A process for producing an amorphous ductile brazing foil is provided. According to one example embodiment, the method includes providing a molten mass, and rapidly solidifying the molten mass on a moving cooling surface with a cooling speed of more than approximately 10.sup.5° C./sec to produce an amorphous ductile brazing foil. A process for joining two or more parts is also provided. The process includes inserting a brazing foil between two or more parts to be joined, wherein the parts to be joined have a higher melting temperature than that the brazing foil to form a solder joint and the brazing foil comprises an amorphous, ductile Ni-based brazing foil; heating the solder joint to a temperature above the liquidus temperature of the brazing foil to form a heated solder joint; and cooling the heated solder joint, thereby forming a brazed joint between the parts to be joined.

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

A Magnetic-field melting preform solder that melts by action of an AC magnetic field, wherein the preform solder includes a laminated structure made up of two or more layers, at least two layers constituting the laminated structure is made up of solder material, the at least two layers do not contain ferromagnetic material, each of the at least two layers includes a surface facing with each other, and the surfaces facing with each other are in contact with each other. A bonding method using the preform solder includes a providing the preform solder between an electrode on a substrate and an electrode of an electronic component, and bonding together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the preform solder.

A capacitor (2) includes a capacitor main body (4), a base (6), and a resin layer (8-1). The capacitor main body includes an outer package case (10), an opening sealing member (14) attached to an opening of the outer package case, and a terminal lead (16-1, 16-2) extending through the opening sealing member. The base is disposed toward the opening sealing member of the capacitor main body and includes an insertion through hole (18-1, 18-2) into which the terminal lead is inserted to be exposed on a mounting surface side, and a protruding portion (20) surrounding the insertion through hole. The resin layer is arranged at least between the base and the opening sealing member. The base and the resin layer are in contact with or spaced apart from each other without at least partly adhering to each other.

A coating composition for a heat exchanger tube including vanadium (V), a flux, and a binder, wherein the vanadium is included in an amount of 28 to 38 parts by weight with respect to 100 parts by weight of the composition, and a coating method of a heat exchanger tube using the same are provided.

The present invention reduces and mitigates thermal stress generated at joint portions between a header plate and a flat tube of a heat exchanger. In a direction of a vertical center axis passing the center of the inside of a flat tube, positions of first brazing parts are set to be closer to the center of the flat tube in the direction of the vertical center axis than positions of edge brazing parts. Accordingly, the thermal stress concentrated at the joint portions between short sides of the flat tube and the header plate is dispersed to other portions.

This document describes systems and techniques of a depth-adaptive mechanism for ball grid array dipping. In an aspect, a depth-adaptive mechanism having a tensioned mesh is positioned in a reservoir filled with flux. When solder balls of an integrated circuit component are dipped into the reservoir of flux, the solder balls are pressed up against the tensioned mesh. The tensioned mesh is configured to, first, elastically deform under the downward force applied by the solder balls and, second, provide an equal and opposite pushing force in order to facilitate solder ball extraction. In so doing, the solder balls of an integrated circuit component can be more easily extracted from flux when deep ball grid array dipping is performed.

A method for joining two or more metallic components. The method includes operating a cold-spray apparatus to deposit a feedstock comprising nickel-based alloy particles on a braze region of a first metallic component to form a nickel-containing coating on the braze region. The method also includes brazing the first metallic component and a second metallic component by exposing the braze region to a braze material to form a braze joint that bonds the first metallic component to the second metallic component.

A method for joining two or more metallic components. The method includes operating a cold-spray apparatus to deposit a feedstock comprising nickel-based alloy particles on a braze region of a first metallic component to form a nickel-containing coating on the braze region. The method also includes brazing the first metallic component and a second metallic component by exposing the braze region to a braze material to form a braze joint that bonds the first metallic component to the second metallic component.

An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.