teeth

A saw blade includes a group A (group A1 [=straight tooth+the odd number of set teeth]+group A2 [=straight tooth+the even number of set teeth]) and a group B (group B1 [=straight tooth+the odd number of set teeth having opposite set-bending sides to those in the group A1]+group B2 [=straight tooth+the even number of set teeth having opposite set-bending sides to those in the group A2]). Wide and narrow set teeth are arranged so that a max/min ratio of the number of pitches between the narrow set teeth having identical set-bending side and set width is 1.8 or less, and a max/min ratio of the number of pitches between the wide set teeth having identical set-bending side set width is 2.7 or less.

Saw blade and method for arranging saw teeth

A saw blade includes a group A (group A1 [=straight tooth+the odd number of set teeth]+group A2 [=straight tooth+the even number of set teeth]) and a group B (group B1 [=straight tooth+the odd number of set teeth having opposite set-bending sides to those in the group A1]+group B2 [=straight tooth+the even number of set teeth having opposite set-bending sides to those in the group A2]). Wide and narrow set teeth are arranged so that a max/min ratio of the number of pitches between the narrow set teeth having identical set-bending side and set width is 1.8 or less, and a max/min ratio of the number of pitches between the wide set teeth having identical set-bending side set width is 2.7 or less.

Methods, wires, and apparatus for slicing hard materials

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

Methods, wires, and apparatus for slicing hard materials

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.