Embodiments of systems and methods to relate welding wire to a welding power source are disclosed. One embodiment is a networked system having a server computer. The server computer is configured to receive first data including at least one of an identity or a location of a consumable source of welding wire, and at least one of a weight status, indicating a change in weight, or an energization status, indicating an energization state, of the consumable source of welding wire. The server computer is configured to receive second data including at least one of an identity or a location of a welding power source, and an activation status indicating an activation state of the welding power source. The server computer is configured to match the welding power source to the consumable source of welding wire based on at least the first data and the second data.

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.

A cutting method using a stamping press according to the present disclosure is a method to cut a workpiece that is configured from a first metal sheet and a second metal sheet joined at a weld portion and that has a heat-affected zone around the weld portion, in which the workpiece is cut using a punch. The punch includes a flat portion and a projecting portion projected more toward the workpiece than a flat portion of the punch. The workpiece is positioned with respect to the punch at a position such that the projecting portion starts cutting at least at one out of the heat-affected zone or the weld portion before the flat portion cuts the workpiece. The workpiece is then cut by moving the punch and a die relative to each other in this state of positioning so as to shear across the weld portion on the workpiece.

A cutting method using a stamping press according to the present disclosure is a method to cut a workpiece that is configured from a first metal sheet and a second metal sheet joined at a weld portion and that has a heat-affected zone around the weld portion, in which the workpiece is cut using a punch. The punch includes a flat portion and a projecting portion projected more toward the workpiece than a flat portion of the punch. The workpiece is positioned with respect to the punch at a position such that the projecting portion starts cutting at least at one out of the heat-affected zone or the weld portion before the flat portion cuts the workpiece. The workpiece is then cut by moving the punch and a die relative to each other in this state of positioning so as to shear across the weld portion on the workpiece.

The present application relates to a field system and methods that can be deployed in the application of pipe welding. The field system provides many embodiments relating to pipe welding systems and methods, that can be used in combination with one another, or individually. Such welding systems and methods, include, for example, internal welding systems and methods, tie-in welding system and methods, pipe inspection systems and methods, pipe handling systems and methods, internal pipe cooling systems and methods, non-destructive testing systems and methods, as well as remote interface and database systems and methods (uLog), to name a few. The application further relates to welded pipes that result from some or all of such processes.

A pressure resistant device includes a tubular main body portion, a lid portion having a wall portion joined to the main body portion, a positioning portion provided to oppose an inner peripheral surfaces of the main body portion and the wall portion, and a groove portion formed on the inner peripheral surface, and the positioning portion is provided to oppose an edge of the groove portion.

A variety of homogeneous or layered hybrid nanostructures are fabricated by electric field-directed assembly of nanoelements. The nanoelements and the fabricated nanostructures can be conducting, semi-conducting, or insulating, or any combination thereof. Factors for enhancing the assembly process are identified, including optimization of the electric field and combined dielectrophoretic and electrophoretic forces to drive assembly. The fabrication methods are rapid and scalable. The resulting nanostructures have electrical and optical properties that render them highly useful in nanoscale electronics, optics, and biosensors.

A variety of homogeneous or layered hybrid nanostructures are fabricated by electric field-directed assembly of nanoelements. The nanoelements and the fabricated nanostructures can be conducting, semi-conducting, or insulating, or any combination thereof. Factors for enhancing the assembly process are identified, including optimization of the electric field and combined dielectrophoretic and electrophoretic forces to drive assembly. The fabrication methods are rapid and scalable. The resulting nanostructures have electrical and optical properties that render them highly useful in nanoscale electronics, optics, and biosensors.

A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.