Patent classifications
B23K26/00
Material deposition for fluid injectors
A method of making a fluid injector for a gas turbine engine includes depositing material onto a piece of tube stock. The method includes machining the deposited material into a fluid injector component. Depositing can include laser cladding the material onto the piece of tube stock. The method can include placing or flowing braze into a braze joint location between the deposited material and another fluid injector component and forming the braze into a braze joint in the braze joint location.
Machining condition adjustment apparatus and machine learning device
Disclosed is a machine learning device of a cutting condition adjustment apparatus including: a state observation section that observes, as state variables indicating a current state of an environment, cutting condition data indicating a laser cutting condition for a laser cutting and oblique rearward temperature rise data indicating a temperature rise value at an oblique rearward part of a cutting front of a workpiece, a determination data acquisition unit that acquires temperature rise value determination data for determining propriety of the temperature rise value during cutting based on the laser cutting condition for the laser cutting as determination data indicating a propriety determination result of the cutting of the workpiece, and a learning unit that learns the temperature rise value and adjustment of the laser cutting condition for the laser cutting in association with each other using the state variables and the determination data.
PATTERN FORMING APPARATUS FOR BASE MATERIAL, PATTERN FORMING METHOD, BASE MATERIAL, AND CONTAINER
A pattern forming apparatus for a base material includes a holding unit and a pattern forming unit. The holding unit is configured to hold a base material on which one of a protrusion shape portion and a recess shape portion is formed. The pattern forming unit is configured to form a pattern on the base material. The pattern is formed on at least one of the protrusion shape portion, the recess shape portion, a periphery of the recess shape portion, a periphery of the protrusion shape portion, a portion along the protrusion shape portion, and a portion along the recess shape portion.
LASER PROCESSING DEVICE AND METHOD FOR ADJUSTING FOCAL POSITION OF LASER BEAM USING SAME
Laser processing device (100) includes a laser oscillator that generates laser beam (LB), laser head (60) that irradiates a workpiece with laser beam (LB), and manipulator (40) on which laser head (60) is mounted. Manipulator (40) includes robot arm (41), arm tip shaft (J6) provided at a tip of robot arm (41) in a manner rotatable about axis (RA), and connector component (50) that connects arm tip shaft (J6) and laser head (60). Connector component (50) is provided with gauge attachment portion (51a) to which gauge (80) is attached removably. Gauge (80) has a reference point corresponding to the focal position of laser beam (LB).
Methods and apparatuses for laser processing materials
Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.
Online ordering and just-in-time manufacturing of laser-finished garments
An on-demand manufacturing of apparel system includes online customization and ordering of garments, previewing of the garments, manufacturing including laser finishing of garments, and delivery to the customer. Laser finishing of apparel products reduces finishing cost, lowers carrying costs, increases productivity, shortens time to market, be more reactive to trends, reduces product constraints, reduces lost sales and dilution, and more. Fabric templates can be used to produce a multitude of laser finishes. Operational efficiency is improved.
Laser apparatus for cutting brittle material
An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.
LASER PROCESSING SYSTEM
A laser processing device includes a setting device that sets an irradiation condition of laser light, and a first storage that stores the set irradiation condition. The setting device sets different irradiation conditions respectively for cells included in test cells. A verification device captures an image of the processing pattern and calculates luminance values for the cells respectively. The setting device sets at least one of the irradiation conditions for main processing, based on information on luminance values of the test cells extracted from the luminance values for the cells and based on the irradiation conditions set for the test cells.
Manufacturing process of element chip using laser grooving and plasma-etching
A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.
Laser welding system and method using machined clamping tool
A laser welding system for joining first and second thermoplastic workpieces, and including a clamp, an actuator, and a laser source. The clamp includes first and second clamping structures positioned together to engage opposite sides of the workpieces when they adjoin each other. The first clamping structure has a non-flat or irregular surface, facing the first workpiece. The actuator causes the clamping structures to press the first and second workpieces together. The laser source applies laser radiation having a wavelength of 2 microns toward the workpieces to be joined, while they are pressed together by the clamp, to melt irradiated portions of the workpieces to one another. The first clamping structure transmits substantially all of the energy of the laser radiation through the material. The first workpiece has a non-flat or irregular surface facing the first clamping structure, which substantially conforms with the surface of the first clamping structure.