A method for producing a glass article is provided. The method for producing a glass article, the method including preparing a glass to be processed, the glass comprising a glass bulk and a low-refractive surface layer disposed on the glass bulk, and etching away the low-refractive surface layer to form an etched glass, wherein the etching away the low-refractive surface layer comprises: cleaning the low-refractive surface layer with an acid solution; and cleaning the low-refractive surface layer with a base solution after the cleaning it with the acid solution.

A method for producing a glass article is provided. The method for producing a glass article, the method including preparing a glass to be processed, the glass comprising a glass bulk and a low-refractive surface layer disposed on the glass bulk, and etching away the low-refractive surface layer to form an etched glass, wherein the etching away the low-refractive surface layer comprises: cleaning the low-refractive surface layer with an acid solution; and cleaning the low-refractive surface layer with a base solution after the cleaning it with the acid solution.

A polishing liquid containing: abrasive grains; a hydroxy acid; a polymer compound having at least one selected from the group consisting of a hydroxyl group and an amide group; and a liquid medium, in which a zeta potential of the abrasive grains is positive, and a weight average molecular weight of the polymer compound is 3000 or more.

A polishing liquid containing: abrasive grains; a hydroxy acid; a polymer compound having at least one selected from the group consisting of a hydroxyl group and an amide group; and a liquid medium, in which a zeta potential of the abrasive grains is positive, and a weight average molecular weight of the polymer compound is 3000 or more.

A cylinder liner of the present invention is a cylinder liner mounted on a cylinder block and formed of flaky graphite cast iron, at least a nitrided layer is provided on an inner periphery of the cylinder liner, and a cross hatching section is formed on the inner periphery, a roughness curve of the inner periphery has a plateau honing shape, a ten-point average roughness Rz of the inner periphery pursuant to JIS B0601:1982 is 4.0 μm or less, and an average value of an area ratio of pits generated in the inner periphery is 8% or less.

The present invention provides aqueous chemical mechanical planarization polishing (CMP polishing) compositions comprising one or more dispersions of a plurality of elongated, bent or nodular anionic functional colloidal silica particles or their mixture with one or more dispersions of anionic functional spherical colloidal silica particles, one or more amine carboxylic acids having an isoelectric point (pI) below 5, preferably, an acidic amino acid or pyridine acid, and, preferably, one or more ethoxylated anionic surfactants having a C.sub.6 to C.sub.16 alkyl, aryl or alkylaryl hydrophobic group, wherein the compositions have a pH of from 3 to 5. The compositions enable good silicon nitride removal and selectivity of nitride to oxide removal in polishing.

The present invention provides aqueous chemical mechanical planarization polishing (CMP polishing) compositions comprising one or more dispersions of a plurality of elongated, bent or nodular anionic functional colloidal silica particles or their mixture with one or more dispersions of anionic functional spherical colloidal silica particles, one or more amine carboxylic acids having an isoelectric point (pI) below 5, preferably, an acidic amino acid or pyridine acid, and, preferably, one or more ethoxylated anionic surfactants having a C.sub.6 to C.sub.16 alkyl, aryl or alkylaryl hydrophobic group, wherein the compositions have a pH of from 3 to 5. The compositions enable good silicon nitride removal and selectivity of nitride to oxide removal in polishing.

Grinding a surface of a workpieces is accomplished with a grinding machine having at least two grinding units. First, a target structure of the surface to be achieved is provided. Then, using predetermined grinding parameters, a first of the two grinding units is used to grind the surface of the structure. Then, the surface of the actual structure is captured and compared to the target structure. Based on the comparison, the grinding parameters are adjusted and the surface is then ground, using the adjusted parameters, with the second of the two grinding units.

Grinding a surface of a workpieces is accomplished with a grinding machine having at least two grinding units. First, a target structure of the surface to be achieved is provided. Then, using predetermined grinding parameters, a first of the two grinding units is used to grind the surface of the structure. Then, the surface of the actual structure is captured and compared to the target structure. Based on the comparison, the grinding parameters are adjusted and the surface is then ground, using the adjusted parameters, with the second of the two grinding units.

A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.