An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate.

A method for circuit fabrication includes defining a solder bump, including a specified solder material and having a specified bump volume, to be formed at a target location on an acceptor substrate. A transparent donor substrate, having a donor film including the specified solder material, is positioned such that the donor film is in proximity to the target location on the acceptor substrate. A sequence of pulses of laser radiation is directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film onto the target location on the acceptor substrate of a number of molten droplets of the solder material such that the droplets deposited at the target location cumulatively reach the specified bump volume. The target location is heated so the deposited droplets melt and reflow to form the solder bump.

A method of using a solder reflow oven can include disposing at least one substrate including solder in a chamber of the oven. The method can include decreasing a pressure of the chamber to a first pressure between about 0.1-50 Torr. After decreasing the pressure of the chamber, the temperature of the at least one substrate can be increased to a first temperature. Formic acid vapor can be admitted into the chamber above the at least one substrate while nitrogen is discharged into the chamber below the at least one substrate. The method can also include removing at least a portion of the formic acid vapor from the enclosure. After the removing step, the temperature of the at least one substrate can be further increased to a second temperature higher than the first temperature. The at least one substrate can be maintained at the second temperature for a first time. And then, the at least one substrate can be cooled.

A welding connection element includes a body and an assembly portion. The body includes a fitting fastening portion having an elastic withdrawal space. The elastic withdrawal space is capable of elastically withdrawing two or more fastening portions, so as to enable the fastening portions to be receivingly fastened in another object. The welding connection element has a welding surface configured to be welding connected to a welding surface of the object. The welding surface of the object is provided in advance with a solder layer configured to be heated and to welding connect the welding connection element and the welding surface of the object. The welding connection element is provided at a carrier in advance, taken out by a tool, compared with an assembly position of the object by a comparison device, and placed at the assembly position by the tool so as to be assembled with the object.

A hot wind is blown to a land and a lead from the underside of a printed board, to perform preheating. At the start of preheating or after start of preheating, a laser beam is applied to a soldering point, and meanwhile, wire solder is fed to a position contacting with the soldering point. The fed wire solder is melted by the laser beam. After soldering is finished, feeding of the wire solder is stopped. Application of the laser beam is stopped, to solidify the melted solder.

A process of repairing a component includes identifying a void in a component; determining at least one approximate physical configuration of the void; inserting borescope into the component in order to view the void; providing a repair rod approximately equivalent to at least one of the least one approximate physical configuration of the void; inserting the repair rod into component; confirming insertion of the repair rod in the void; separating the repair rod to leave a repair plug in the void; and depositing braze paste over the repair plug in the void.

A method of making a fluid injection component for a gas turbine engine includes depositing material onto a piece of tube stock. The method includes machining an elbow into the deposited material, wherein machining the elbow includes forming a braze joint surface in the deposited material. Depositing can include laser cladding the material onto the piece of tube stock.

A method of making a fluid injector for a gas turbine engine includes depositing material onto a piece of tube stock. The method includes machining the deposited material into a fluid injector component. Depositing can include laser cladding the material onto the piece of tube stock. The method can include placing or flowing braze into a braze joint location between the deposited material and another fluid injector component and forming the braze into a braze joint in the braze joint location.

A brazing material for brazing aluminum or an aluminum alloy includes fluoride-based flux, a solidifying agent, and a coating film uniformity agent, and is solid at 25° C.

Iron-based braze filler alloys having unexpectedly narrow melting temperature ranges, low solidus and low liquidus temperatures, as determined by Differential Scanning calorimetry (DSC), while exhibiting high temperature corrosion resistance, good wetting, and spreading, without deleterious significant boride formation into the base metal, and that can be brazed below 1,100 C contains a) nickel in an amount of from 0% to 35% by weight, b) chromium in an amount of from 0% to 25% by weight, c) silicon in an amount of from 4% to 9% by weight, d) phosphorous in an amount of from 5% to 11% by weight, e) boron in an amount of from 0% to 1% by weight, and f) the balance being iron, the percentages of a) to f) adding up to 100% by weight. The braze filler alloys or metals have sufficient high temperature corrosion resistance to withstand high temperature conditions of Exhaust Gas Recirculation Coolers.