An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

The invention relates to a soldering tip assembly for an electric soldering device, in particular a soldering iron. The soldering tip assembly is designed to be releasably arranged on a soldering device handle which has a heating element, and the soldering tip assembly has a sleeve with a soldering tip provided on the distal end of the sleeve. The sleeve has an opening at the proximal end for introducing the heating element, wherein a holding element which at least partially surrounds the sleeve in an annular manner and a spring element which is provided between the holding element and the sleeve are provided, the spring element pushing the holding element in the distal direction. The sleeve has at least one stop arranged distally from the spring element. The stop secures the holding element against the soldering tip assembly in the distal direction.

A semiconductor device manufacturing device (10) comprises: a stage (16) on which a substrate (100) is loaded; a bonding head (14) that is disposed facing the stage (16) and that bonds a semiconductor chip (110) to the substrate (100); and a controller (18). The bonding head (14) includes: an attachment (33) that holds the semiconductor chip (110) by suctioning; and a heating part (31) that detachably holds the attachment (33) and that heats the attachment (33). The heating part (31) has a first heating area (32a) and a second heating area (32b) that surrounds the first heating area (32a) in the horizontal direction. The controller (18) controls the temperatures of the first heating area (32a) and the second heating area (32b) independently.

A semiconductor device manufacturing device (10) comprises: a stage (16) on which a substrate (100) is loaded; a bonding head (14) that is disposed facing the stage (16) and that bonds a semiconductor chip (110) to the substrate (100); and a controller (18). The bonding head (14) includes: an attachment (33) that holds the semiconductor chip (110) by suctioning; and a heating part (31) that detachably holds the attachment (33) and that heats the attachment (33). The heating part (31) has a first heating area (32a) and a second heating area (32b) that surrounds the first heating area (32a) in the horizontal direction. The controller (18) controls the temperatures of the first heating area (32a) and the second heating area (32b) independently.

A plumber's heat shield comprises an arcuate preferably metallic shell attached to a spring-clamp by means of an obedient shaft which enables the heat shield to be moved to any position relative to the spring-clamp. The arcuate shell is preferably formed from aluminum or other material having high infrared reflectivity. The obedient shaft is preferably formed from helically-wound steel spring outer sheath surrounding a ductile copper wire core. The spring steel outer sheath prevents the ductile copper wire core from being bent at too sharp of a radius (which would cause the ductile core to work-harden and fracture) while at the same time protecting the ductile copper wire core from the open-flame of the soldering torch.

A plumber's heat shield comprises an arcuate preferably metallic shell attached to a spring-clamp by means of an obedient shaft which enables the heat shield to be moved to any position relative to the spring-clamp. The arcuate shell is preferably formed from aluminum or other material having high infrared reflectivity. The obedient shaft is preferably formed from helically-wound steel spring outer sheath surrounding a ductile copper wire core. The spring steel outer sheath prevents the ductile copper wire core from being bent at too sharp of a radius (which would cause the ductile core to work-harden and fracture) while at the same time protecting the ductile copper wire core from the open-flame of the soldering torch.

A first water spray unit that sprays water into the gaseous mixture containing the flux component, a separation unit having an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flow component from the gaseous mixture.

An apparatus for manufacturing a thermoelectric module includes an alignment mechanism for aligning a plurality of thermoelectric elements with respect to a plurality of electrodes attached to a substrate, wherein the alignment mechanism includes a dispenser having a plurality of injection portions and the plurality of thermoelectric elements is inserted into the plurality of injection portions.

Provided is an attaching device that can convey a component, such as a nut, to a portion to be welded without using an air cylinder.

The present invention provides an attaching device (100) that attaches a nut (240) to a bracket (230). The attaching device (100) has a component feeding part (10) that stores the nut therein, a welding part (40) that welds the nut to the bracket by using electrodes (41, 42), a conveying part (20) that conveys the nut stored in the component feeding part to a position where the nut is to be attached to the bracket, and a feeding head (30) that temporarily positioned between the electrodes (41, 42) and that places the nut conveyed from the conveying part on the lower electrode of the pair of electrodes.