The present disclosure provides a semiconductor device, including a substrate, a first active region in the substrate, a second active region in the substrate and adjacent to the first active region, an isolation region in the substrate and between the first active region and the second active region, and a dummy gate overlapping with the isolation region, wherein an entire bottom width of the dummy gate is greater than an entire top width of the isolation region.

An FPA includes a substrate; a plurality of spaced-apart implant regions deposited in the substrate; a plurality of supplemental metal contacts, one supplemental metal contact of the plurality of supplemental metal contacts electrically connected to one implant region of the plurality of implant regions; a plurality of metal conductors electrically connecting the plurality of supplemental metal contacts; and a primary metal contact, electrically connected to the plurality of supplemental metal contacts by at least one of the metal conductors of the plurality of metal conductors. The pixel can include an Indium bump electrically connected to the primary metal contact.

A photovoltaic cell includes an edge; an interconnection conductive track extending parallel to the edge to within 1.3 mm; and a plurality of electrodes, called collection fingers, extending parallel to each other and electrically connected to the interconnection track; the interconnection conductive track including a plurality of spaced-apart closed-contour conductive patterns, each closed-contour conductive pattern including a closed contour surrounding a portion of the first face.

A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and conductively bonded to each other in their overlapping regions to form super cells, which may be arranged to efficiently use the area of the solar module.

Disclosed are a solar cell and a photovoltaic module. The solar cell includes a substrate, having a first surface, having a metal pattern region and a non-metal pattern region, a first passivation contact structure, located in the metal pattern region and including a first tunneling layer and a first doped conductive layer stacked in a direction away from the substrate, and a second passivation contact structure, including a second tunneling layer and a second doped conductive layer stacked in the direction away from the substrate, and having a first portion over the non-metal pattern region and a second portion over the first passivation contact structure, and a top surface of the first portion of the second passivation contact structure is not further away from the substrate than a top surface of the second portion of the second passivation contact structure.

This relates to a method of forming a device structure, including: providing at least one device component having front and rear device component surfaces and at least one electrically conductive region on the device component surfaces; providing at least one contact sheet including a polymeric material and at least one electrically conductive element with a non-circular cross-sectional shape and embedded in the polymeric material such that a surface portion of the electrically conductive element is exposed; applying a bonding material to one or both of the exposed surface portion and the electrically conductive regions on the device component surfaces; positioning the contact sheet relative to the device component such that the bonding material is located between the electrically conductive region and the exposed surface portion; activating the bonding material such that a bond and an electrically conductive coupling are formed between the electrically conductive region and the exposed surface portion.

A solar module comprising: one or more solar cells having a front face and a back face, said solar cells being electrically connected to a terminal via one or more electrically conductive interconnect members, and surrounded by an encapsulant; an insulating backsheet arranged to overlay the one or more solar cells and encapsulant on a back face side of the module; and a laminate interlayer interposed between the encapsulant and the backsheet, the laminate interlayer comprising an electrically insulating layer and a metallic barrier film arranged in that order from a front face side of the module to the back face side of the module; wherein the laminate interlayer has a lateral extent less than the lateral extent of the backsheet.

A multispectral sensor array can include a combination of ranging sensor channels (e.g., LIDAR sensor channels) and ambient-light sensor channels tuned to detect ambient light having a channel-specific property (e.g., color). The sensor channels can be arranged and spaced to provide multispectral images of a field of view in which the multispectral images from different sensors are inherently aligned with each other to define an array of multispectral image pixels. Various optical elements can be provided to facilitate imaging operations. Light ranging/imaging systems incorporating multispectral sensor arrays can operate in rotating and/or static modes.

A system and method for automated shutdown, disconnect, or power reduction of solar panels. A system of solar panels includes one or more master management units (MMUs) and one or more local management units (LMUs). The MMUs are in communication with the LMUs with the MMUs and LMUs handshaking when the system is in operation. The MMUs are connected to one or more controllers which in turn are connected to emergency detection sensors. Upon a sensor detection of an emergency, the associated MMU is notified which in turn instructs associated LMUs to take appropriate action. In the event that communication with the MMUs has been cut off, the LMUs take the initiative to shut down, disconnect, or reduce the output of associated string(s) of solar panels.

A photoelectric conversion apparatus includes a photodiode, a generation circuit, a first control circuit, and a second control circuit. The photodiode is configured to perform avalanche multiplication. The generation circuit is configured to generate a control signal. The first control circuit is configured to be controlled by the control signal to be in a standby state where the avalanche multiplication by the photodiode is possible and in a recharging state for returning the photodiode having performed the avalanche multiplication to the standby state. The second control circuit is configured to count a number of periods in which the avalanche multiplication has occurred among a plurality of periods of the standby state by using the control signal and a signal corresponding to an output of the photodiode.