The present disclosure provides a linear friction joining device which includes: a pressing device for pressing a second member onto a first member in a pressing direction; a vibrator for relatively vibrating the first member and the second member; a controller which is configured to bring the second member into contact with the first member by a position control, which depends on a measurement result of position sensors, to change the position control to a load control, which depends on a measurement result of load sensors, and to increase a pressing load toward a joining load; and a joining load reaching time adjuster which is configured to adjust a length of a joining load reaching time which is between the time when the position control is changed to the load control and the time when the pressing load reaches the joining load.

A non-magnetic member, a first magnetic member and a second magnetic member are prepared. The first magnetic member and the second magnetic member are connected to the non-magnetic member. Then, a first bonding portion which bonds the non-magnetic member and the first magnetic member to each other, and a second bonding portion which bonds the non-magnetic member and the second magnetic member to each other are formed. A hot isostatic pressing process is performed to the non-magnetic member, the first magnetic member and the second magnetic member to establish diffusion-bond. Thereafter, the non-magnetic member, the first magnetic member and the second magnetic member are hollowed, and the first bonding portion and the second bonding portion are removed. Thereafter, the non-magnetic member becomes a non-magnetic body, the first magnetic member becomes a first magnetic body, the second magnetic member becomes a second magnetic body and a sleeve is obtained.

A non-magnetic member, a first magnetic member and a second magnetic member are prepared. The first magnetic member and the second magnetic member are connected to the non-magnetic member. Then, a first bonding portion which bonds the non-magnetic member and the first magnetic member to each other, and a second bonding portion which bonds the non-magnetic member and the second magnetic member to each other are formed. A hot isostatic pressing process is performed to the non-magnetic member, the first magnetic member and the second magnetic member to establish diffusion-bond. Thereafter, the non-magnetic member, the first magnetic member and the second magnetic member are hollowed, and the first bonding portion and the second bonding portion are removed. Thereafter, the non-magnetic member becomes a non-magnetic body, the first magnetic member becomes a first magnetic body, the second magnetic member becomes a second magnetic body and a sleeve is obtained.

A friction stir spot welding method includes a welding step of performing friction stir spot welding of a workpiece by using a pin member and a shoulder member while the workpiece is supported and pressed by the end face of a clamp member and a pressing step of causing a friction stir spot welding device to press an obverse surface and a reverse surface of at least one of a friction-stirred region of the workpiece and an adjacent region adjacent to the friction-stirred region of the workpiece from a rotary tool side and an opposite side after the welding step while the pin member and the shoulder member are accommodated in an accommodation space of the clamp member.

A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).

The present disclosure provides methods for preparing an extruded product from a solid billet. The methods can include providing an as-cast billet for extrusion; applying a simultaneous rotational shear and axial extrusion force to the as-cast billet to plasticize the as-cast billet; and extruding the plasticized as-cast billet with an extrusion die to form an extruded product. Methods for preparing extruded products from billets can also include: providing a billet for extrusion; while maintaining a majority of the billet below 100° C., applying a simultaneous rotational shear and axial extrusion force to one end of the billet to plasticize the one end of the billet; and extruding the plasticized one end of the billet with an extrusion die to form an extruded product. Methods for preparing an extruded product from a billet can also include providing a billet for extrusion; applying a simultaneous rotational shear and axial extrusion force to the billet to plasticize the billet; extruding the plasticized billet with an extrusion die to form an extruded product; and artificially aging the extruded product for less than the ASTM recommended amount of time.

A transmission shaft of a countershaft-type manual transmission is constructed from a plurality of hollow shaft portions which are butt press welded to one another, at least two of which hollow shaft portions are provided in each instance with at least one helical toothing of a fixed wheel of a spur gear stage. The hollow shaft portions provided with a helical toothing are connected to the respective adjacent hollow shaft portion in each instance so as to be rotated by a correction angle (Δα) around their center axis in proportion to a deviation (Δx) from their axial target position, wherein the ratio between the correction angle (Δα) and the axial deviation (Δx) corresponds to the pitch (s) of the helical toothing (Δα/Δx=s).

A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

A friction stir processing system can include a rotatable die assembly. The rotatable die assembly can include a die body and a plurality of die segments. The die body includes a die base and a die stem. The die stem extends axially from the die base, the die stem defines an extrusion cavity, and the die body is formed from a first material. The plurality of die stems are coupled to the die stem. The plurality of die segments are disposed around the extrusion cavity to collectively form a die surface opposite to the die base. The plurality of die segments are formed from a different material than the die body.