B23P13/00

Method of manufacturing a perforated sheet, perforated sheet, shaped part and processing device
11839911 · 2023-12-12 · ·

A method of manufacturing a perforated sheet which has at least one hole. The method includes introducing at least two spaced boreholes into a sheet, the at least two spaced boreholes being formed so that they each pass through a thickness of the sheet, introducing a continuous cut between the at least two spaced boreholes in the sheet, and bending open a section of the sheet which is adjacent to the continuous cut so as to form a hole.

Method of manufacturing a perforated sheet, perforated sheet, shaped part and processing device
11839911 · 2023-12-12 · ·

A method of manufacturing a perforated sheet which has at least one hole. The method includes introducing at least two spaced boreholes into a sheet, the at least two spaced boreholes being formed so that they each pass through a thickness of the sheet, introducing a continuous cut between the at least two spaced boreholes in the sheet, and bending open a section of the sheet which is adjacent to the continuous cut so as to form a hole.

BUILD MATERIAL FORMATION

A device for forming spherical particles may include a receiving chamber having a heating portion and a cooling portion. Wire segments may travel in a free fall through the receiving chamber. While falling through the heating portion, wire segments may be heated to form spherical particles in response to exposure to microwave electromagnetic radiation. While falling through the cooling portion, formed spherical particles cool.

ASSEMBLING DEVICE
20210094133 · 2021-04-01 · ·

An assembling device includes a holding member and a processing device. The holding member is configured to hold a first assembly component and a second assembly component. The processing device is configured to process a first excess thickness portion and a second excess thickness portion. The first excess thickness portion is provided at the first assembly component and is configured to adjust a gap between the first assembly component and the second assembly component. The second excess thickness portion is provided at the second assembly component and is configured to adjust the gap.

Three-dimensional structures and related methods of forming three-dimensional structures

The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc.

Three-dimensional structures and related methods of forming three-dimensional structures

The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc.

Additive forging method for preparing homogenized forged pieces

A constructing-and-forging method for preparing homogenized forged pieces comprises: preparing preformed billets: cutting off a plurality of continuous casting billets, milling and smoothing surfaces of the billets to be welded, performing vacuum plasma cleaning operation to the surfaces to be welded, stacking the plurality of billets and sealing around the surfaces in a vacuum chamber by electron beam welding; forge-welding and homogenizing the preformed billets: heating the preformed billets to a certain temperature in a heating furnace and taking the heated preformed billets out of the heating furnace, forging the preformed billets by a hydraulic press, then using three-dimensional forging to disperse the welded surfaces such that composition, structure and inclusion of the interface areas are at the same level as those of the bodies of the billets. Cheap continuous casting billets are stacked and forge welded.

Additive forging method for preparing homogenized forged pieces

A constructing-and-forging method for preparing homogenized forged pieces comprises: preparing preformed billets: cutting off a plurality of continuous casting billets, milling and smoothing surfaces of the billets to be welded, performing vacuum plasma cleaning operation to the surfaces to be welded, stacking the plurality of billets and sealing around the surfaces in a vacuum chamber by electron beam welding; forge-welding and homogenizing the preformed billets: heating the preformed billets to a certain temperature in a heating furnace and taking the heated preformed billets out of the heating furnace, forging the preformed billets by a hydraulic press, then using three-dimensional forging to disperse the welded surfaces such that composition, structure and inclusion of the interface areas are at the same level as those of the bodies of the billets. Cheap continuous casting billets are stacked and forge welded.

Cable management for enclosures

Provided is a cable retention device configured to facet attachments and projections onto an enclosure. The device includes an inner and outer planar layer which include an inner and outer cutout respectively. The inner and outer planar layers are attached and aligned so the inner and outer cutouts overlap. The inner planar layer includes a pair of vertical slotted cutouts connected by a center cutout to form a plurality of pinch points. Each vertical slotted cutout includes an inner edge and an outer edge.

Cable management for enclosures

Provided is a cable retention device configured to facet attachments and projections onto an enclosure. The device includes an inner and outer planar layer which include an inner and outer cutout respectively. The inner and outer planar layers are attached and aligned so the inner and outer cutouts overlap. The inner planar layer includes a pair of vertical slotted cutouts connected by a center cutout to form a plurality of pinch points. Each vertical slotted cutout includes an inner edge and an outer edge.