The present disclosure describes a resistance soldering method for producing a plate assembly including at least two basic elements that are materially bonded together via a soldering device, e.g., for producing a winding of an electrical machine. The method includes applying an output voltage to a first electrode and a second electrode, between which the at least two basic elements are arranged, to solder a solder element interposed therebetween; detecting a correct or incorrect position of the solder element in the plate assembly via a control unit; determining via the control unit a voltage between the solder element and one or more points on the electric circuit. The control unit detects the correct or incorrect position of the solder element through an evaluation and/or a comparison with reference to the voltage or voltages.

The disclosure relates to the field of spray welding, and involves a method and a device for liquid spray welding, as well as the application method thereof. The method for liquid spray welding specifically comprises the following steps: S1: Solder to be spray-soldered is melted under the protection of an inert gas; S2: Then, the melted solder is spray-soldered while using ultrasonic focusing. The device includes a solder conversion mechanism which consists of a container; the cavity in the container is used for placing the solder; a spraying hole is arranged at the bottom of the container to connect with the cavity, and a heating mechanism is mounted along the outer wall of the container; a device for driving the solder spraying is used to control the frequency of an ultrasonic generating mechanism.

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.

A robotic wire termination system for efficiently connecting a plurality of wires to an electrical connector. The robotic wire termination system generally includes a frame, a connector support attached to the frame, a robot manipulator having at least one arm, a heating device attached to the at least one arm and a control unit in communication with the robot manipulator to control the operation of the robot manipulator. The arm of the robot manipulator is adapted to move the heating device so that the heating device can apply heat to a selected connector pin of the electrical connector.

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.

A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.

A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.

A soldering station includes a first tool port configured to interface with a first soldering tool, a second tool port configured to interface with a second soldering tool, a display configured to display information relating to one or both of the first and second soldering tools, and processing circuitry configured to interface with the display to provide the information relating to one or both of the first and second soldering tools. The first tool port has a first indicator associated therewith and the second tool port has a second indicator associated therewith. The first indicator generates a first color that is also generated at a third indicator associated with the first soldering tool. The second indictor generates a second color that is also generated at a fourth indicator associated with the second soldering tool, the first and second colors being different from each other.