In some implementations, an apparatus comprises a pipe, a stud that is forge-welded to the pipe, creating a forge-welded stud, a bracket that is operably coupled to the forge-welded stud, and a ladder support operably coupled to the bracket.

A yaw braking assembly of a wind turbine is presented. Accordingly, the yaw braking assembly includes a bedplate support frame having an annular flange defining a plurality of recesses formed into a lower-most annular surface of the annular flange and extending at least partially through an axial thickness of the annular flange. Each of the plurality recesses define an open exterior circumferential side. The yaw braking assembly also includes a plurality of brake pads which are positioned within the plurality of recesses and configured to engage at least one race of an adjacent yaw bearing. The yaw braking assembly further includes a plurality of actuators for driving the plurality of brake pads to engage the yaw bearing.

A method comprises inspecting a ceramic matrix composite component assembled in a gas turbine engine to determine an extent of damage to the ceramic matrix composite component, determining a repair technique to repair the damage to the ceramic matrix composite component based on the extent of damage to the ceramic matrix composite component, and repairing the ceramic matrix composite component using the repair technique.

An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.

A system and method including receiving a data model representation of a part, the data model representation including at least one layer of the part and inner and outer contours for the at least one layer; determining a hatch pattern for each layer of the at least one layer of the part, the hatch pattern for each layer being dependent on the inner and outer contours for each respective layer; generating a record of the determined hatch pattern for each layer, the record including locations for the hatch pattern for each layer; and saving the record of the determined hatch pattern for each layer of the part. In some aspects, the record of the determined hatch pattern for each layer of the part may be used in an additive manufacturing process.

A ballistic panel formed with a ballistic material, the panel comprising: a panel with a filled void; wherein the filled void is filled with a ballistic replacement material; and wherein the filled void exhibits ballistic properties equivalent to the ballistic panel formed with the ballistic material; wherein the ballistic replacement material and the ballistic material comprise between about 1121 kg/cubic meter (about 70 pounds per cubic foot) and about 1442 kg/cubic meter (about 90 pounds per cubic foot); and wherein the ballistic replacement material and the ballistic material comprise: about 1 part by mass Portland cement; about 0.5 to 1.5 part by mass fine aggregate; and about 0.0005 to 0.05 part by mass air entrainment additive; about 0.005 to 0.15 part by mass fiber; about 0.005 to 0.05 part by mass aluminum hydroxide and about 0.005 to 0.05 part by mass calcium phosphate.

A ballistic panel formed with a ballistic material, the panel comprising: a panel with a filled void; wherein the filled void is filled with a ballistic replacement material; and wherein the filled void exhibits ballistic properties equivalent to the ballistic panel formed with the ballistic material; wherein the ballistic replacement material and the ballistic material comprise between about 1121 kg/cubic meter (about 70 pounds per cubic foot) and about 1442 kg/cubic meter (about 90 pounds per cubic foot); and wherein the ballistic replacement material and the ballistic material comprise: about 1 part by mass Portland cement; about 0.5 to 1.5 part by mass fine aggregate; and about 0.0005 to 0.05 part by mass air entrainment additive; about 0.005 to 0.15 part by mass fiber; about 0.005 to 0.05 part by mass aluminum hydroxide and about 0.005 to 0.05 part by mass calcium phosphate.

Vehicle dimension data describing dimensions of a vehicle are obtained, a robotic apparatus is moved to a position about the vehicle, a reference point of the vehicle is determined, and the robotic apparatus is caused to move to positions about the vehicle based on the reference point. The reference point may be a center point of a selected wheel of the vehicle. A coordinate system of the robotic apparatus is aligned to the reference point of the selected wheel of the vehicle. Based on the aligned coordinate system of the robotic apparatus, operations are performed by the robotic apparatus to remove lug nuts from a wheel hub of the vehicle.

Vehicle dimension data describing dimensions of a vehicle are obtained, a robotic apparatus is moved to a position about the vehicle, a reference point of the vehicle is determined, and the robotic apparatus is caused to move to positions about the vehicle based on the reference point. The reference point may be a center point of a selected wheel of the vehicle. A coordinate system of the robotic apparatus is aligned to the reference point of the selected wheel of the vehicle. Based on the aligned coordinate system of the robotic apparatus, operations are performed by the robotic apparatus to remove lug nuts from a wheel hub of the vehicle.

A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance travelled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.