A case includes a first member and a second member configured in such a way that a closed space is formed between the first and second members in a state where the first and second members abut against each other. The first member includes a shaft portion extending toward the second member. The second member includes a shaft support portion including a circumferential wall portion that surrounds one end portion of the shaft portion. The shaft portion includes an enlarged-diameter portion that is the one end portion melted in such a way as to be enlarged in diameter.

A method of separating a wafer into at least two thinner wafers includes a pressing member placing step of placing a pressing member that is transmissive of a wavelength of a laser beam on a first surface of the wafer such that the pressing member is pressed against the first surface of the wafer, a separation initiating point forming step of forming a separation initiating point in the wafer by applying the laser beam whose wavelength is transmittable through the wafer to the wafer while positioning a focused spot of the laser beam within the wafer and moving the focused spot and the wafer relatively to each other along a first direction, and an indexing feed step of moving the focused spot and the wafer relatively to each other along a second direction perpendicular to the first direction.

Embodiments of the present disclosure generally relate to flexible substrate fabrication. In particular, embodiments described herein relate to methods for flexible substrate fabrication which can be used to improve the life of lithium-ion batteries. In one or more embodiments, a method of fabricating alloy anodes includes forming an alloy anode using a planar flow melt spinning process including solidifying a molten material over a quenching surface of a rotating casting drum and performing a pre-lithiation surface treatment on the alloy anode.

In order to cut a plurality of clumps having an approximately uniform shapes and approximately uniform dimensions out of a cell aggregate which has proliferated and appropriately eliminate contamination with fragments of different shapes or dimensions, when cutting the clumps of approximately uniform shape out of the cell aggregate which has proliferated, cutting lines along which the clumps of a specific shape are cut out are set such that the area of a peripheral part of the cell aggregate which is not cut by the cutting line exceeds the surface area of one of the clumps, and the cell aggregate is cut by irradiating with laser light in such a way as to trace the cutting lines.

A sealing method for sealing an opening of a metallic molded body with a resin molded body, the metallic molded body having a cavity therein and an opening connected to the cavity, includes a step of irradiating laser light onto a joining surface on a periphery of the opening of the metallic molded body in an energy density of 1 MW/cm.sup.2 or more and at an irradiation rate of 2000 mm/sec or more to roughen the surface, and a step of placing, in a mold, a portion including the joining surface of the metallic molded body roughened in the preceding step and sealing the opening with a resin molded body formed by injection molding or compression molding of a resin.

A method according to one aspect of the present disclosure is a laser marking method for a powder compact containing metal powder, which includes: a first step of scanning with laser light of first power which is weaker over a predetermined area in a surface of the powder compact, to melt and smooth inside of the predetermined area; and a second step of scanning with laser light of second power which is greater, to form a dot formed of a recess of a predetermined depth at a predetermined location in the predetermined area.

A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.

In a method of providing a flow for a process chamber of a device for producing a three-dimensional object by layer-wise application and selective solidification of a building material in a build area a process gas is supplied to the process chamber in a lower altitude region of the process chamber, wherein the process chamber includes a gas inlet for introducing the process gas into the process chamber and a gas outlet for discharging the process gas from the process chamber. The gas inlet and the gas outlet are provided in the lower altitude region of the process chamber and the process gas flows in a main flow from the gas inlet to the gas outlet, and wherein a secondary flow is located in a sub-region of the lower altitude region, which sub-region is located above a bottom surface of the process chamber surrounding the build area.

A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.

A method for making an infrared light absorber is provided, and the method includes following steps: providing a first carbon nanotube array on a substrate; truncating the carbon nanotube array by irradiating a top surface of the carbon nanotube array by a laser beam in two directions, the top surface being away from the substrate, wherein the two directions being at an angle, the angle is in a range of 30 degrees to 90 degrees.