Patent classifications
B23K35/00
Method for passive metal activation and uses thereof
Disclosed is a method for activating a surface of metals, such as self-passivated metals, and of metal-oxide dissolution, effected using a fluoroanion-containing composition. Also disclosed is an electrochemical cell utilizing an aluminum-containing anode material and a fluoroanion-containing electrolyte, characterized by high efficiency, low corrosion, and optionally mechanical or electrochemical rechargeability. Also disclosed is a process for fusing (welding, soldering etc.) a self-passivated metal at relatively low temperature and ambient atmosphere, and a method for electrodepositing a metal on a self-passivated metal using metal-oxide source.
METHOD FOR MANUFACTURING REFRIGERANT DISTRIBUTOR, REFRIGERANT DISTRIBUTOR MANUFACTURING APPARATUS, REFRIGERANT DISTRIBUTOR, HEAT EXCHANGER, AND AIR-CONDITIONING DEVICE
A sacrifice positive electrode layer is formed conveniently, efficiently, and accurately on the surface of a refrigerant distributor having a complicated shape. Further, during the formation of the sacrifice positive electrode layer, the strength in the surroundings of joined parts is prevented from being lowered by excessive heating. Included are: an applying step of applying flux to remove an aluminum oxide to a surface of a plurality of outflow sections and a distributing section; an alloy disposing step of disposing a zinc-containing aluminum-silicon alloy on the surface to which the flux is applied; a forming step of forming the sacrifice positive electrode layer on the surface by heating the disposed zinc-containing aluminum-silicon alloy; a brazing material disposing step of inserting a plurality of outflow pipes into the plurality of outflow sections, respectively, and disposing an aluminum-silicon alloy brazing material on the surface of the outflow sections; and a brazing step of brazing the plurality of outflow sections with the plurality of outflow pipes, respectively, by heating the aluminum-silicon alloy brazing material.
Systems and methods for low-manganese welding alloys
The present disclosure relates generally to welding alloys and, more specifically, to welding consumables (e.g., welding wires and rods) for arc welding operations. In an embodiment, a welding consumable includes less than approximately 1 wt % manganese as well as one or more strengthening agents selected from the group: nickel, cobalt, copper, carbon, molybdenum, chromium, vanadium, silicon, and boron. The welding consumable also includes one or more grain control agents selected from the group: niobium, tantalum, titanium, zirconium, and boron, wherein the welding consumable includes less than approximately 0.6 wt % grain control agents. Additionally, the welding consumable has a carbon equivalence (CE) value that is less than approximately 0.23. The welding consumable is designed to provide a manganese fume generation rate that is less than approximately 0.01 grams per minute during a welding operation.
Systems and methods for low-manganese welding alloys
The present disclosure relates generally to welding alloys and, more specifically, to welding consumables (e.g., welding wires and rods) for arc welding operations. In an embodiment, a welding consumable includes less than approximately 1 wt % manganese as well as one or more strengthening agents selected from the group: nickel, cobalt, copper, carbon, molybdenum, chromium, vanadium, silicon, and boron. The welding consumable also includes one or more grain control agents selected from the group: niobium, tantalum, titanium, zirconium, and boron, wherein the welding consumable includes less than approximately 0.6 wt % grain control agents. Additionally, the welding consumable has a carbon equivalence (CE) value that is less than approximately 0.23. The welding consumable is designed to provide a manganese fume generation rate that is less than approximately 0.01 grams per minute during a welding operation.
CARBIDE-BASED HARDFACING
One aspect of the disclosure provides an iron-based hardfacing layer which includes hard or wear resistant phases resulting at least in part from dissolution of silicon and/or boron carbide particles into a liquid iron-based metal during the fabrication process. In an embodiment, the hardfacing layer is formed by a fusion welding process in which carbide particles are added to the molten weld pool. In an example, the filler metal supplied to the welding process is a mild steel. In an embodiment, the hardness as measured at the surface of the hardfacing ranges from 40 to 65 HRC. In an example, the iron-based hardfacing layer also includes tungsten carbide particles.
Package on package structure and method for forming the same
Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.
WINDOW GLASS STRUCTURE FOR VEHICLE
A window glass structure according to one aspect of the present invention includes a window glass for a vehicle that has a surface provided with a conductive layer having a predetermined pattern, and a connection terminal that is soldered to the conductive layer. The connection terminal includes a first joining portion that is joined to the conductive layer by soldering using a lead-free solder, a first side plate that is linked to the first joining portion and extends in a direction of separation from the surface of the window glass, a second joining portion that is joined to the conductive layer by soldering using a lead-free solder, a second side plate that is linked to the second joining portion and extends in a direction of separation from the surface of the window glass, a bridge portion that extends so as to link the two side plates, and a terminal portion configured to be linked to the bridge portion so as to have a face that is oriented in a direction different from directions in which faces of the two side plates and the bridge portion are oriented, at a position separated from regions to which the first side plate and the second side plate are linked.
High temperature electrochemical cell structures, and methods for making
An electrochemical cell is described, including an anodic chamber and a cathodic chamber separated by an electrolyte separator tube, all contained within a cell case. The cell also includes an electrically insulating ceramic collar positioned at an opening of the cathodic chamber, and defining an aperture in communication with the opening; along with a cathode current collector assembly; and at least one metallic ring that has a coefficient of thermal expansion (CTE) in the range of about 3 to about 7.5 ppm/° C., contacting at least a portion of a metallic component within the cell, and an adjacent ceramic component. An active braze alloy composition attaches and hermetically seals the ring to the metallic component and the collar. Sodium metal halide batteries that contain this type of cell are also described, along with methods for sealing structures within the cell.
Composite nanometal paste containing copper filler and joining method
The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.
CONTROL OF INTERMETALLIC COMPOUND GROWTH IN ALUMINUM TO STEEL RESISTANCE WELDING
A method of resistance spot welding a workpiece stack-up that includes an aluminum workpiece and an overlapping adjacent steel workpiece so as to minimize the thickness of an intermetallic layer comprising Fe—Al intermetallic compounds involves providing reaction-slowing elements at the faying interface of the aluminum and steel workpieces. The reaction-slowing elements may include at least one of carbon, copper, silicon, nickel, manganese, cobalt, or chromium. Various ways are available for making the one or more reaction-slowing elements available at the faying interface of the aluminum and steel workpieces including being dissolved in a high strength steel or being present in an interlayer that may take on a variety of forms including a rigid shim, a flexible foil, a deposited layer adhered to and metallurgically bonded with a faying surface of the steel workpiece, or an interadjacent organic material layer that includes particles containing the reaction-slowing elements.