Provided is an attaching device that can convey a component, such as a nut, to a portion to be welded without using an air cylinder. The present invention provides an attaching device (100) that attaches a nut (240) to a bracket (230). The attaching device (100) has a component feeding part (10) that stores the nut therein, a welding part (40) that welds the nut to the bracket by using electrodes (41, 42), a conveying part (20) that conveys the nut stored in the component feeding part to a position where the nut is to be attached to the bracket, and a feeding head (30) that temporarily positioned between the electrodes (41, 42) and that places the nut conveyed from the conveying part on the lower electrode of the pair of electrodes.

In solder printer, solder supply device uses positive and negative pressure supply device to apply pressure inside air chamber to move solder cup inside outer tube, such that solder paste is supplied from supply nozzle. Controller, when supply of solder paste from supply nozzle is stopped, performs drive control of positive and negative pressure supply device to decrease the pressure inside air chamber, and uses timer to measure the time required from the starting of decreasing the pressure inside the air chamber to when the pressure inside air chamber has reached a set pressure. Because this required time corresponds to the movement amount of solder cup from the start of supply of the solder paste to when supply is stopped, controller using the measured required to estimate the remaining amount of the solder paste in detail with good accuracy.

A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

A torch includes a body that defines an interior cavity, and a fuel inlet connector secured to the body and disposed within the interior cavity. A regulator is disposed within the interior cavity and includes a regulator housing, a regulator valve and a regulator valve actuating device. An intake stem is secured to one of the fuel inlet connector and the regulator housing, and defines an intake flow passage. A burn tube is coupled with the body and defines a burn tube flow passage. A trigger is pivotally coupled with the body. The regulator valve opens as the trigger pivots between an off position and a full flow position, permitting a user to initiate and vary a flow of hydrocarbon fuel to the burn tube flow passage when the intake flow passage is in fluid communication with a source of hydrocarbon fuel, by varying the position of the trigger.

An intelligent soldering handpiece comprising a housing; a solder tip; a heater for heating the solder tip; a processor for receiving an image of a solder joint being soldered by the intelligent soldering handpiece, determining solder joint information, and associating the image of the solder joint with the determined solder joint information to distinguish the determined solder joint information for each respective joint.

A pattern formed on a silicon wafer is fine so that solder bumps formed on the silicon wafer are also fine and hence, when a failure occurs, the failure cannot be corrected so that an entire silicon wafer as a workpiece is discarded. Provided is a correction method where, on solder bumps formed on the silicon wafer, a mask in which holes are formed with the same pattern as the solder bumps is placed so as to cover the solder bumps and, thereafter, molten solder is caused to come into contact with the solder bumps through the mask thus filling hole portions of the mask with the molten solder.

A soldering apparatus and method involves capturing an image of a soldering operation, and storing image data in association with that particular soldering operation. A soldering tool that is used to perform the soldering operation has a position during the soldering operation, and the image data could also be stored in association with data for that particular position. The position data could be for an operation start point and/or an operation endpoint. Associating the image data in this way could help a manufacturer investigate soldering abnormalities that might be reported after a product is shipped to a customer.

A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device.

Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.