An inspection device includes: a laser irradiation unit; an imaging unit; and a control unit. The control unit is configured to execute a processing process of controlling the laser irradiation unit according to a recipe set such that a plurality of modified regions are formed inside a wafer by irradiating the wafer with a laser beam and a full-cut state where cracks extending from the modified regions have reached a back surface and a surface is attained; an identification process of identifying a state of the crack on the back surface extending from the modified region, and a state of at least one of the modified regions and the cracks inside the wafer, based on a signal; and a determination process of determining whether or not a dicing force applied to the wafer according to the recipe is proper, based on information identified in the identification process.

A method for welding between two metallic plates, including: (a) fitting a solid plate without openings, configured to be transparent at at least one emission wavelength of a laser beam (F) emitted by a laser (L), between the laser (L) and at least one contact zone between the metallic plates to be welded; (a1) inerting of the contact zone via a netural gas, where the neutral gas circulates in channels delimited by the contact zone between the metallic plates and by the solid plate; (a2) exerting pressure on the two metallic plates to apply them against one another in the contact zone to be welded, where the application pressure is exerted by the solid plate directly in contact with one of the two metallic plates to be welded; and (b) emission of a laser beam, through the solid plate, to perform welding of the metallic plates in the contact zone.

An example system includes: a hand-held welding tool that is manually placed in a welding position, wherein the hand-held welding tool is configured to be activated to cause a contact tip or a welding heat source to automatically move from a first position and to second position during a welding operation, and wherein a welding arc is automatically and repeatedly turned off and on while the contact tip or the welding heat source moves from the first position to the second position to make a plurality of welds between the first position and the second position, wherein, as a travel speed decreases, a time period between each arc on time increases to make equally spaced welds.

A method for producing an intermediate glass plate includes a defect formation step, a separation step, and a polishing step. In the defect formation step, a defect is formed on main surfaces of glass blanks by irradiating a laminate of the glass blanks with a laser beam from one side in a lamination direction in which the glass blanks are laminated, along the lamination direction, and moving the laser beam relative to the laminate such that a circle is drawn in a view from the main surfaces of the glass blanks. In the separation step, a cylindrical laminate is formed by separating a removal target portion along the defect while maintaining the laminate. In the polishing step, a side wall surface of the laminate is polished while maintaining the cylindrical laminate so as to obtain a disk-shaped intermediate glass plate that has been subjected to edge surface polishing.

A wafer processing method includes a shield tunnel forming step of executing irradiation with a laser beam with a wavelength having transmissibility with respect to a wafer to form shield tunnels each including a fine pore and a modified tube that surrounds the fine pore, and a dividing step of applying an external force to the wafer to divide the wafer into individual device chips. The shield tunnel forming step includes a first shield tunnel forming step of successively forming the shield tunnels in one planned dividing line with interposition of at least intervals corresponding to one shield tunnel, and a second shield tunnel forming step of successively forming the shield tunnels in regions in which the intervals are provided in the planned dividing line.

A method for manufacturing a unitary body side structural frame for a vehicle is provided. The method comprises providing a plurality of blanks, joining the blanks to each other to form a composite blank wherein joining the blanks includes forming one or more overlapping regions formed by partially overlapping two blanks and deforming the composite blank to form the unitary body side structural frame. A unitary body side structural frame as obtained by any of the methods herein described is also provided.

A laser processing method includes a first step of emitting measurement laser light of a first wavelength from the reference surface side to a reference object having a reference surface of which reflectance for the first wavelength is known to obtain a reference light amount as a reflected light amount of the measurement laser light on the reference surface, a second step of emitting the measurement laser light from the first surface side to the object to be processed to obtain a first light amount as a reflected light amount of the measurement laser light on the first surface, and a third step of, after the first step and the second step, calculating a reflectance of the first surface for the first wavelength based on a reflectance of the reference object, the reference light amount, and the first light amount.

A system for treating material of a cutting element may include a method, and the method may include providing a piece of material to form a blank for the cutting element, and applying a cladding material to at least a portion of the blank utilizing a laser to bond a cladding powder to the exterior surface of the blank. The application may include selecting and utilizing a power level of the laser and a rate of movement of the spot of the laser across the exterior surface which is effective to form a stratum of martensite in the substrate of the material below the exterior surface and the cladding material bonded to the exterior surface. The method may further include removing a portion of the cladded blank to form a cutting edge with a portion of the stratum of martensite exposed at the cutting edge.

A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing head.

The invention relates to a device (1) for laser cladding, a method (100) for operating such a device, and a component (4′) produced using such a method and/or such a device comprising a laser cladding unit (2) having at least one laser cladding head (3) disposed thereon, one or more material sources (5) for supplying the laser cladding head with a material (M) to be applied, and a laser beam source (6) for supplying the laser cladding head with laser light (L) for carrying out the laser cladding, wherein the device is configured to apply material layers (42, 43, 44) from an adjacent application cladding track (MS) to a surface (41) of a component (4) in the form of at least a first layer (42) made from a material (M) that comprises structures (42s) projecting from the surface of the first layer and having a first hardness (H1), and a second layer (43) applied thereto made from a material (M) having a second hardness (H2) that is less than the first hardness, and the application process is controlled so that the second layer at least partly covers the structures projecting from the first layer.