A lead-free solder material is provided. In one example, the solder material may include solder particles including at least 30 wt % nickel, and an activator including or consisting of at least one of a group of activator materials, the group including an organic acid or salt thereof, and an amine or salt thereof.

A lead-free solder material is provided. In one example, the solder material may include solder particles including at least 30 wt % nickel, and an activator including or consisting of at least one of a group of activator materials, the group including an organic acid or salt thereof, and an amine or salt thereof.

Moving unit for moving two soldering assemblies connected by means of a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.

There is provided a laser welding method of joining a bus bar and an intermediate member by irradiating a laser beam on a surface of the intermediate member with the bus bar and the intermediate member being overlapped with each other. The laser welding method includes: a first welding step of forming a first welding line by moving the laser beam in a C shape from a welding start point to a welding intermediate point when viewed from a direction orthogonal to a surface of the intermediate member; and a second welding step of forming a second welding line continuous with the first welding line by moving the laser beam from the welding intermediate point to a welding end point located in a welding region formed inside the first welding line from the welding start point and the welding intermediate point.

The invention relates to a laser brazing system, comprising a braze tool having a laser configured to emit a laser beam along a radiation path, and a braze wire tool being configured to guide a braze wire along a wire path intersecting the laser beam. The system comprises a jig comprising a first alignment surface and a first blocking surface, wherein the first alignment surface is configured to be in contact with the braze wire while the first blocking surface blocks at least a first part of the emitted laser beam, and a detector arranged in the radiation path and configured to detect the emitted light of the laser beam passing the jig.

The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected. It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.

An aluminum alloy brazing sheet has a 3XXX, 1XXX or 6XXX core, an interliner and a 4XXX brazing layer without added Mg. The interliner has Bi and Mg, the magnesium migrating to the surface of the brazing sheet during brazing and reducing the aluminum oxide to facilitate brazing without flux in a controlled inert atmosphere with reduced oxygen.

In an under component having a proximal end and a distal end, the under component comprising a cylindrical portion extending from the proximal end to the distal end; wherein the proximal end includes a rim that extends laterally from the cylindrical portion and that is flush with the proximal end; the rim extending from the cylindrical portion, wherein the rim includes a proximal edge and a distal edge. An over component having a proximal end and a distal end and a rim having a proximal edge and a distal edge, wherein the distal end of the under component extending to a position flush with a proximal edge of the rim of the over component, wherein the distal end of the over component extending to a position flush with a distal edge of the rim of the under component. A central component, wherein the central component is coupled to the over component, and the over component is coupled to the under component

A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.