A processing machine and a method of using the processing machine to process a block to form a dental prosthesis is provided. The processing machine includes a polishing jig. The polishing jig is for machining tools which makes it possible for a deteriorating machining tool to be used again without detaching the machining tool, with which the processing machine is equipped, from the processing machine. The polishing jig for machining tools comprises an attachment part to be attached to the processing machine; and a polishing face that is at least part of a surface of the polishing jig, the polishing face adapted to polish a processing part of a machining tool.

A processing machine and a method of using the processing machine to process a block to form a dental prosthesis is provided. The processing machine includes a polishing jig. The polishing jig is for machining tools which makes it possible for a deteriorating machining tool to be used again without detaching the machining tool, with which the processing machine is equipped, from the processing machine. The polishing jig for machining tools comprises an attachment part to be attached to the processing machine; and a polishing face that is at least part of a surface of the polishing jig, the polishing face adapted to polish a processing part of a machining tool.

A machine for working a workpiece made of wood, plastic, glass, fiberglass, metal, ceramic, and the like including an entry station for the entrance of the workpiece to be worked and an exit station for the exit of the worked workpiece; a conveyor group for moving the workpiece to be worked, according to a forward direction, from the entry station towards the exit station; at least one working unit of the workpiece, arranged overhead with respect to the conveyor group including at least one working tool of the workpiece; the machine including a laser system configured for carrying out further working operations on the workpiece. Also disclosed is a laser system that can be installed on a machine for machining a workpiece and an operation method of a machine for machining a workpiece.

A machine for working a workpiece made of wood, plastic, glass, fiberglass, metal, ceramic, and the like including an entry station for the entrance of the workpiece to be worked and an exit station for the exit of the worked workpiece; a conveyor group for moving the workpiece to be worked, according to a forward direction, from the entry station towards the exit station; at least one working unit of the workpiece, arranged overhead with respect to the conveyor group including at least one working tool of the workpiece; the machine including a laser system configured for carrying out further working operations on the workpiece. Also disclosed is a laser system that can be installed on a machine for machining a workpiece and an operation method of a machine for machining a workpiece.

A filamentation process uses ultrafast laser pulses to form a line of filaments or perforations in a glass material in sheet form. The glass material is then cleaved using mechanical or thermal stress to form a glass substrate with a planar doughnut shape having an inner circular edge and an outer circular edge. The inner and outer edges may exhibit filamentary damage from the filamentation process, including microcracks and pillar shaped funnels along an entire length of the edge. The inner and/or outer edges may then be treated by polishing only, by etching only, or by etching and polishing to remove a portion of the filamentary damage to improve the strength of the edges. The resulting glass substrate may be used in a magnetic medium for a magnetic recording device, wherein it provides an edge strength sufficient to withstand high force shocks to the device.

Smoothness of glass is improved. A polishing slurry (A) contains amorphous carbon and water, and a total amount of the amorphous carbon and the water is equal to or more than 90% of the whole polishing slurry in terms of mass ratio.

Methods for polishing dielectric layers using an auto-stop slurry in forming semiconductor devices, such as three-dimensional (3D) memory devices, are provided. For example, a stack structure is formed in a staircase region and a core array region. The stack structure includes a plurality of interleaved first material layers and second material layers. Edges of the interleaved first material layers and second material layers define a staircase structure on a side of the stack structure in the staircase region. A dielectric layer is formed over the staircase region and a peripheral region outside the stack structure. The dielectric layer includes a protrusion from the stack structure. The dielectric layer is polished using an auto-stop slurry to remove the protrusion of the dielectric layer.

A CMP slurry composition and a method of polishing a metal layer are provided. In some embodiments, the CMP slurry composition includes about 0.1 to 10 parts by weight of a metal oxide, and about 0.1 to 10 parts by weight of a chelator. The chelator includes a thiol compound or a thiolether compound.

A CMP slurry composition and a method of polishing a metal layer are provided. In some embodiments, the CMP slurry composition includes about 0.1 to 10 parts by weight of a metal oxide, and about 0.1 to 10 parts by weight of a chelator. The chelator includes a thiol compound or a thiolether compound.

A method for manufacturing a toner includes a pigment crushing step of kneading a pigment, a binder, and a grinding agent to obtain a pigment dispersion in which the grinding agent and the crushed pigment are dispersed in the binder; and a step of obtaining toner particles by a predetermined method using the pigment dispersion. The binder and the grinding agent are contained in the resulting toner particles.