A friction stir welding tool comprises a cylindrical shank, a shoulder portion disposed at a distal end of the shank, a pin extending from the shoulder, a cutting insert mounted within a concave portion at the distal end of the shank, and a scribe cutter mounted at a distal end of the cutting insert. The cutting insert extends distally through a channel in the pine, and the scribe cutter extends from a distal end surface of the pin in an offset position. The distal end surface of the pin is perpendicular to a longitudinal axis of the shank.

A friction stir welding tool comprises a cylindrical shank, a shoulder portion disposed at a distal end of the shank, a pin extending from the shoulder, a cutting insert mounted within a concave portion at the distal end of the shank, and a scribe cutter mounted at a distal end of the cutting insert. The cutting insert extends distally through a channel in the pine, and the scribe cutter extends from a distal end surface of the pin in an offset position. The distal end surface of the pin is perpendicular to a longitudinal axis of the shank.

The present invention provides a conductive bonded assembly utilizing particles of Ni or an Ni alloy as conductive particles so as to enable firing under non-pressing conditions and further realize an excellent bonding strength, electron migration characteristic, and ion migration characteristic. The conductive bonded assembly of the present invention is a conductive bonded assembly of an electronic component which has a first bondable member (for example, electrode material), a second bondable member (for example, a semiconductor device on an Si or SiC substrate), and a conductive bonding layer bonding these bondable members together, where the bonding layer is an Ni sintered body formed by a sintered body of Ni particles which has a porosity of 30% or less, and, further, can be obtained by heating and sintering the Ni particles at the time of firing where the Ni sintered bonding layer is formed.

The disclosure relates to a brazing method for joining substrates, in particular where one of the substrates is difficult to wet with molten braze material. The method includes formation of a porous metal layer on a first substrate to assist wetting of the first substrate with a molten braze metal, which in turn permits joining of the first substrate with a second substrate via a braze metal later in an assembled brazed joint. Ceramic substrates can be particularly difficult to wet with molten braze metals, and the disclosed method can be used to join a ceramic substrate to another substrate. The brazed joint can be incorporated into a solid-oxide fuel cell, for example as a stack component thereof, in particular when the first substrate is a ceramic substrate and the joined substrate is a metallic substrate.

The present invention relates to a method for joining at least two metal workpiece parts (2, 8) of a differing metal composition to each other by means of explosion welding, comprising the steps of: •—enclosing an inner workpiece part (2) at least partially with an outer workpiece part (89; •—arranging a mantle of explosive material (14) round the outer workpiece part; and •—detonating the explosive material in order to bring about a metallurgical connection between the two workpiece parts; •—wherein during the detonation of the explosive material the inner workpiece part is substantially wholly filled with and/or is at least partially enclosed by a dilatant non-Newtonian mixture (20). The invention further relates to a workpiece manufactured via this method.

A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.

The disclosed method relates to manufacturing a heat exchanger which causes no brazing defects, and a heat exchanger manufactured by the method. The method relates to manufacturing a heat exchanger having an aluminum alloy tube defining a cooling-medium flowing passage and a copper alloy tube defining a water flowing passage, wherein a heat exchange is carried out between a cooling medium flowing through the cooling-medium flowing passage and water flowing through the water flowing passage. The aluminum alloy tube and the copper alloy tube are brazed to each other at a temperature of less than 548° C.

Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

A lift-off method for transferring an optical device layer in an optical device wafer to a transfer substrate, the optical device layer being formed on the front side of an epitaxy substrate through a buffer layer. A transfer substrate is bonded through a bonding layer to the front side of the optical device layer of the optical device wafer, thereby forming a composite substrate. A pulsed laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer is applied from the back side of the epitaxy substrate to the buffer layer, thereby breaking the buffer layer, and the epitaxy substrate is peeled from the optical device layer, thereby transferring the optical device layer to the transfer substrate. Ultrasonic vibration is applied to the composite substrate in transferring the optical device layer.

A magnetic component with a rare-earth magnet is provided. The rare-earth magnet has a bronze coating that partially or entirely covers the surface of the rare-earth magnet. Further, the tin coating partially or entirely covers the bronze coating. A production process for the magnetic component as well as a soldering method for connecting the magnetic component with a substrate is also provided.