A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance travelled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.

A spike puller for pulling a railroad spike of a track includes a housing, a linear displacement unit mounted at the housing, and a claw unit for gripping the railroad spike. The claw unit is displaceable in a linear manner relative to the housing in a displacement direction by using the linear displacement unit. The linear displacement unit includes a hollow tube which is guided in the housing. A method for pulling a railroad spike of a track is also provided.

A method of repairing a composite blade. The composite blade includes a metal work bonded to a composite part through an adhesive layer. The method includes determining a locally damaged portion of the metal work, and removing a bullet portion corresponding to the locally damaged portion. The method further includes detaching, debonding, and removing a first wing portion from the composite part to obtain a first exposed surface portion. The method further includes detaching, debonding, and removing a second wing portion from the composite part to obtain a second exposed surface portion. The method further includes reconditioning the first and second exposed surface portions to obtain first and second reconditioned surface portions, respectively, and applying first and second adhesive layers to the first and second reconditioned surface portions respectively. The method further includes bonding a metal work patch to the first and second adhesive layers.

A method of furnace-less brazing of a substrate is provided. The method includes providing a substrate having a brazing region thereon; disposing braze precursor material containing a nickel powder, an aluminum powder, and a platinum group metal powder on the brazing region; and initiating an exothermic reaction of the braze precursor material such that the exothermic reaction produces a braze material that reaches a braze temperature above the liquidus temperature for the braze material. A braze precursor material is also provided.

A build plate-clamping assembly may include a work station having a build plate-receiving surface and a lock-pin extending from the build plate-receiving surface of the work station. The lock-pin may include a hollow pin body, a piston disposed within the hollow pin body, with the piston axially movable from a retracted position to an actuated position, and a plurality of detents, with the plurality of detents radially extensible through respective ones of a plurality of detent-apertures in the hollow pin body responsive to the piston having been axially moved to the actuated position. A methods of working on workpieces may include lockingly engaging a build plate at a first work station, performing a first work-step, releasing the build plate from the first work station, lockingly engaging the build plate at a second work station, and performing a second work-step. An additive manufacturing system may include a vision system with a first build plate-receiving surface and an additive manufacturing machine with a second build plate-receiving surface.

A surgical instrument. The surgical instrument includes an end effector that comprises a staple channel and an anvil that is movably translatable relative to the staple channel. A tool mounting portion is configured to interface with a robotic system and operably communicate with the end effector. The instrument further includes a first sensor that has an output that represents a first condition of a portion of the robotic system. A second sensor has an output that represents a position of the anvil. A third sensor has an output that represents a position of a reciprocating knife within the end effector. An externally accessible memory device communicates with the first, second and third sensors.

A surgical instrument. The surgical instrument includes an end effector that comprises a staple channel and an anvil that is movably translatable relative to the staple channel. A tool mounting portion is configured to interface with a robotic system and operably communicate with the end effector. The instrument further includes a first sensor that has an output that represents a first condition of a portion of the robotic system. A second sensor has an output that represents a position of the anvil. A third sensor has an output that represents a position of a reciprocating knife within the end effector. An externally accessible memory device communicates with the first, second and third sensors.

Because reprocessing or refurbishing of physiological sensors reuses large portions of an existing sensor, the material costs for refurbishing sensors is significantly lower than the material costs for making an entirely new sensor. Typically, existing reprocessors replace only the adhesive portion of an adhesive physiological sensor and reuse the sensing components. However, re-using the sensing components can reduce the reliability of the refurbished sensor and/or reduce the number of sensors eligible for refurbishing due to out-of-specification sensor components. It is therefore desirable to provide a process for refurbishing physiological sensors that replaces the sensing components of the sensor. While sensing components are replaced, generally, sensor cable and/or patient monitor attachments are retained, resulting in cost savings over producing new sensors.

Because reprocessing or refurbishing of physiological sensors reuses large portions of an existing sensor, the material costs for refurbishing sensors is significantly lower than the material costs for making an entirely new sensor. Typically, existing reprocessors replace only the adhesive portion of an adhesive physiological sensor and reuse the sensing components. However, re-using the sensing components can reduce the reliability of the refurbished sensor and/or reduce the number of sensors eligible for refurbishing due to out-of-specification sensor components. It is therefore desirable to provide a process for refurbishing physiological sensors that replaces the sensing components of the sensor. While sensing components are replaced, generally, sensor cable and/or patient monitor attachments are retained, resulting in cost savings over producing new sensors.

A method includes estimating a replacement time of a consumable part of a processing device, specifying a timing after substrate processing of the processing device is completed in a period before the replacement time as a replaceable timing of the consumable part, estimating a movement time period required for the part transporting device to move to a position of the processing device requiring the replacement, and estimating a preparation time period required for preparation until the part transporting device moved to the position of the processing device requiring the replacement becomes a state in which the consumable part is replaceable. The method further includes transmitting a replacement instruction to the part transporting device at a timing before a timing that is earlier than the replaceable timing by a total time of the movement time period and the preparation time period, and instructing the replacement of the consumable part.