A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.

An aluminum heat exchanger includes first and second plates with inner and outer surfaces, which are joined by brazing and define at least one fluid flow passage. The first and second plates each comprise a core layer of aluminum or an aluminum alloy having a melting temperature greater than an aluminum brazing temperature. The first plate also includes a first outer clad layer defining the outer surface of the first plate. The first outer clad layer is solderable to a metal layer of an object to be cooled and includes nickel or copper. A second outer clad layer is located between the first outer clad layer and the core layer and is roll bonded to at least the second outer clad layer. A manufacturing method includes brazing first and second plates, where the layers of the first plate are roll bonded and the first plate is optionally formed before brazing.

A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.

Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including embossments that are made of multiple deposited layers, the layers including diamond-like carbon layers and layers that contain silicon-based materials such as silicon carbide layers.

A tool system controls and prevents gaps during processing of assemblies at elevated temperature. Gaps are prevented from arising at joints between components during temperature changes. The tool system includes a lever arm having a body, a connection configured to allow the body to pivot, a cam surface defined by the body and configured to engage the second component, and a weight arm extending from the body and over the second component. In response to movement of the second component, the lever arm is configured to pivot at the connection while the weight arm is configured to generate a force transferred through the body to the second component to maintain contact at the joint between the first component and the second component. A rod may be connected with the lever arm for added weight.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.

A screen for brazing a heat exchanger including a plurality of core plates and a base plate. The plurality of core plates may be formed from an aluminum alloy brazing sheet containing magnesium and may have a shape having a taper portion at a periphery. The base plate may be larger and thicker than a core plate of the plurality of core plates. The plurality of core plates and the base plate may be heated and brazed under an inert gas atmosphere. The screen may include a metal tube enclosing a stacked body of the plurality of core plates. The tube may follow the outer border of the plurality of core plates such that a specific minute gap is defined between an inner wall face of the tube and a tip edge of the taper portion.

A ball disposition system includes a ball adsorption device, and a ball guide plate providing a ball guide hole. The ball adsorption device includes an adsorption plate providing an adsorption hole extending in a first direction, and a pin extending in the first direction, a portion of the pin inserted in the adsorption hole. The ball guide plate is located beyond the adsorption plate in the first direction.

An aluminum brazing sheet having a multi-layer structure of two layers or more, an aluminum alloy brazing material being located on an outermost surface by being cladded on one surface or both surfaces of a core material, and the aluminum brazing sheet being applied to brazing in which the aluminum brazing sheet is bonded to a member to be brazed made of aluminum or an aluminum alloy without using a flux in a non-oxidizing atmosphere without decompression. The brazing material is made of an Al—Si—Mg—Sn brazing material containing, by mass %, 0.01% to 2.0% of Mg, 1.5% to 14% of Si, and 0.005% to 1.5% of Sn, and in observation in a surface direction before brazing, there are more than 10 Mg—Sn compounds with a circle equivalent diameter of 0.01 μm or more and less than 5.0 μm in the Al—Si—Mg—Sn brazing material per 10000 μm.sup.2 field of view.