Patent classifications
B23K28/00
METHOD OF MANUFACTURING MOLDED PRODUCT
A method of manufacturing a molded product is provided. The method of manufacturing a molded product includes forming a first joining portion by placing an inner metallic plate and an outer metallic plate on each other and welding them together; bending, after forming the first joining portion, the outer metallic plate with the inner metallic plate in a first direction by performing a first press working; and forming, after the first press working, a first surface, a second surface, and a curved portion on the outer metallic plate by performing a second press working. In the second press working, the outer metallic plate is bent with the inner metallic plate in a second direction to form an oppositely curved portion which is bent in a direction opposite from a bending direction of the curved portion on the outer metallic plate.
WELDING DEVICE AND METHOD FOR WELDING
The disclosure relates to a welding device for welding components which comprises a linear unit that is configured for moving a component placed thereon back and forth along one direction, an optical measuring unit comprising a detection region directed onto a portion of the linear unit in order to measure a component placed on the linear unit, and a welding unit which is configured for lifting a first component, optionally a sphere, from the linear unit and, after displacement of the linear unit, for welding it to a second component, optionally a wire, placed in the detection region.
WELDING DEVICE AND METHOD FOR WELDING
The disclosure relates to a welding device for welding components which comprises a linear unit that is configured for moving a component placed thereon back and forth along one direction, an optical measuring unit comprising a detection region directed onto a portion of the linear unit in order to measure a component placed on the linear unit, and a welding unit which is configured for lifting a first component, optionally a sphere, from the linear unit and, after displacement of the linear unit, for welding it to a second component, optionally a wire, placed in the detection region.
HEATING UNIT AND SOLAR CELL REPAIRING APPARATUS HAVING THE SAME
Provided a heating unit for a solar cell including a housing forming an exterior, a plurality of air heaters arranged in a first direction in the housing, and a heating block disposed on one side of the housing and configured to spray gas heated by the plurality of air heaters to the outside in a concentrated manner, wherein the heating block includes a plurality of inlet ports formed at positions corresponding to the plurality of air heaters, and a plurality of spray ports in communication with the plurality of inlet ports, spaced apart from each other predetermined intervals, and each having a diameter smaller than a diameter of each of the inlet ports.
HEATING UNIT AND SOLAR CELL REPAIRING APPARATUS HAVING THE SAME
Provided a heating unit for a solar cell including a housing forming an exterior, a plurality of air heaters arranged in a first direction in the housing, and a heating block disposed on one side of the housing and configured to spray gas heated by the plurality of air heaters to the outside in a concentrated manner, wherein the heating block includes a plurality of inlet ports formed at positions corresponding to the plurality of air heaters, and a plurality of spray ports in communication with the plurality of inlet ports, spaced apart from each other predetermined intervals, and each having a diameter smaller than a diameter of each of the inlet ports.
Liquid cold welding methods and apparatus
The application discloses a method of liquid cold welding (LCW) including: (a) engaging two or more porous conductive substrate layers between perforated non-conductive frames so that the substrate layers contact one another; (b) immersing the substrate layers in an electrolyte solution; and (c) applying electric current and/or voltage and/or electric power to the electrolyte solution. Apparatus suitable for performance of some embodiments of the method are also disclosed.
WELDMENTS, CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING WELDMENTS, AND METHOD OF MAKING WELDMENTS FOR CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS
A weldment includes a channel body formed from a ceramic material and having a plate portion, and first and second sidewall portions. The plate portion of the channel body has first and second surfaces. The first sidewall portion extends from the plate portion and is substantially orthogonal relative to the first surface of the plate portion of the channel body. The second sidewall portion is spaced apart from the first sidewall portion of the channel body and is substantially parallel to the first sidewall portion. The channel body has a single, one-piece construction with no welds formed using a subtractive manufacturing technique to limit optical effects associated with dimensional variation otherwise introduced into the channel body by welding. Chamber arrangements and semiconductor processing systems including weldments, methods of making weldments, and related methods of depositing material layers and/or removing material form substrates supported within weldments are also described.
WELDMENTS, CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING WELDMENTS, AND METHOD OF MAKING WELDMENTS FOR CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS
A weldment includes a channel body formed from a ceramic material and having a plate portion, and first and second sidewall portions. The plate portion of the channel body has first and second surfaces. The first sidewall portion extends from the plate portion and is substantially orthogonal relative to the first surface of the plate portion of the channel body. The second sidewall portion is spaced apart from the first sidewall portion of the channel body and is substantially parallel to the first sidewall portion. The channel body has a single, one-piece construction with no welds formed using a subtractive manufacturing technique to limit optical effects associated with dimensional variation otherwise introduced into the channel body by welding. Chamber arrangements and semiconductor processing systems including weldments, methods of making weldments, and related methods of depositing material layers and/or removing material form substrates supported within weldments are also described.