A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.

A system for creating a braze joint within a component. The system includes an environment operable to reach a braze temperature sufficient to melt at least a portion of a braze material. The system also includes a component within the environment, the component including a base having a base surface, a recess depending from the base surface into the base to an inner edge, and a braze material within the recess and forming a cap above the base surface. The braze material fills the recess from the cap to the inner edge. The cap has an exposed braze surface. The system also includes an insulation layer that at least partially covers the exposed braze surface.

Systems and methods to control fabrication of an assembly involve a first end sheet having an interior surface and an exterior surface, opposite the interior surface. A system includes interior sheets, the interior sheets including a first interior sheet at one end of a stack of the interior sheets and including a last interior sheet at an opposite end of the stack of the two or more interior sheets, the first interior sheet being adjacent to the interior surface of the first end sheet, and a second end sheet having an interior surface and an exterior surface, opposite the interior surface. The last interior sheet is adjacent to the interior surface of the last end sheet, and the interior surface of the first end sheet or the second end sheet includes venting features, the venting features including holes or slots to channel heat, gas, or vapor during a brazing process.

A method for producing a component by brazing and a related component are disclosed. The component may include a first part, a second part and a third part, wherein the first part includes a first junction part, the second part includes a second junction part and a cross junction part, and the third part includes a third junction part, and wherein the third junction part has a part and a remaining part. In an embodiment the method includes coupling the first part and the second part to each other by performing a preceding weld in a state of overlapping a part of the first junction part and the second junction part and, after performing the preceding weld, coupling the first part, the second part, and the third part to each other by performing a following weld.

A process of modifying a passage in a component is provided. The process includes inserting a first material into the passage; blocking at least one end of the passage; inserting an elongated member into the passage through the first material; heat treating the passage, the first material, and the elongated member to form a solid interior in component; and machining through the solid interior to form a modified passage in the component.

The invention relates to a method for theiiiially stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.

An aluminum alloy brazing sheet including a core material, a sacrificial material provided on one surface of the core material, a brazing filler material provided on the other surface side of the core material, and an intermediate layer provided between the core material and the brazing filler material. The core material contains Si: 0.30 to 1.00 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.60 to 1.20 mass %, Mg: 0.05 to 0.80 mass %, and Al. The sacrificial material contains Si: 0.10 to 1.20 mass %, Zn: 2.00 to 7.00 mass %, Mn: 0.40 mass % or less, and Al. The intermediate layer contains Si: 0.05 to 1.20 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.10 to 1.20 mass %, and Al.

An aluminum brazing sheet for flux-free brazing having a multilayer structure of two or more layers including at least one core material layer and one brazing material layer, wherein the brazing material layer is positioned on one or both sides of the core material layer and on an outermost surface of the brazing sheet. The brazing material layer is made of an Al—Si—Mg—X brazing material containing: in mass%, 0.05 to 2.0% of Mg, and 2.0 to 14.0% of Si, and further containing one or more of 0.01 to 0.3% of Bi, Ga, Sn, In and Pb, a total amount of Bi, Ga, Sn, In and Pb being 0.5% or less. X indicates one or more of Bi, Ga, Sn, In and Pb.

Provided are new aluminum alloys for use as one or more cladding layer(s) in clad aluminum alloy products for brazing applications. The cladding layer(s) include constituents that break and remove the oxide film on metal parts to be joined to produce high-strength brazing joints without the use of corrosive flux. Also provided herein are corrosion-resistant aluminum sheet packages including one or more of the aluminum alloy cladding layer(s) and an aluminum alloy core.

Since the solder 106 temporarily remaining in the first region 301 is in a state of being high in curvature, it is in point contact with the semiconductor element 105 at the vertex of the solder 106. Thereafter, the solder 106 is gradually wetted and spread from the center part to the peripheral part and from the first region 301 to the second region 302 while the semiconductor element 105 is pressed against the solder 106. At this time, since the solder 106 wets and spreads while discharging air, generation of voids can be suppressed.